Embodiments provide methods of disassembling an apparel product. The methods include exposing an adhesive of the apparel product to heat or electromagnetic energy. The adhesive is disposed at least partially disposed between a major component and a minor component of the apparel product. The adhesive includes a shape memory material. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion configured to be coupled to the major component with the adhesive. The methods include separating the major component from the minor component adjoined by the adhesive.

Provided herein is a solvent-based pressure sensitive adhesive comprising a polymer comprising a vinyl acetate monomer, an acrylic ester monomer, and a monomer having hydroxyl or amine functionality. The adhesive also comprise a crosslinker. The coated and dried adhesive has outgassing of less than 2000 ng/cm.sup.2, even when applied to an electronic device that is operated at elevated temperature.

Provided herein is a solvent-based pressure sensitive adhesive comprising a polymer comprising a vinyl acetate monomer, an acrylic ester monomer, and a monomer having hydroxyl or amine functionality. The adhesive also comprise a crosslinker. The coated and dried adhesive has outgassing of less than 2000 ng/cm.sup.2, even when applied to an electronic device that is operated at elevated temperature.

A low temperature rapid curing type low elastic conductive adhesive is provided which is useful as a conductive adhesive for component mounting in a field of FHE. The conductive resin composition contains (A) at least two types of urethane acrylate oligomers, (B) a radical polymerizable monomer, (C) a free radical generation curing agent, and (D) conductive particle. In the conductive resin composition, the component (A) preferably contains a high molecular weight urethane acrylate oligomer having a weight average molecular weight of 10,000 or more (A1), and a low molecular weight urethane acrylate oligomer having a weight average molecular weight of 9,999 or less (A2).

A low temperature rapid curing type low elastic conductive adhesive is provided which is useful as a conductive adhesive for component mounting in a field of FHE. The conductive resin composition contains (A) at least two types of urethane acrylate oligomers, (B) a radical polymerizable monomer, (C) a free radical generation curing agent, and (D) conductive particle. In the conductive resin composition, the component (A) preferably contains a high molecular weight urethane acrylate oligomer having a weight average molecular weight of 10,000 or more (A1), and a low molecular weight urethane acrylate oligomer having a weight average molecular weight of 9,999 or less (A2).

Non-sensitizing pressure sensitive adhesives which are useful in medical applications and other uses where an adhesive is in contact with skin are obtained by energy-curing compositions containing one or more acrylate-functionalized compounds and possibly other components which are selected such that the cured adhesive passes an in vitro cytotoxicity test in accordance with ISO 10993-5 (2009).

Adhesives, particularly reversible adhesives, reversible adhesive hydrogel meshes and polymer formulations that may be used in preparation of the reversible adhesive hydrogel meshes are disclosed. The polymer formulations may comprise a reversible monomer of a reversible adhesive polymer, acrylic acid (AA), an acrylate cross-linker, a photo-initiator for free radical polymerization, and a solvent. The disclosure also relates to a wound dressing comprising the reversible adhesive hydrogel meshes. Such wound dressings are particularly suitable for treatment of damaged sensitive tissue, for example, wounds formed on a fragile skin.

Described herein is a reworkable optically clear adhesive composition comprising: a hot melt adhesive present in an amount of at least about 40 wt. %; a pressure sensitive adhesive present in an amount of at 5 least about 10 wt. %; and titanium dioxide nanoparticles present in an amount of up to about 5 wt. %; wherein the weight percentage of each component is based on the total weight of solids of the adhesive composition. Also described herein is a display for an electronic device comprising the reworkable optically clear adhesive composition and a method of producing the display for an 10 electronic device.

The present disclosure relates to a thin glass layer-laminated printed steel sheet having a clearly visible pattern printed on a printed steel sheet and has excellent flame retardancy, and a method for manufacturing the same. Specifically, the present disclosure provides a thin glass layer-laminated printed steel sheet comprising: a printed steel sheet comprising a metal sheet and a printed layer on which a design or pattern having a resolution of 300 dpi or higher is printed, the printed layer being formed on a surface of the metal sheet; a transparent ultraviolet-curable adhesive layer comprising a flame retardant material and having a thickness of 10 to 100 μm, the adhesive layer being formed on the printed steel sheet; and thin glass layer attached by the adhesive layer, and a method for manufacturing the same.

An adhesive film for a display includes a first adhesive layer including an adhesive resin; a water-vapor barrier layer disposed on the first adhesive layer; a second adhesive layer disposed on the water-vapor barrier layer and including an adhesive resin; and an optical film disposed on the second adhesive layer, wherein at least one layer of the first adhesive layer or the water-vapor barrier layer contains at least one tungsten oxide selected from a group consisting of cesium-doped tungsten oxide (CWO; cesium-doped WO.sub.3) and tungsten oxide (WO.sub.3).