C09J2461/00

Incorporation of boron complex into resin

Complexes, compositions, articles of manufacture, and method for making the same are provided herein. In one embodiment, a borate-polyol complex may be prepared by reacting a boron-containing compound and a polyol to form a reaction mixture and then neutralizing the reaction mixture to form a neutralized borate-polyol complex. The neutralized borate-polyol complex may then be used in combination with polymeric resins to form adhesive products, among other material products, which products can be in manufacturing articles.

WAFER LAMINATE AND MAKING METHOD

A wafer laminate has an adhesive layer (2) sandwiched between a support (1) and a wafer (3), with a circuit-forming surface of the wafer facing the adhesive layer. The adhesive layer (2) includes a light-shielding resin layer (2a), an epoxy-containing siloxane skeleton resin layer (2b), and a non-silicone thermoplastic resin layer (2c).

Flexible substrates comprising curable compositions containing acetoacetylated resins

This invention relates to an article of manufacture comprising at least one flexible substrate coated with at least one curable composition comprising: I. a first component (I) comprising at least one resin having at least one functional group selected from the group consisting of β-ketoester and malonate functional groups, II. a second component (II) comprising at least one curing agent having at least one aldehyde functional group, and III. a third component (III) comprising at least one compound having amine functionality, salts thereof, or combinations thereof.

POLYMER FILM AND POLYMER FILM MANUFACTURING METHOD
20170313832 · 2017-11-02 ·

The present invention relates to a polymer film comprising a base film comprising polyamide-based resin; and two or more kinds of copolymers comprising polyamide-based segments and polyether-based segments, and a method for preparing the polymer film.

INCORPORATION OF BORON COMPLEX INTO RESIN

Complexes, compositions, articles of manufacture, and method for making the same are provided herein. In one embodiment, a borate-polyol complex may be prepared by reacting a boron-containing compound and a polyol to form a reaction mixture and then neutralizing the reaction mixture to form a neutralized borate-polyol complex. The neutralized borate-polyol complex may then be used in combination with polymeric resins to form adhesive products, among other material products, which products can be in manufacturing articles.

HOT-MELT ADHESIVE RESIN COMPOSITION AND HOT-MELT ADHESIVE RESIN LAMINATE
20220049131 · 2022-02-17 ·

A hot-melt adhesive resin composition includes a modified polyolefin in which a functional group is introduced into a polyolefin, a solid phenol resin, and a crosslinking agent, wherein the content of the modified polyolefin is 10 parts by mass or more and 40 parts by mass or less, based on 100 parts by mass of the total of the modified polyolefin and the solid phenol resin, and the modified polyolefin and the crosslinking agent are mixed so that a functional group possessed by the crosslinking agent is more than 1.0 equivalent and 5.0 equivalents or less, based on 1.0 equivalent of a functional group possessed by the modified polyolefin.

HOT-MELT ADHESIVE RESIN COMPOSITION AND HOT-MELT ADHESIVE RESIN LAMINATE
20220049131 · 2022-02-17 ·

A hot-melt adhesive resin composition includes a modified polyolefin in which a functional group is introduced into a polyolefin, a solid phenol resin, and a crosslinking agent, wherein the content of the modified polyolefin is 10 parts by mass or more and 40 parts by mass or less, based on 100 parts by mass of the total of the modified polyolefin and the solid phenol resin, and the modified polyolefin and the crosslinking agent are mixed so that a functional group possessed by the crosslinking agent is more than 1.0 equivalent and 5.0 equivalents or less, based on 1.0 equivalent of a functional group possessed by the modified polyolefin.

IMPROVEMENTS IN OR RELATING TO STRUCTURAL ADHESIVES
20170240774 · 2017-08-24 ·

The invention relates to structural adhesives and in particular to structural adhesives which are heat activated and which can be used for the bonding of components, particularly metal components, employed in the automotive industry.

INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT

Provided is an inkjet adhesive which is applied using an inkjet device, wherein the adhesive can suppress generation of voids in the adhesive layer and, after bonding, can enhance adhesiveness, moisture-resistant adhesion reliability, and cooling/heating cycle reliability. An inkjet adhesive according to the present invention comprises a photocurable compound, a photo-radical initiator, a thermosetting compound having one or more cyclic ether groups or cyclic thioether groups, and a compound capable of reacting with the thermosetting compound, and the compound capable of reacting with the thermosetting compound contains aromatic amine.

METHOD FOR PRODUCING A CERAMIC COMPONENT COMPOSED OF A PLURALITY OF JOINED PREFORMS AND COMPONENT OBTAINED BY THE METHOD

A method for producing a component includes a) providing at least two preforms each made of a carbon composite material, b) joining the at least two preforms at least at one respective connecting surface to form a composite, in which a joining compound is introduced between the joining surfaces of the preforms and then cured and the joining compound contains silicon carbide and at least one polymer adhesive, and c) siliconizing the composite to form the component. A component, such as an optical component produced thereby, is also provided.