An adhesive film and a display member, the adhesive film being formed of an adhesive composition that includes a monomer mixture comprising a hydroxyl group-containing (meth)acrylate and a comonomer, wherein the adhesive film has a recovery rate of about 40% to about 99%, the recovery rate being determined according to Method A as described herein, and wherein the adhesive film has a bubble generation area of about 0%, the bubble generation area being determined according to Method B as described herein.

Provided is a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. The film includes a base layer, and an adhesive layer disposed on one surface side of the base layer, wherein the ratio RE (=E′(160)/E′(−40)) of the elastic modulus of the base layer at 160° C. to the elastic modulus of the base layer at −40° C. is RE≥0.01, and the elastic modulus E′(−40) is 10 MPa to less than 1000 MPa. The method includes bonding the adhesive layer to a back surface of a semiconductor wafer, separating the semiconductor wafer into segments to obtain semiconductor parts, and separating the semiconductor parts from the adhesive layer, and includes a step of evaluating.

To provide a double-sided pressure-sensitive adhesive sheet having high flexing resistance that does not suffer flexure and exfoliation in a flexing test that is closer to the actual use environment. A double-sided pressure-sensitive adhesive sheet having no substrate, containing a pressure-sensitive adhesive composition containing a (meth)acrylate ester (co)polymer (A), and having a glass transition temperature (Tg) defined by a Tan δ peak temperature of dynamic viscoelasticity in a range of −50° C. to −20° C., a storage elastic modulus G′ at a frequency of 1 Hz and a temperature 100° C. in a range of 2.0×10.sup.3 to 3.0×10.sup.4 Pa, and a thickness of 10 μm or more and 150 μm or less.

The present invention refers to a method for producing polymeric compositions, preferably in the form of water-based (i.e. waterborne) compositions, more preferably dispersions (i.e. emulsions or latices), which are particularly useful as or in adhesives, especially pressure-sensitive adhesives, particularly pressure-sensitive adhesives degradable under basic conditions, as well as to the polymeric compositions thus produced and to their applications.

Film constructions are disclosed that remove well from both new and aged substrates, initially and over the long term, without compromising the other possible required properties of film construction, including but not limited to, digital printability, cold temperature adhesion, durability, and conformability. Methods of protecting a surface are also disclosed.

Provided is a pressure-sensitive adhesive sheet for semiconductor wafer processing that is excellent in adhesiveness with a semiconductor wafer, and that has light peelability and suppresses adhesive residue. The pressure-sensitive adhesive sheet for semiconductor wafer processing includes in this order: a base material; an intermediate layer; and a UV-curable pressure-sensitive adhesive layer. The intermediate layer has a storage modulus of elasticity at room temperature, G′1.sub.RT, of from 300 kPa to 2,000 kPa, and a storage modulus of elasticity at 80° C., G′1.sub.80, of from 10 kPa to 500 kPa. The UV-curable pressure-sensitive adhesive layer has a storage modulus of elasticity at room temperature, G′2.sub.RT, of from 100 kPa to 1,000 kPa, and a storage modulus of elasticity at 80° C., G′2.sub.80, of from 10 kPa to 1,000 kPa. G′1.sub.RT/G′2.sub.RT is 1 or more.

The purpose of the present invention is to provide a transfer sheet capable of providing hard coat properties and excellent weather resistance to a resin molded article such as organic glass. The transfer sheet has, in order, a base material film for mold release, a hard coat layer, a primer layer, and an adhesive layer. The weather resistance and adhesiveness of the hard coat layer and the primer layer are improved and hard coat properties and excellent weather resistance can be provided to a resin molded article being the transfer object, as a result of: the hard coat layer being formed from a cured product of a resin composition including a curable resin; and the primer layer being formed from a binder resin including a polyurethane having a mass-average molecular weight of 40,000-100,000 and including 1-30% by mass of an acrylic component.

The disclosed adhesive medical article has a backing layer having a first major surface and a second major surface opposite to the first major surface. The backing layer has a central portion and an outer circumferential portion. The article further has a pressure sensitive adhesive pattern coating applied onto at least part of the first major surface of the backing layer in such a way as to form a plurality of adhesive coated and adhesive uncoated areas of the backing layer. The adhesive uncoated areas comprise a central collection portion and at least one longitudinal extension radiating from the central collection portion towards the outer circumferential portion of the backing layer.

A film that is excellent in easy cuttability and linear cuttability and suppressed in breakability in processing, and a roll and a pressure-sensitive adhesive tape that includes the film. The film has the tensile strength in one direction is 1.1 to 2.5 kN/m and the tensile strength in a direction orthogonal to the one direction is 3.0 to 10 kN/m, or the tensile strain at tensile strength in one direction is 50 to 150% and the tensile strain at tensile strength in a direction orthogonal to the one direction is 8 to 20%.

There is a method of manufacturing a multilayer wiring board including: alternately stacking wiring layers and insulating layers; stacking a reinforcing sheet on one surface of the resulting multilayer laminate with a soluble adhesive layer therebetween, wherein an unoccupied region without the soluble adhesive layer is provided within a facing area where the reinforcing sheet faces the multilayer laminate; allowing a liquid capable of dissolving the soluble adhesive layer to infiltrate the unoccupied region to dissolve or soften the soluble adhesive layer; and releasing the reinforcing sheet from the multilayer laminate at the soluble adhesive layer. This method enables the multilayer wiring layer to be reinforced to generate no large local warpage, thereby improving the reliable connection and the surface flatness (coplanarity) of the multilayer wiring layer. The used reinforcing sheet can be released in a significantly short time, while minimizing the stress applied to the multilayer laminate.