The present disclosure provides an anti-PID encapsulation adhesive film, a photovoltaic module, and a photovoltaic module manufacturing method. The anti-PID encapsulation adhesive film includes a base adhesive film layer, an insulating layer, and a conductive layer. The insulating layer is located on one side surface of the base adhesive film layer. The insulating layer has a grid structure. The grid structure includes grid lines and a plurality of hollow portions defined by the grid lines. The grid lines have a structure corresponding to gaps between cell pieces. The conductive layer includes a plurality of conductive portions. The conductive portions are arranged in the hollow portions in one-to-one correspondence. The volume resistivity of the conductive portions is less than 100 ?.Math.cm.

The present disclosure provides an anti-PID encapsulation adhesive film, a photovoltaic module, and a photovoltaic module manufacturing method. The anti-PID encapsulation adhesive film includes a base adhesive film layer, an insulating layer, and a conductive layer. The insulating layer is located on one side surface of the base adhesive film layer. The insulating layer has a grid structure. The grid structure includes grid lines and a plurality of hollow portions defined by the grid lines. The grid lines have a structure corresponding to gaps between cell pieces. The conductive layer includes a plurality of conductive portions. The conductive portions are arranged in the hollow portions in one-to-one correspondence. The volume resistivity of the conductive portions is less than 100 ?.Math.cm.

A sealant structure and a method of fabricating a display panel are provided. The sealant structure includes a plurality of adhesive strips, and the adhesive strips overlap end to end to form a closed loop. Ends of at least one of any two adjacent adhesive strips are provided with an overlap region, and a width of the overlap region is less than or equal to one third of a width of the adhesive strip provided with the overlap region.

A heat sealable resin composition includes an ethylene-vinyl ester copolymer (A), and a tackifier resin (B), a content ratio of a constituent unit derived from a vinyl ester included in the ethylene-vinyl ester copolymer (A) is 8% by mass or more with respect to total copolymer constituent units constituting the ethylene-vinyl ester copolymer (A), and the tackifier resin (B) includes an alicyclic hydrocarbon resin (B1) and an aromatic hydrocarbon resin (B2).

A heat sealable resin composition includes an ethylene-vinyl ester copolymer (A), and a tackifier resin (B), a content ratio of a constituent unit derived from a vinyl ester included in the ethylene-vinyl ester copolymer (A) is 8% by mass or more with respect to total copolymer constituent units constituting the ethylene-vinyl ester copolymer (A), and the tackifier resin (B) includes an alicyclic hydrocarbon resin (B1) and an aromatic hydrocarbon resin (B2).

A curable composition comprising: a hydroxy-functional or ether-functional (meth)acrylate copolymer, an epoxy resin; water; a photocatalyst, and optionally a polyvinyl acetal polymer and/or a film-forming polymer. When cured, provides structural bonding adhesives that are curable under high humidity conditions.

The object of the invention is a low-fogging adhesive tape for enveloping elongated objects, in particular a low-fogging wrapping tape for bundling cables in automobiles. The latter has a support and an adhesive coating on at least one side of the support. According to the invention, a synthetic-rubber-based coating is used as the adhesive coating.

The present invention relates to a midsole material composition, a method for producing the midsole material and a shoe sole. The midsole material composition comprises an elastomer, a thermoplastic polymer, a suitable crosslinker and a catalyst, such that the midsole material of the present invention can be fabricated by subjecting the midsole material composition to a phase-inversion crosslinking reaction and a foaming process. The aforementioned thermoplastic polymer, which is a recyclable material, is inverted into a continuous phase after the phase-inversion crosslinking reaction, thereby enhancing a recycling property of the midsole material and improving a reusability of the shoe sole.

The present invention relates to a midsole material composition, a method for producing the midsole material and a shoe sole. The midsole material composition comprises an elastomer, a thermoplastic polymer, a suitable crosslinker and a catalyst, such that the midsole material of the present invention can be fabricated by subjecting the midsole material composition to a phase-inversion crosslinking reaction and a foaming process. The aforementioned thermoplastic polymer, which is a recyclable material, is inverted into a continuous phase after the phase-inversion crosslinking reaction, thereby enhancing a recycling property of the midsole material and improving a reusability of the shoe sole.

A composite dry adhesive includes (a) an adhesive layer comprising a shape memory polymer and (b) a resistive heating layer comprising a shape memory polymer composite on the adhesive layer. The shape memory polymer composite includes conductive particles dispersed in a shape memory polymer matrix, where the conductive particles have a concentration sufficient to form a conductive path through the resistive heating layer.