The present disclosure relates to a dielectric substrate that may include a first fluoropolymer based adhesive layer, a polyimide layer overlying the fluoropolymer based adhesive layer, and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.

The present disclosure relates to a dielectric substrate that may include a polymer based core film, and a fluoropolymer based adhesive layer. The polymer based core film may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D.sub.10 of at least about 1.0 microns and not greater than about 1.7, a D.sub.50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D.sub.90 of at least about 2.7 microns and not greater than about 6 microns.

The current disclosure describes carrier tape systems, which include a carrier tape including a plurality of pockets. Each pocket contains a semiconductor device adhered to a bottom surface of the pocket by an adhesive. In some embodiments, the adhesive is a reversible adhesive. Use of the adhesive reduces the likelihood the semiconductor device will be damaged due to movement of the semiconductor device in the pocket during shipment of the carrier tape. Methods of forming a semiconductor device carrier systems and methods of supplying semiconductor devices are also described.

A resin composition, a metal laminate, and a printed circuit board which use the resin composition are disclosed. A method for manufacturing the metal laminate is also disclosed. The resin composition contains at least one elastomer selected from the group consisting of a fluoroelastomer or a styrene-based elastomer; a fluororesin filler; and an inorganic filler.

A separator for a non-aqueous secondary battery, the separator including: a porous substrate; and an adhesive porous layer provided on one or both sides of the porous substrate and including a polyvinylidene fluoride-based resin, the adhesive porous layer would exhibit a ratio of an area intensity of a β-phase-crystal-derived peak of the polyvinylidene fluoride-based resin to a sum of an area intensity of an α-phase-crystal-derived peak of the polyvinylidene fluoride-based resin and the area intensity of the β-phase-crystal-derived peak of the polyvinylidene fluoride-based resin of from 10% to 100% when an x-ray diffraction spectrum is obtained by performing measurement by an x-ray diffraction method.

A hot-melt composition is provided. The hot-melt composition includes thermoplastic polyurethane (TPU) and polyvinylchloride (PVC), the weight ratio of TPU over PVC is in the range of 50/50 to 95/5, and the TPU and PVC together forms at least 50% w of the composition.

The present invention involves a 100% solids, radiation curable adhesive formulation for adhesion to EVA. This formulation may have varying compositions, as discussed in detail herein. However primarily the composition may comprise at least a monomer, and a chlorinated additive. Photo initiators may be used to allow for low temperature UV or other radiation curing. Other additives may be used to enhance functional features in various ways. In use, the present invention may be coated on a surface of EVA and then cured, and may be adhered to a substrate using only a layer of adhesive on the substrate, in contrast to the structures of the prior art, which require at least two sided adhesive application, among other complexities.

The current disclosure describes carrier tape systems, which include a carrier tape including a plurality of pockets. Each pocket contains a semiconductor device adhered to a bottom surface of the pocket by an adhesive. In some embodiments, the adhesive is a reversible adhesive. Use of the adhesive reduces the likelihood the semiconductor device will be damaged due to movement of the semiconductor device in the pocket during shipment of the carrier tape. Methods of forming a semiconductor device carrier systems and methods of supplying semiconductor devices are also described.

A resin composition, a metal laminate, and a printed circuit board which use the resin composition are disclosed. A method for manufacturing the metal laminate is also disclosed. The resin composition contains at least one elastomer selected from the group consisting of a fluoroelastomer or a styrene-based elastomer; a fluororesin filler; and an inorganic filler.

The present disclosure relates to a dielectric substrate that may include a polymer based core film, and a fluoropolymer based adhesive layer. The polymer based core film may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D.sub.10 of at least about 1.0 microns and not greater than about 1.7, a D.sub.50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D.sub.90 of at least about 2.7 microns and not greater than about 6 microns.