A hot melt adhesive sheet according to the present invention is a hot melt adhesive sheet including a base material having at least one surface on which an adhesive layer made of a hot melt adhesive is disposed. The hot melt adhesive includes a crosslinked product of an adhesive composition including a crosslinking agent, and includes a polyurethane resin, an epoxy resin, an isocyanate-based crosslinking agent, and a crystalline polyester resin. The epoxy resin includes a bisphenol A type epoxy resin and a rubber-modified epoxy resin. The crystalline polyester resin has a number average molecular weight Mn of 33,000 or less, and a glass transition temperature Tg of 5 C. or less. The isocyanate-based crosslinking agent is included in an amount of 14 mass parts or less based on 100 mass parts of a total of the polyurethane resin and the crystalline polyester resin.

The present invention provides low polyphenols (such as bisphenol A) tougheners for epoxy adhesives. The tougheners, and adhesives comprising the tougheners exhibit enhanced viscosity stability, e.g., compared to tougheners prepared from higher amounts of bisphenol A (and epoxy adhesives comprising them).

Provided are a low-temperature heat-curable adhesive composition for structures which is able to cure at a low temperature in a short time, is reduced in groove defects after open-state standing, and is excellent in rust-preventive property, corrosion resistance, shower resistance, and workability; and a method for producing an automotive structure using the adhesive composition. The low-temperature heat-curable adhesive composition for structures includes (A) an epoxy resin, (B) a micro-encapsulated curing agent, (C) a hygroscopic agent, (D) a viscosity modifier, and (E) a stabilizer. The hygroscopic agent (C) is calcium oxide, which suitably includes both a surface-treated grade and a non-surface-treated grade.

The present application provides agents for producing an impact-modified epoxy adhesive encompassing at least two components A and B packaged separately from each other, wherein (a) component A contains at least one compound having two or more isocyanate groups together with one or more further additives, (b) component B contains at least one compound which has at least two reactive groups selected from hydroxyl groups, thiol groups, primary amino groups and secondary amino groups and is simultaneously free from epoxy groups, together with one or more further additives, (c) at least one of components A and/or B contains at least one epoxide prepolymer as an additive, (d) at least one of components A and/or B contains at least one latent hardener for epoxide prepolymers as an additive, and (e) components A and B contain no blowing agent that is capable of being heat activated.

The present invention relates to an adhesive composition for a semiconductor and an adhesive film for a semiconductor including a cured product thereof, and in particular, to an adhesive composition for a semiconductor capable of removing voids occurring between an adherend and an adhesive and reducing bleed-out, and an adhesive film for a semiconductor including a cured product thereof.

As a first aspect, provided is a hybrid lens for which peeling and shifting of a glass and a resin lens do not easily occur, and for which floating of an adhesive layer and peeling between the glass and resin lens do not easily occur even when the hybrid lens is exposed to a high temperature environment. As a second aspect, provided is an easily produced hybrid lens in which a glass and a resin lens are laminated, and in which the resin lens and a light-shielding portion are laminated with good precision.

The hybrid lenses 11 and 12 each include a glass substrate 3, a resin lens 2, and an adhesive layer 4 provided between the glass substrate 3 and the resin lens 2. In the hybrid lens 11, the glass transition temperature of the resin lens 2 is higher than the glass transition temperature of the adhesive layer 4, and the difference between the glass transition temperature of the resin lens 2 and the glass transition temperature of the adhesive layer 4 is from 97 to 150° C. The hybrid lens 12 further includes a metal compound layer 52 provided between the glass substrate 3 and the resin lens 2.

A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.

An adhesive comprising a getter material and optionally a solvent comprising a catalyst activatable by means of an external stimulus for the reaction of the getter material with a permeate can tolerate brief contact with permeates such as moisture in particular before user application, without any significant impairment of getter capacity.

An adhesive comprising a getter material and optionally a solvent comprising a catalyst activatable by means of an external stimulus for the reaction of the getter material with a permeate can tolerate brief contact with permeates such as moisture in particular before user application, without any significant impairment of getter capacity.

The present invention aims to provide an adhesive composition which enables achievement of highly strong adhesion between a lightweight composite resin and a lightweight metal member, and which can maintain excellent adhesive strength even in cases where the ambient temperature largely changes or the adhesive composition is in contact with water or a snow-melting agent, and an adhesive sheet using it. The above object can be achieved with an adhesive composition containing at least an epoxy resin, an acrylic particle, and a curing agent, wherein the acrylic particle is a core-shell structure containing a butadiene-based rubber, and polymethacrylate or polyacrylate. The adhesive sheet is constituted such that an adhesive layer formed with the adhesive composition is present between a first release film and a second release film.