A splicing adhesive film, a manufacturing method thereof, and a photovoltaic module are provided. The splicing adhesive film includes a first portion and a plurality of second portions. The first portion includes a first material, and each second portion includes a second material. The first portion is located in the central region, and the plurality of second portions each are at least partially located in the edge region. The first portion and each second portion are at least partially overlapped in the first direction. The maximum thickness of each second portion located in the edge region is P, and the maximum thickness of the first portion located in the central region is Q, P>Q.

Provided are a film and an electric device comprising the same. The film comprises at least one modified polyolefin resin layer. A resin forming the modified polyolefin resin layer comprises 1-100% of modified polyolefin resin. A main chain in the modified polyolefin resin is an ethylene--olefin copolymer. A grafted branched chain in the modified polyolefin resin is selected from a compound formed by a vinyl monomer comprising one or more of anhydride group, hydroxyl, ester group, carbonyl, acylamino, pyridyl, epoxy, pyrrolidonyl and glycidyl. A molecular weight of the grafted branched chain is 150-8000 g/mol. The film prepared from the modified POE layer with the main chain and the grafted branched chain has excellent anti-PID performance. The layers have a better adhesive property without a laminated interface therebetween. The co-extruded film further has an excellent water vapor barrier property, a relatively high insulating property and a relatively high light transmittance.

Provided are a film and an electric device comprising the same. The film comprises at least one modified polyolefin resin layer. A resin forming the modified polyolefin resin layer comprises 1-100% of modified polyolefin resin. A main chain in the modified polyolefin resin is an ethylene--olefin copolymer. A grafted branched chain in the modified polyolefin resin is selected from a compound formed by a vinyl monomer comprising one or more of anhydride group, hydroxyl, ester group, carbonyl, acylamino, pyridyl, epoxy, pyrrolidonyl and glycidyl. A molecular weight of the grafted branched chain is 150-8000 g/mol. The film prepared from the modified POE layer with the main chain and the grafted branched chain has excellent anti-PID performance. The layers have a better adhesive property without a laminated interface therebetween. The co-extruded film further has an excellent water vapor barrier property, a relatively high insulating property and a relatively high light transmittance.

A high-frequency-dielectric-heating adhesive configured to bond three or more adherends is provided. The high-frequency-dielectric-heating adhesive contains a thermoplastic resin and a dielectric filler configured to generate heat upon application of a high-frequency electric field. MVR of the high-frequency-dielectric-heating adhesive in a range from a lower-limit temperature TL to an upper-limit temperature TU is in a range from 1 to 300 cm.sup.3/10 min, where the lower-limit temperature TL (unit: degrees C.) is defined by a numerical formula (Numerical Formula 11) below and the upper-limit temperature TU (unit: degrees C.) is defined by a numerical formula (Numerical Formula 12) below,

TL=(softening temperature TM of the high-frequency-dielectric-heating adhesive)+10 degrees C.(Numerical Formula 11)

TU=(thermal decomposition temperature TD of the high-frequency-dielectric-heating adhesive)10 degrees C.(Numerical Formula 12).

A high-frequency-dielectric-heating adhesive configured to bond three or more adherends is provided. The high-frequency-dielectric-heating adhesive contains a thermoplastic resin and a dielectric filler configured to generate heat upon application of a high-frequency electric field. MVR of the high-frequency-dielectric-heating adhesive in a range from a lower-limit temperature TL to an upper-limit temperature TU is in a range from 1 to 300 cm.sup.3/10 min, where the lower-limit temperature TL (unit: degrees C.) is defined by a numerical formula (Numerical Formula 11) below and the upper-limit temperature TU (unit: degrees C.) is defined by a numerical formula (Numerical Formula 12) below,

TL=(softening temperature TM of the high-frequency-dielectric-heating adhesive)+10 degrees C.(Numerical Formula 11)

TU=(thermal decomposition temperature TD of the high-frequency-dielectric-heating adhesive)10 degrees C.(Numerical Formula 12).

The invention features a reinforcement element including a continuous paper strip having a first side and a second side, a first adhesive composition disposed on at least one of the first side and second side.

The invention further features a paper reinforced tape including a continuous paper strip, a continuous paper backing layer and a first adhesive composition disposed between the continuous paper strip and the continuous paper backing layer thereby adhering the continuous paper strip to the continuous paper backing layer.

The paper reinforced tapes and reinforcement elements of this invention have improved repulpability, recyclability, compostability and biodegradability. Further, these reinforcement elements and paper reinforced tapes, despite being predominately paper, unexpectedly provide excellent container reinforcement properties and further can be used as opening tapes, closing tapes and carrying handles.

An article includes a substrate including a bonding surface area, a first adhesive disposed on the bonding surface area in a first discrete pattern, the first adhesive comprising a hot melt adhesive, and a second adhesive disposed on the bonding surface area in a second discrete pattern that is complementary to the first discrete pattern, wherein the first discrete pattern comprises about 1% to about 25% of the bonding surface area and the second discrete pattern comprises a balance of the bonding surface area.

A dielectric welding configured to weld a plurality of adherends of the same material or different materials through dielectric heating is provided. The dielectric welding film contains an A component in a form of a thermoplastic resin and a B component in a form of a dielectric filler, the A component including a polyolefin resin having a polar part, a content of the B component in the dielectric welding film ranging from 3 volume % to 40 volume %.

Provided is an interlayer film for laminated glass with which a void is difficult to be formed in an end part of laminated glass, and deterioration in transparency of laminated glass can be suppressed. An interlayer film for laminated glass according to the present invention has a one-layer structure or a two or more-layer structure, the interlayer film for laminated glass contains a polyvinyl acetal resin, a plasticizer, an oxidation inhibitor, and an ultraviolet absorber, and a spectral transmittance of a pressed interlayer film when the interlayer film for laminated glass is pressed to a thickness of 3% of a thickness before pressing to obtain the pressed interlayer film is 60% or more at a wavelength of 380 nm, 40% or less at a wavelength of 350 nm, and 38% or less at a wavelength of 320 nm.

The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.