A thermosetting sheet according to the present invention includes: a thermosetting resin; a volatile component; and conductive particles, in which a weight reduction ratio W.sub.1 obtained when the thermosetting sheet under a nitrogen gas flow of 200 mL/min is heated from room temperature to 100° C. at a temperature rising rate of 10° C./min and then maintained at 100° C. for 30 minutes is 0.5 mass % or less, and a weight reduction ratio W.sub.2 obtained when the thermosetting sheet under a nitrogen gas flow of 200 mL/min is heated from 100° C. to 200° C. at a temperature rising rate of 10° C./min and then maintained at 200° C. for 30 minutes is 2 mass % or more.

Provided is an inkjet adhesive which is applied using an inkjet device, wherein the adhesive can suppress generation of voids in the adhesive layer and, after bonding, can enhance adhesiveness, moisture-resistant adhesion reliability, and cooling/heating cycle reliability. An inkjet adhesive according to the present invention comprises a photocurable compound, a photo-radical initiator, a thermosetting compound having one or more cyclic ether groups or cyclic thioether groups, and a compound capable of reacting with the thermosetting compound, and the compound capable of reacting with the thermosetting compound contains aromatic amine.

Provided is a masking tape for a shot peening process, including: a substrate having a first surface and a second surface; and a pressure-sensitive adhesive layer disposed on the first surface of the substrate. The masking tape has a breaking strength of 55 N/15 mm or more and exhibits an impact absorption rate of 20% or more in a falling ball impact test. Further, the masking tape has a displacement distance of 2 mm or less after 1 h from an initial position in a holding power test at 40 C. which is performed by applying a load of 500 g.

The embodiments described herein generally relate to methods and chemical compositions of phenolic epoxy systems. In one embodiment, a composition comprising a phenolic epoxy resin system includes an epoxy resin component and an alkoxylated phenol-aldehyde novolac resin.

A double-sided adhesive tape is provided, which includes a pressure-sensitive adhesive layer on a first side of the adhesive tape, a thermal bonding film layer on a second side of the adhesive tape, and a carrier layer interposing the thermal bonding film layer and the pressure-sensitive adhesive layer. A total thickness of the adhesive tape is 50-500 m.

A laminated product in which a first base material layer, an adhesive layer and a second base material layer are stacked in this order, wherein an edge of the laminated product is covered with a layer formed by a curable composition including at least one perfluoropolyether group-containing compound.

A display device includes a display module and a housing. At least one roller is disposed in the housing. The display module is configured to be wound on the at least one roller and to be inserted and drawn from the housing. The display module comprises a display panel, a window on the display panel and an adhesion layer between the display panel and the window. The adhesion layer comprises a first polymer layer having positive charges and a second polymer layer having negative charges. The second polymer layer is directly disposed on the first polymer layer.

The present disclosure relates to an adhesive resin composition for bonding semiconductors, including: a thermoplastic resin; a thermosetting resin; a curing agent; and a compound having a specific structure, and an adhesive film for semiconductors including the same.

The present disclosure relates to an adhesive resin composition for bonding semiconductors, including: a thermoplastic resin; a thermosetting resin; a curing agent; and a compound having a specific structure, and an adhesive film for semiconductors including the same.

Provided herein is a high performance reactive pressure sensitive adhesive (HPR-PSA) formulation which can be compounded and coated on facestock at ambient temperatures. Upon curing by exposing to a high temperature, the HPR-PSA becomes a structural adhesive with superior mechanical performance. This HPR-PSA formulation comprises the unique mixture of the SIS and SB rubber, hydrocarbon and rosin resins tackifiers, and a phenolic derivative curing agent.