A protective film 10 of the present invention is used by being attached to a resin substrate 21 at the time of performing heat bending on the resin substrate 21 while heating the resin substrate 21. The protective film 10 includes a base material layer and a pressure sensitive adhesive layer which is positioned between the base material layer and the resin substrate 21 and is adhered to the resin substrate 21. The base material layer is formed of a laminate having a first layer which is positioned on the opposite side of the pressure sensitive adhesive layer, contains a thermoplastic resin, and has a melting point of 150° C. or higher and a second layer which is positioned on the pressure sensitive adhesive layer side, contains a thermoplastic resin, and has a melting point of lower than 120° C.

There is provided a block copolymer A which is represented by a following general formula (I), wherein a ratio ((Ar.sup.1-D.sup.1)/D.sup.2) of a mass of a branched chain represented by Ar.sup.1-D.sup.1 to a mass of a branched chain represented by D.sup.2 is 1.0/0.15 to 1.0/1.75,

(Ar.sup.1-D.sup.1).sub.mX(D.sup.2).sub.n  (I) where, in the formula (I), Ar.sup.1-D.sup.1 and D.sup.2 are each a branched chain bonded to X, Ar.sup.1 is an aromatic monovinyl polymer block, D.sup.1 and D.sup.2 are each a conjugated diene polymer block, “m” is an integer of 1 or more, “n” is an integer of 1 or more, “m”+“n” is an integer of 3 or more, and X is a residue of a polyfunctional coupling agent.

The invention pertains to a relates to a copolymer (P1) of poly(aryl ether sulfones) (PAES) and polydimethylsiloxane (PDMS) and to the process for preparing the copolymer (P1) by melt-hydrosilylation.

A block copolymer comprising a polymer block (A) mainly comprising a vinyl aromatic monomer unit, and a polymer block (B) mainly comprising a conjugated diene monomer unit, the block copolymer being represented by the following general formula (1) or (2):

##STR00001##

wherein each curved portion represents a saturated or unsaturated hydrocarbon group having 1 to 20 carbon atoms which is unsubstituted or optionally has a substituent, X represents a group 1 element, and “polymer” represents a polymer moiety.

The invention relates to an adhesive strip which can be detached substantially on the adhesion plane in a residue-free and nondestructive manner by stretching, said strip consisting of one or more adhesive material layers and optionally one or more intermediate carrier layers, at least one of the adhesive materials layers containing at least one filler, the primary particles of which can be individually separated, wherein the primary particles (i) are substantially spherical and (ii) have an average diameter d(0.5) of less than 10 μm, and the ratio of the average diameter d(0.5) of the primary particles to the thickness of the adhesive material layer in which the primary particles are contained is less than 1:2. The invention also relates to the production and use of said adhesive strip.

The present invention relates to an adhesive composition containing a base polymer, a water-absorbing material, and a moisture-curable component, wherein the moisture-curable component is contained in an unreacted state, an adhesive layer made from the adhesive composition, and an adhesive sheet including the adhesive layer.

Provided is a PSA sheet comprising a fabric sheet and a PSA layer laminated on the fabric sheet. The PSA layer comprises a base polymer and a tackifier resin. The base polymer is a block copolymer of a monovinyl-substituted aromatic compound and a conjugated diene compound. The PSA layer has a thickness greater than 100 μm and less than 190 μm.

Provided is a PSA sheet comprising a fabric sheet and a PSA layer laminated on the fabric sheet. The PSA layer comprises a base polymer and a tackifier resin. The base polymer is a block copolymer of a monovinyl-substituted aromatic compound and a conjugated diene compound. The tackifier resin comprises a tackifier resin having a softening point below 120° C. and a tackifier resin having a softening point of 120° C. or higher. The fabric sheet has a thickness of 15 μm or greater and 50 μm or less as well as a bulk density of 0.25 g/cm.sup.3 or higher and 0.50 g/cm.sup.3 or lower.

The present disclosure relates to an encapsulation film and an organic electronic device comprising the same, which provides an encapsulation film having excellent resilience without causing plastic deformation, while having flexible and rollable characteristics, as well as implementing excellent moisture barrier characteristics, and an organic electronic device comprising the same. The encapsulation film includes an encapsulation composition which includes a block copolymer having a first block derived from a monomer having a glass transition temperature of 0° C. or higher, and a multifunctional oligomer, where, after the encapsulation film is stretched 200% (2 times the existing length) in the longitudinal direction under conditions of a temperature of 25° C. and 60% relative humidity and left for 24 hours, the degree of restoration at the time of removing the stretched force and measuring the length after 1 hour is within 110% of the existing length.

The present disclosure relates to an encapsulation film and an organic electronic device comprising the same, which provides an encapsulation film having excellent resilience without causing plastic deformation, while having flexible and rollable characteristics, as well as implementing excellent moisture barrier characteristics, and an organic electronic device comprising the same. The encapsulation film includes an encapsulation composition which includes a block copolymer having a first block derived from a monomer having a glass transition temperature of 0° C. or higher, and a multifunctional oligomer, where, after the encapsulation film is stretched 200% (2 times the existing length) in the longitudinal direction under conditions of a temperature of 25° C. and 60% relative humidity and left for 24 hours, the degree of restoration at the time of removing the stretched force and measuring the length after 1 hour is within 110% of the existing length.