Disclosed herein are various embodiments of a protective packaging system suitable for use with a prefinished building article. The protective packaging system generally is designed to reduce shrink back of the flexible substrate after tension is applied. The protective packaging system generally comprises at least one outer layer, at least one core layer and at least one adhesive layer. One or more layers of the protective packaging system may include a roughening agent such that the flexible substrate will not “gloss” or burnish a coating on a prefinished building article. The protective packaging system may also include one or more biocides.

Disclosed herein are various embodiments of a protective packaging system suitable for use with a prefinished building article. The protective packaging system generally is designed to reduce shrink back of the flexible substrate after tension is applied. The protective packaging system generally comprises at least one outer layer, at least one core layer and at least one adhesive layer. One or more layers of the protective packaging system may include a roughening agent such that the flexible substrate will not “gloss” or burnish a coating on a prefinished building article. The protective packaging system may also include one or more biocides.

A method for dielectrically heating foamable composition to foam and set the composition is described. In particular, radio frequency (RF) heating is used to heat the foamable composition to provide insulation in the manufacture of an article.

Example embodiments provide a resin layer, a light transmitting laminate, and a vehicle. The resin layer includes at least one laminating layer containing a polyvinyl acetal resin, a plasticizer, and a bonding strength modifier. The surface of the laminating layer includes a portion having a hydrophobicity of 3.5 to 10, as calculated by Equation 1:

Hydrophobicity=Non-polarity/polarity  (1) where the non-polarity represents the non-polar fraction of the surface free energy of the laminating layer and the polarity represents the polar fraction of the surface free energy of the laminating layer.

The resin layer has good shelf moisture resistance, undergoes less change in yellowness index, and has effectively controllable bonding strength due to its controlled hydrophobicity.

Provided is a pressure-sensitive adhesive sheet that may be used for the grinding of a hard and brittle substrate in a backgrinding step for the hard and brittle substrate, the pressure-sensitive adhesive sheet being excellent in all of low contamination property, productivity, grinding accuracy, and peelability. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer has a thickness of from 1 μm to 300 μm, and wherein a microhardness H (Pa) of the pressure-sensitive adhesive layer at 25° C. and the thickness, which is represented by h.sub.A (μm), of the pressure-sensitive adhesive layer satisfy a relationship represented by the following expression (1). log H≥1.9385×log h.sub.A+4.2611 . . . (1)

Provided is a pressure-sensitive adhesive sheet that may be used for the grinding of a hard and brittle substrate in a backgrinding step for the hard and brittle substrate, the pressure-sensitive adhesive sheet being excellent in all of low contamination property, productivity, grinding accuracy, and peelability. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer has a thickness of from 1 μm to 300 μm, and wherein a microhardness H (Pa) of the pressure-sensitive adhesive layer at 25° C. and the thickness, which is represented by h.sub.A (μm), of the pressure-sensitive adhesive layer satisfy a relationship represented by the following expression (1). log H≥1.9385×log h.sub.A+4.2611 . . . (1)

The present disclosure provides a low-temperature thermal laminating film (10), and a preparation method and the use thereof. The low-temperature thermal laminating film (10) includes a film substrate (100) and an adhesive layer (200), wherein the adhesive layer (200) is disposed on the film substrate (100), and the raw materials of the adhesive layer (200) include an ethylene-vinyl acetate resin, a tackifier and an antioxidant, wherein the weight percentage of the ethylene-vinyl acetate resin is 70%-90%, the weight percentage of the tackifier is 5%-25%, and the weight percentage of the antioxidant is 3%-5%. The adhesive layer (200) in the low-temperature thermal laminating film (10) has a strong bonding force with the film substrate (100), and the low-temperature thermal laminating film can be laminated at relatively low-temperatures and can achieve a good laminating effect.

The present disclosure provides a low-temperature thermal laminating film (10), and a preparation method and the use thereof. The low-temperature thermal laminating film (10) includes a film substrate (100) and an adhesive layer (200), wherein the adhesive layer (200) is disposed on the film substrate (100), and the raw materials of the adhesive layer (200) include an ethylene-vinyl acetate resin, a tackifier and an antioxidant, wherein the weight percentage of the ethylene-vinyl acetate resin is 70%-90%, the weight percentage of the tackifier is 5%-25%, and the weight percentage of the antioxidant is 3%-5%. The adhesive layer (200) in the low-temperature thermal laminating film (10) has a strong bonding force with the film substrate (100), and the low-temperature thermal laminating film can be laminated at relatively low-temperatures and can achieve a good laminating effect.

The present invention relates to a thermoplastic hot melt film having excellent adhesive strength in which hydrophobic nanosilica is mixed. The resin composition contains nanosilica having a particle size of 1 to 100 nm and containing hydrophobic functional groups on its surface in the range of 0.1 to 5 phr (Parts per Hundred Resin), and the nanosilica forms nanosilica aggregates with an average size of the aggregates is within 100˜1200 nm. The thickness of the thermoplastic hot melt film is 0.02˜0.3 mm. The thermoplastic hot melt film of the present invention is mixed with nanosilica containing hydrophobic functional groups, lipophilic, on the surface to improve dispersibility, strengthen water resistance, and increase tensile strength. The material cost is reduced while securing one adhesive strength and excellent durability, and multi-press molding is possible, which has the effect of increasing energy saving and productivity.

The present invention relates to a thermoplastic hot melt film having excellent adhesive strength in which hydrophobic nanosilica is mixed. The resin composition contains nanosilica having a particle size of 1 to 100 nm and containing hydrophobic functional groups on its surface in the range of 0.1 to 5 phr (Parts per Hundred Resin), and the nanosilica forms nanosilica aggregates with an average size of the aggregates is within 100˜1200 nm. The thickness of the thermoplastic hot melt film is 0.02˜0.3 mm. The thermoplastic hot melt film of the present invention is mixed with nanosilica containing hydrophobic functional groups, lipophilic, on the surface to improve dispersibility, strengthen water resistance, and increase tensile strength. The material cost is reduced while securing one adhesive strength and excellent durability, and multi-press molding is possible, which has the effect of increasing energy saving and productivity.