C09J2431/00

Back-off preventing resealable adhesives

Adhesive compositions that replace gaskets and liners in sealing applications for packages that are detachable with hand force are described. The adhesive compositions are particularly useful in preventing leaks and spillage during storage and transport of its packaged contents. Advantageously, the adhesive composition provides packages with (1) a removal torque of from about 4 to about 20 in-lb and (2) resealable torque on subsequent openings of from about 2 to about 15 in-lb, measured in accordance to ASTM D2063.

Back-off preventing resealable adhesives

Adhesive compositions that replace gaskets and liners in sealing applications for packages that are detachable with hand force are described. The adhesive compositions are particularly useful in preventing leaks and spillage during storage and transport of its packaged contents. Advantageously, the adhesive composition provides packages with (1) a removal torque of from about 4 to about 20 in-lb and (2) resealable torque on subsequent openings of from about 2 to about 15 in-lb, measured in accordance to ASTM D2063.

COMPOSITE DRY ADHESIVE AND METHODS OF MAKING AND USING A COMPOSITE DRY ADHESIVE

A composite dry adhesive includes (a) an adhesive layer comprising a shape memory polymer and (b) a resistive heating layer comprising a shape memory polymer composite on the adhesive layer. The shape memory polymer composite includes conductive particles dispersed in a shape memory polymer matrix, where the conductive particles have a concentration sufficient to form a conductive path through the resistive heating layer.

COMPOSITE DRY ADHESIVE AND METHODS OF MAKING AND USING A COMPOSITE DRY ADHESIVE

A composite dry adhesive includes (a) an adhesive layer comprising a shape memory polymer and (b) a resistive heating layer comprising a shape memory polymer composite on the adhesive layer. The shape memory polymer composite includes conductive particles dispersed in a shape memory polymer matrix, where the conductive particles have a concentration sufficient to form a conductive path through the resistive heating layer.

LOW-TEMPERATURE THERMAL LAMINATING FILM AND PREPARATION METHOD AND APPLICATION THEREOF
20190284452 · 2019-09-19 · ·

The present disclosure provides a low-temperature thermal laminating film (10), and a preparation method and the use thereof. The low-temperature thermal laminating film (10) includes a film substrate (100) and an adhesive layer (200), wherein the adhesive layer (200) is disposed on the film substrate (100), and the raw materials of the adhesive layer (200) include an ethylene-vinyl acetate resin, a tackifier and an antioxidant, wherein the weight percentage of the ethylene-vinyl acetate resin is 70%-90%, the weight percentage of the tackifier is 5%-25%, and the weight percentage of the antioxidant is 3%-5%. The adhesive layer (200) in the low-temperature thermal laminating film (10) has a strong bonding force with the film substrate (100), and the low-temperature thermal laminating film can be laminated at relatively low-temperatures and can achieve a good laminating effect.

LOW-TEMPERATURE THERMAL LAMINATING FILM AND PREPARATION METHOD AND APPLICATION THEREOF
20190284452 · 2019-09-19 · ·

The present disclosure provides a low-temperature thermal laminating film (10), and a preparation method and the use thereof. The low-temperature thermal laminating film (10) includes a film substrate (100) and an adhesive layer (200), wherein the adhesive layer (200) is disposed on the film substrate (100), and the raw materials of the adhesive layer (200) include an ethylene-vinyl acetate resin, a tackifier and an antioxidant, wherein the weight percentage of the ethylene-vinyl acetate resin is 70%-90%, the weight percentage of the tackifier is 5%-25%, and the weight percentage of the antioxidant is 3%-5%. The adhesive layer (200) in the low-temperature thermal laminating film (10) has a strong bonding force with the film substrate (100), and the low-temperature thermal laminating film can be laminated at relatively low-temperatures and can achieve a good laminating effect.

DIELECTRIC HEATING OF FOAMABLE COMPOSITIONS

A method for dielectrically heating foamable composition to foam and set the composition is described. In particular, radio frequency (RF) heating is used to heat the foamable composition to provide insulation in the manufacture of an article.

RELEASE MATERIALS
20190276714 · 2019-09-12 ·

The present application is directed to an adhesive article comprising a pressure sensitive adhesive layer and a release layer in contact with the pressure sensitive adhesive layer. The release layer comprises a polyolefin block copolymer. Generally, the polyolefin block copolymer has a density of no greater than 0.9 g/cc.

MULTILAYER ADHESIVE ARTICLE

An adhesive article is described comprising a foamed adhesive layer and a non-foamed adhesive layer. The adhesive of each adhesive layer comprises a tetrahydrofurfuryl (meth)acrylate copolymer; an epoxy resin; a polyether polyol; and optionally a hydroxy-functional film-forming polymer. The adhesive may be used in structural and semi-structural bonding applications and is designed to fail cohesively.

EPOXY ADHESIVE COMPOSITION

The present invention provides an epoxy adhesive composition that is excellent in compatibility and storage stability, has high strength and excellent adhesiveness, is capable of reducing occurrence of warping or peeling when used for bonding different materials, and is also excellent in impact resistance after being cured. Provided is an epoxy adhesive composition including: a modified polyvinyl acetal resin having a constitutional unit with an acid-modified group; and an epoxy resin, the epoxy adhesive composition containing an organic solvent in an amount of 10.0% by weight or less.