Disclosed herein are an antimicrobial reinforced floor and a method for preparing the same. In the method, a substrate and an impregnated paper impregnated with an inorganic antimicrobial agent and an organic antimicrobial agent are subjected to hot press forming to produce the antimicrobial reinforced floor.

The invention provides a bonding agent particularly suited for bonding metal to castable polyurethane, polyesters and or polyamides.

Pressure-sensitive adhesive compositions and articles that include a layer of the pressure-sensitive adhesive compositions are provided. The pressure-sensitive adhesive compositions are particularly well suited for use with substrates that have been considered to have difficult to bond to surfaces such as those routinely encountered in the automotive industry. For example, the pressure-sensitive adhesive can be adhered to clear coat compositions, painted surfaces, and various polymeric materials having low energy surfaces (e.g., surfaces having a surface energy no greater than 35 dynes per centimeter).

A semiconductor-processing tape, for use in dividing an adhesive layer along semiconductor chips by expansion, having a base material film, a removable adhesive layer, and an adhesive layer, in this order, wherein the base material film has the stress values in MD and TD at the time of 5%-elongation of 5 MPa or, more, the tensile strength values in MD and TD at the time of 5%-elongation of 10 to 30 N/25 mm, and the thickness of from 70 to 150 m, and wherein the adhesive layer has a thickness of 40 m or more and the storage elastic modulus at 25 C. of 2000 MPa or less.

The present disclosure provides an organic sulfur acid-free composition containing a benzoxazine, phenolic compound and nitrogen-containing heterocyclic compound. The organic sulfur acid-free composition, upon curing at temperatures as low as 130-140 C., renders void free cured articles having well balanced thermal, chemical and mechanical properties. The organic sulfur acid-free composition may be used in a variety of applications, such as in coatings, structural and non-structural composites and encapsulating systems for electronic and electrical components.

Pressure-sensitive adhesive compositions and articles that include a layer of the pressure-sensitive adhesive compositions are provided. The pressure-sensitive adhesive compositions are particularly well suited for use with substrates that have been considered to have difficult to bond to surfaces such as those routinely encountered in the automotive industry. For example, the pressure-sensitive adhesive can be adhered to clear coat compositions, painted surfaces, and various polymeric materials having low energy surfaces (e.g., surfaces having a surface energy no greater than 35 dynes per centimeter).

An anisotropic conductive film can reduce the conduction resistance of an anisotropic conductively connected connection structure, and can reliably suppress the occurrence of short-circuits. The film has a structure wherein insulating particle-including conductive particles, wherein insulating particles adhere to the surfaces of conductive particles, are distributed throughout an insulating resin layer. In the insulating particle-including conductive particles, a number of insulating particles in contact with the conductive particles with respect to a film thickness direction is lower than with respect to a film planar direction. Preferably, a number of the insulating particles overlapping with the conductive particles when one of a front and rear film surface of the anisotropic conductive film is viewed in plan view is lower than a number of the insulating particles overlapping with the conductive particles when the other of the film surfaces is viewed in plan view.

A semiconductor-processing tape, for use in dividing an adhesive layer along semiconductor chips by expansion, having a base material film, a removable adhesive layer, and an adhesive layer, in this order, wherein the base material film has the stress values in MD and TD at the time of 5%-elongation of 5 MPa or, more, the tensile strength values in MD and TD at the time of 5%-elongation of 10 to 30 N/25 mm, and the thickness of from 70 to 150 m, and wherein the adhesive layer has a thickness of 40 m or more and the storage elastic modulus at 25 C. of 2000 MPa or less.

An adhesive article is described comprising a foamed adhesive layer and a non-foamed adhesive layer. The adhesive of each adhesive layer comprises a tetrahydrofurfuryl (meth)acrylate copolymer; an epoxy resin; a polyether polyol; and optionally a hydroxy-functional film-forming polymer. The adhesive may be used in structural and semi-structural bonding applications and is designed to fail cohesively.

An anisotropic conductive film or other filler-containing film 10A of the present invention includes a filler dispersed-layer 3 including a resin layer 2, a first filler layer with a filler 1A dispersed in a single layer in the resin layer 2, and a second filler layer with a filler 1B dispersed in a single layer in the resin layer 2 at a depth different from the depth of the first filler layer. The filler 1A of the first filler layer is exposed from one surface 2a of the resin layer 2, or is in close proximity to the surface 2a, and the filler 1B of the second filler layer is exposed from the other surface 2b of the resin layer 2, or is in close proximity to the surface 2b.