A filler-containing film that can be precisely pressed to an electronic component with lower thrust is a film having a filler distributed layer in which fillers are regularly disposed in a resin layer, wherein an area occupancy rate of the fillers in a plan view is 25% or less, a ratio La/D between a layer thickness La of the resin layer and a particle diameter D of the fillers is 0.3 or more and 1.3 or less, and a proportion by number of the fillers present in a non-contact state with each other is 95% or more with respect to the entire fillers. The proportion by number of the fillers present in a non-contact state with each other is preferably 99.5% or more with respect to the entire fillers.

A process of heat shrinking an article is provided. The process includes shaping a thermoplastic vulcanizate (TPV) into an article, the TPV having: a partially vulcanized rubber dispersed in a continuous thermoplastic phase, wherein more than 5 wt % of the rubber is extractable in boiling xylene, and wherein the thermoplastic phase comprises a thermoplastic resin having a Tm>110 C. and a propylene-based elastomer (PBE) having a Tm<110 C.; and heating the article to a temperature between about 100 C. and 250 C. to shrink the article.

The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.

Provided are a film-like adhesive that can prevent the back surface of a semiconductor chip, the front surface of a substrate, or the front surface of a heat sink from being partially fractured by a filler; and a method for producing a semiconductor package using the film-like adhesive.

The film-like adhesive includes an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and a heat-conductive filler material (D), in which the heat-conductive filler (D) has an average particle size of 0.1 to 10.0 m, a compression ratio at break in a microcompression test of 5 to 50% of the average particle size of the sample, a fracture strength in a microcompression test of 0.01 to 2.0 GPa, and a thermal conductivity of 30 W/m.Math.K or higher, the content of component (D) is 10 to 70 vol % with respect to the total amount of the components (A) to (D), and the thermal conductivity after thermal curing is 1.0 W/m.Math.K or higher.

Provided are a film-like adhesive that can prevent the back surface of a semiconductor chip, the front surface of a substrate, or the front surface of a heat sink from being partially fractured by a filler; and a method for producing a semiconductor package using the film-like adhesive.

The film-like adhesive includes an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and a heat-conductive filler material (D), in which the heat-conductive filler (D) has an average particle size of 0.1 to 10.0 m, a compression ratio at break in a microcompression test of 5 to 50% of the average particle size of the sample, a fracture strength in a microcompression test of 0.01 to 2.0 GPa, and a thermal conductivity of 30 W/m.Math.K or higher, the content of component (D) is 10 to 70 vol % with respect to the total amount of the components (A) to (D), and the thermal conductivity after thermal curing is 1.0 W/m.Math.K or higher.

This disclosure relates to a polymer film including: a base film including polyamide-based resin including two or more different kinds of repeat units; and a copolymer including polyamide-based segments and polyether-based segments.

An adhesive composition, wherein the adhesive composition is applied to obtain an adhesive coating layer having a complex viscosity of 10 Pa.Math.s or more and 10,000 Pa.Math.s or less at 25? C. or more and 100? C. or less, and the adhesive coating layer has a viscosity reduction rate of 80% or less determined by the following formula (1):

Viscosity reduction rate (%)=((V.sub.25?V.sub.100)/V.sub.25)?100Formula (1) wherein V.sub.25: Complex viscosity at 25? C., and V.sub.100: Complex viscosity at 100? C.

An energy-beam-crosslinkable pressure sensitive adhesive composition, including an acrylic resin (A) having energy beam crosslinkability, and a tackifier (B). The tackifier (B) contains a styrene-based resin (B1). A pressure sensitive adhesive sheet including an energy-beam-crosslinkable pressure sensitive adhesive composition layer containing the energy-beam-crosslinkable pressure sensitive adhesive composition on a substrate or a release liner.

Flexible films of thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces. the materials are particularly useful in bonding together dissimilar substrates.

A composite comprises: at least one reinforcing element (10), an adhesive layer (14) made from an adhesive composition and coating the reinforcing element (10), an elastomeric bonding layer (16) made from an elastomeric bonding composition and directly coating the adhesive layer (14), and an elastomeric body made from an elastomeric matrix and embedded in which is the reinforcing element (10) coated with the adhesive layer (14) and with the elastomeric bonding layer (16). The adhesive composition comprises a phenol-aldehyde resin based: on an aromatic polyphenol comprising at least one aromatic ring bearing at least two hydroxyl functions in the meta position relative to one another, the two positions ortho to at least one of the hydroxyl functions being unsubstituted; and on an aromatic aldehyde bearing an aldehyde function, comprising at least one aromatic ring.