This invention relates to an assembly component comprising at least one substrate coated with at least one curable composition comprising:

I. a first component (I) comprising a resin having at least one functional group selected from the group consisting of -ketoester and malonate functional groups,

II. a second component (II) comprising at least one curing agent having at least one aldehyde functional group, and

III. a third component (HI) comprising at least one compound having amine functionality, salts thereof, or combinations thereof.

This invention provides a composition comprising I. a first component comprising at least one resin having two or more functional groups selected from the group consisting of -ketoester and malonate functional groups, and II. a second component having at least one or at least two primary amine functional groups.

This invention relates to a curable composition comprising: comprising: I. a first component comprising a resin having at least one functional group selected from the group consisting of -ketoester and malonate functional groups, II. a second component comprising at least one curing agent having at least one aldehyde functional group, and III. a third component comprising at least one primary amine or at least one secondary amine, salts thereof, or combinations thereof.

This invention relates to a curable adhesive composition comprising: I. Component (I) comprising at least one amorphous or semi-crystalline polyester or at least one polyether or combinations thereof having at least one or at least two functional groups selected from the group consisting of -ketoester and malonate functional groups, II. Component (II) comprising at least one or at least two aldehyde functional groups or isomers thereof, and III. Component (III) comprising at least one basic catalyst, salts thereof, or combinations thereof.

This invention relates to an article of manufacture comprising at least one flexible substrate coated with at least one curable composition comprising: I. a first component (I) comprising at least one resin having at least one functional group selected from the group consisting of -ketoester and malonate functional groups, II. a second component (II) comprising at least one curing agent having at least one aldehyde functional group, and III. a third component (III) comprising at least one compound having amine functionality, salts thereof, or combinations thereof.

An adhesive strain sensing pod includes at least one strain sensor, electronics for electrically sensing at least one strain signal from the at least one strain sensor, and a sensor adhesive for adhering the strain sensor to a surface of a structural element. The pod may have a protective case for protecting the strain sensor and the electronics and for transferring at least part of a force, pressing the pod against the surface, to press the strain sensor against the surface. The sensor adhesive may be a liquid adhesive contained in a fragile pouch that ruptures when the pod is forced against the surface, or may be a thermally activated adhesive film that is activated to bond the strain sensor to the surface. A protective film may protect the sensor adhesive prior to installation of the pod and is removed prior to installation of the pod on the surface.

A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form division grooves in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyester sheet in each region of the polyester sheet corresponding to each device chip, pushing up each device chip from the polyester sheet side to pick up each device chip from the polyester sheet.

The present invention provides an adhesive film hardly suffering from fisheyes and deposition of dirt and dusts thereonto and having excellent mechanical strength and heat resistance as well as good adhesion properties, which can be suitably used as various surface protective films, etc. The present invention relates to an adhesive film comprising a polyester film and an adhesive layer formed on at least one surface of the polyester film, in which the adhesive layer comprises a resin having a glass transition point of not higher than 0 C., and an antistatic agent, and a thickness of the adhesive layer is not more than 10 m.

Provided is a lid material for a press-through pack package, comprising a heat-seal layer composed of a heat-sealing agent and a lid material film, wherein the heat-sealing agent contains an adhesive resin having a ratio E1/E2 of a storage elastic modulus at 30 C. E1 to a storage elastic modulus at 60 C. E2 of from 4.0 to 20.0 and a ratio E2/E3 of E2 to a storage elastic modulus at 80 C. E3 of from 1.3 to 4.0. Also provided is a lid material for a press-through pack package, comprising a heat-seal layer composed of a heat-sealing agent and a lid material film, wherein the heat-sealing agent contains an adhesive resin having a melting point of from 40 C. to lower than 90 C.

Methods of using a toner as a printable adhesive are provided. In embodiments, a method of adhering substrates is provided which comprises disposing a cold pressure fix toner comprising a phase change material on a first substrate via xerography to form an unfused layer of the cold pressure fix toner on the first substrate; placing a second substrate on the unfused layer of the cold pressure fix toner; and subjecting the cold pressure fix toner to a pressure to form a bonded article comprising the first substrate, an adhesive layer formed from the cold pressure fix toner, and the second substrate. Methods of applying an adhesive to a substrate and bonded articles are also provided.