Disclosed are a structural adhesive tape in which a mesh layer is located on one side or both sides of an adhesive layer, and a method of manufacturing the same. The mesh layer having a specific specification may be used and an adhesive layer including an epoxy resin with a solid phase and a liquid phase and a flame retardant plasticizer may be used introduced so that a tape sagging phenomenon can be solved while minimizing degradation in adhesive strength. In addition, the mesh layer may be used so that a usage temperature range may be extended from a range ranging from about 5° C. to about 35° C. to a range ranging from about 0° C. to about 40° C., and thus workability in high and low temperature ranges may be improved such that tape workability can be improved even in overseas factories with poor temperature conditions.

Disclosed is a semi-hardened pressure sensitive adhesive film to be used in the semi-hardened state and having excellent printing step absorption properties. The adhesive film according to the present invention contains a radial polymer composition and a cationic polymer composition, and the radial polymer composition is primarily cross-linked to maintain the semi-hardened state. When applied onto a substrate through a printing step, the present invention has excellent step absorption properties and adhesion properties and excellent durability even under high-temperature and high-humidity conditions.

Provided are a heat dissipation material capable of ensuring stable adhesion while reducing cost, an inlay substrate using the same, and a method for manufacturing the same. A heat dissipation material having adhesive is obtained by coating a portion or the whole of the heat dissipation material with a heat dissipation material adhering composition including a resin component containing an epoxy resin, a curing agent, and an inorganic filler, and having a complex viscosity at 80° C. of 1×10.sup.3 Pa.Math.s to 5×10.sup.6 Pa.Math.s.

The cationically photopolymerizable composition according to the present disclosure includes: (A) a polyfunctional epoxy compound having two or more epoxy groups per molecule; (B) a monofunctional epoxy compound having one epoxy group per molecule; (C) a photocation generator; and (D) an oxetane compound. At least one of the component (A) and the component (B) contains an epoxy compound ((A1) or (B1)) having a polyether backbone per molecule. A mass ratio of the component (A) to the component (B) falls within a range of 90:10 to 30:70.

Methods for securely transferring and attaching electrically conductive particles filled in openings to a binder resin layer. The methods include a step of filling a solvent and electrically conductive particles in a plurality of openings formed on a surface of a substrate in a predetermined pattern, a step of pasting a surface on which a binder resin layer is formed of an adhesive film having the binder resin layer formed on a base film on a surface on which the openings are formed of the substrate, and a step of peeling off the adhesive film from the surface of the substrate and transferring and attaching the electrically conductive particles filled in the openings to the binder resin layer while heating the substrate.

The present invention aims to provide a polyvinyl acetal resin composition that is moldable by an extrusion method and capable of exhibiting excellent heat resistance after molding, an adhesive sheet containing the polyvinyl acetal resin composition, and a method for producing the adhesive sheet. The present invention relates to a polyvinyl acetal resin composition including: a polyvinyl acetal; a reactive diluent; and a photopolymerization initiator, the polyvinyl acetal resin composition having a storage modulus G′ at 200° C. before irradiation with light of 8×10.sup.4 Pa or lower and a storage modulus G′ at 200° C. after irradiation with light of 8×10.sup.3 Pa or higher, with the storage modulus G′ at 200° C. after irradiation with light being higher than the storage modulus G′ at 200° C. before irradiation with light.

The present invention aims to provide a polyvinyl acetal resin composition that is moldable by an extrusion method and capable of exhibiting excellent heat resistance after molding, an adhesive sheet containing the polyvinyl acetal resin composition, and a method for producing the adhesive sheet. The present invention relates to a polyvinyl acetal resin composition including: a polyvinyl acetal; a reactive diluent; and a photopolymerization initiator, the polyvinyl acetal resin composition having a storage modulus G′ at 200° C. before irradiation with light of 8×10.sup.4 Pa or lower and a storage modulus G′ at 200° C. after irradiation with light of 8×10.sup.3 Pa or higher, with the storage modulus G′ at 200° C. after irradiation with light being higher than the storage modulus G′ at 200° C. before irradiation with light.

A method a described which includes depositing a first component of a multicomponent system by means of an inkjet process, and depositing a second component of the multicomponent system by means of an inkjet process.

A laminate having an adhesive layer, which exhibits excellent adhesion to base films made from polyimide resins and the like or copper foils, as well as superior electrical properties, and also providing a laminate having an adhesive layer, which is low in warpage when the adhesive layer is in B stage, and which is excellent in storage stability of the laminate. The laminate having an adhesive layer includes a base film and an adhesive layer formed on at least one of the surfaces of the base film, in which the adhesive layer is formed of an adhesive composition comprising a carboxyl group-containing styrene based elastomer and an epoxy resin, wherein the content of the carboxyl group-containing styrene based elastomer is 50 parts by mass or more relative to 100 parts by mass of the solid content of the adhesive composition; the content of the epoxy resin is from 1 to 20 parts by mass relative to 100 parts by mass of the carboxyl group-containing styrene based elastomer; and the adhesive layer is in B-stage.

A laminate having an adhesive layer, which exhibits excellent adhesion to base films made from polyimide resins and the like or copper foils, as well as superior electrical properties, and also providing a laminate having an adhesive layer, which is low in warpage when the adhesive layer is in B stage, and which is excellent in storage stability of the laminate. The laminate having an adhesive layer includes a base film and an adhesive layer formed on at least one of the surfaces of the base film, in which the adhesive layer is formed of an adhesive composition comprising a carboxyl group-containing styrene based elastomer and an epoxy resin, wherein the content of the carboxyl group-containing styrene based elastomer is 50 parts by mass or more relative to 100 parts by mass of the solid content of the adhesive composition; the content of the epoxy resin is from 1 to 20 parts by mass relative to 100 parts by mass of the carboxyl group-containing styrene based elastomer; and the adhesive layer is in B-stage.