An adhesive composition and a polarizing plate including an adhesive layer formed using the same are disclosed herein. In some embodiments, an adhesive composition includes 3-ethyl-3-(2-ethylhexyloxy)methyloxetane, 3-ethyl-3-hydroxymethyloxetane, 3,3′-oxybis(methylene)bis(3-ethyloxetane), an aromatic epoxy compound, and an alicyclic epoxy compound, wherein the 3-ethyl-3-(2-ethylhexyloxy)methyloxetane is present in an amount of 20 parts by weight to 50 parts by weight, the 3-ethyl-3-hydroxymethyloxetane is present in an amount of 2 parts by weight to 8 parts by weight, the 3,3′-oxybis(methylene)bis(3-ethyloxetane) is present in an amount of 2 parts by weight to 8 parts by weight, the aromatic epoxy compound is present in an amount of 7 parts by weight to 38 parts by weight, and the alicyclic epoxy compound is present in amount of 10 parts by weight to 50 parts by weight, based on 100 parts by weight of the adhesive composition.

An ultraviolet-curable (UV-curable) adhesive composition is disclosed. The adhesive composition comprises: A) an epoxy curing agent component; B) a microencapsulated epoxy resin component; C) an expansion agent component; D) a binder component; and E) a photoinitiator component. The adhesive composition is useful for forming an adhesive. In various embodiments, the adhesive composition is in the form of a stick. The adhesive composition is useful for securing a fastener (e.g. in a borehole).

A pressure-sensitive structural adhesive film based on an epoxy resin composition, wherein the epoxy resin composition comprises a latent-reactive, thermally activatable curing agent for producing a structural bond after thermal curing and additionally a curing agent that cross-links at room temperature, wherein the not-cured adhesive film is compressible and therefore allows for tolerance compensation.

A resin composition for temporary fixing of a support for substrate conveyance to an organic substrate, the resin composition containing a thermoplastic resin, a thermosetting resin, and an inorganic filler. When the resin composition is formed into a film that is then heated for 30 minutes at 130° C. and for 2 hours at 170° C., the film obtains an elastic modulus of 350 to 550 MPa at 25° C.

There are provided a heat exchanger having a flat tube and a fin bonded together, without causing melting of a coating material covering the fin, and a method of manufacturing thereof. A heat exchanger includes: a flat tube having a flat cross-sectional shape and covered with an anticorrosive layer; and a fin bonded to the flat tube with a bonding agent on a first surface of the anticorrosive layer interposed therebetween, and covered with a coating material, the first surface of the anticorrosive layer having been roughened, and the bonding agent being fixed to the roughened first surface.

A low-cost, multi-function system with a form factor that unobtrusively integrates the components needed to implement a combination of different functions and also is able to perform a useful ancillary function that otherwise would have to be performed with the attendant need for additional materials, labor, and expense. An example adhesive product that integrates sensing components within a flexible adhesive structure in a way that not only provides a cost-effective platform for interconnecting, optimizing, and protecting the components of the tracking system but also maintains the flexibility needed to function as an adhesive product that can be deployed seamlessly and unobtrusively into various applications and workflows, including person and object tracking applications, and asset management workflows such as manufacturing, storage, shipping, delivery, and other logistics associated with moving products and other physical objects.

A microcapsule for use with an underwater adhesive includes a shell including nanoclay platelets and a polyurea product of an interfacial polymerization of a polyamine and an aromatic polyisocyanate. The microcapsule further includes a core composition encapsulated by the shell. The core composition includes a base catalyst for formation of a polyurethane, a polyol, and a hydrophilic solvent.

The present invention relates to an adhesive film comprising an adhesive layer; a photothermal conversion layer containing a light absorber and a thermally decomposable resin; and an adhesive base film layer disposed between the adhesive layer and the photothermal conversion layer, wherein the adhesive base film layer contains a multifunctional epoxy resin, a binder resin, a curing agent, and a curing catalyst. The adhesive film according to the present invention may be able to simplify a processing process of a substrate, and prevent damage to the substrate and circuits or elements formed on the substrate.

Provided is an adhesive composition that is capable of forming an adhesive layer having excellent electrical properties (low relative permittivity and low dielectric loss tangent) and excellent adhesiveness (adhesion properties) after heat curing, can improve adhesiveness (adhesion properties) in a laminating step, can prevent the peeling and lifting of layers during temporary fixing and roll-to-roll work, also has a high crosslink density, and does not cause heat resistance, solvent resistance and the like to deteriorate. The adhesive composition contains a bismaleimide resin and a styrene-based elastomer.

Provided is an adhesive composition that is capable of forming an adhesive layer having excellent electrical properties (low relative permittivity and low dielectric loss tangent) and excellent adhesiveness (adhesion properties) after heat curing, can improve adhesiveness (adhesion properties) in a laminating step, can prevent the peeling and lifting of layers during temporary fixing and roll-to-roll work, also has a high crosslink density, and does not cause heat resistance, solvent resistance and the like to deteriorate. The adhesive composition contains a bismaleimide resin and a styrene-based elastomer.