This invention relates to a curable composition comprising: I. a first component comprising a resin having at least one functional group selected from the group consisting of β-ketoester and malonate functional groups, II. a second component comprising at least one curing agent having at least one aldehyde functional group, and III. a third component comprising at least one primary amine or at least one secondary amine, salts thereof, or combinations thereof.

This invention relates to a curable composition comprising: I. Component (I) comprising a resin having at least one functional group selected from the group consisting of β-ketoester and malonate functional groups; II. Component (II) comprising at least one curing agent having at least one aldehyde functional group; III. Component (III) comprising at least one amine, salts thereof, or combinations thereof; and, optionally IV. Component (IV) comprising at least one reactivity delayer; wherein said curing agent is at least one dialdehyde selected from the group consisting of 1,3-cyclohexanedicarboxaldehyde; 1,4 -cyclohexanedicarboxaldehyde; mixtures of 1,3-cyclohexanedicarboxaldehyde and 1,4-cyclohexanedicarboxaldehyde; 2,6-norbornanedicarboxaldehyde; 2,5-norbornanedicarboxaldehyde; cyclododecane-1,4,8-tricarbaldehyde; 3-(4 -formylcyclohexyl)propanal; tricyclodecane dialdehyde; o-phthalaldehyde; terephthalaldehyde; isophthalaldehyde; cyclopentane-1,3-dicarbaldehyde; cyclopenta-3,5-diene-1,3-dicarbaldehyde; glutaraldehyde; benzenedipropanal; any isomers thereof; and any mixtures thereof.

This invention relates to a curable composition comprising: I. Component (I) comprising at least one resin having at least one functional group selected from the group consisting of β-ketoester and malonate functional groups, II. Component (II) comprising at least one curing agent having at least one aldehyde functional group, and III. Component (III) comprising at least one compound having amine functionality, salts thereof, or combinations thereof; IV. Component (IV) which is at least one additive comprising at least one adhesion promoter, at least one green strength enhancer, or combinations thereof, or wherein said at least one additive is both an adhesion promoter and a green strength enhancer.

This invention relates to an assembly component comprising at least one substrate coated with at least one curable composition comprising: I. a first component (I) comprising a resin having at least one functional group selected from the group consisting of β-ketoester and malonate functional groups, II. a second component (II) comprising at least one curing agent having at least one aldehyde functional group, and III. a third component (III) comprising at least one compound having amine functionality, salts thereof, or combinations thereof.

This invention relates to a curable adhesive composition comprising: I. Component (I) comprising at least one amorphous or semi-crystalline polyester or at least one polyether or combinations thereof having at least one or at least two functional groups selected from the group consisting of β-ketoester and malonate functional groups, II. Component (II) comprising at least one or at least two aldehyde functional groups or isomers thereof, and III. Component (III) comprising at least one basic catalyst, salts thereof, or combinations thereof.

A display device includes a display module and a housing. At least one roller is disposed in the housing. The display module is configured to be wound on the at least one roller and to be inserted and drawn from the housing. The display module comprises a display panel, a window on the display panel and an adhesion layer between the display panel and the window. The adhesion layer comprises a first polymer layer having positive charges and a second polymer layer having negative charges. The second polymer layer is directly disposed on the first polymer layer.

A temporary adhesive includes: a polar resin of 5 wt % to 50 wt %, a first solvent of 30 wt % to 90 wt %, and a second solvent of 5 wt % to 60 wt %, wherein the polar resin includes at least one selected from a group consisting of a phenoxy resin, a poly(ether-ether-ketone) resin, a polycarbonate resin, a modified epoxy resin, or a polyolefin resin with a modified polar group; the first solvent is used to dissolve the polar resin; and the second solvent is used to improve a leveling property of the temporary adhesive.

An aqueous adhesive composition comprises a thermosetting resin based on: at least one aromatic compound bearing at least two functions, one of these functions being a hydroxymethyl function and the other being an aldehyde function or a hydroxymethyl function, the aromatic compound comprising at least one aromatic ring; and at least aromatic polyphenol comprising at least one aromatic ring bearing at least two hydroxyl functions in the meta position relative to one another, the two positions ortho to at least one of the hydroxyl functions being unsubstituted. Such an adhesive composition may especially be used to join elements made of wood; it constitutes an advantageous alternative to the use of a formaldehyde-based phenolic resin adhesive.

Provided are a film-like adhesive that can prevent the back surface of a semiconductor chip, the front surface of a substrate, or the front surface of a heat sink from being partially fractured by a filler; and a method for producing a semiconductor package using the film-like adhesive. The film-like adhesive includes an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and a heat-conductive filler material (D), in which the heat-conductive filler (D) has an average particle size of 0.1 to 10.0 μm, a compression ratio at break in a microcompression test of 5 to 50% of the average particle size of the sample, a fracture strength in a microcompression test of 0.01 to 2.0 GPa, and a thermal conductivity of 30 W/m.Math.K or higher, the content of component (D) is 10 to 70 vol % with respect to the total amount of the components (A) to (D), and the thermal conductivity after thermal curing is 1.0 W/m.Math.K or higher.

Provided are a film-like adhesive that can prevent the back surface of a semiconductor chip, the front surface of a substrate, or the front surface of a heat sink from being partially fractured by a filler; and a method for producing a semiconductor package using the film-like adhesive. The film-like adhesive includes an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and a heat-conductive filler material (D), in which the heat-conductive filler (D) has an average particle size of 0.1 to 10.0 μm, a compression ratio at break in a microcompression test of 5 to 50% of the average particle size of the sample, a fracture strength in a microcompression test of 0.01 to 2.0 GPa, and a thermal conductivity of 30 W/m.Math.K or higher, the content of component (D) is 10 to 70 vol % with respect to the total amount of the components (A) to (D), and the thermal conductivity after thermal curing is 1.0 W/m.Math.K or higher.