An electrically conductive adhesive layer is described. The adhesive layer includes an adhesive material and pluralities of electrically conductive at least first and second particles. The adhesive layer may have a thickness less than about 35 micrometers and an electrical resistance in the thickness direction of less than about 30 milliohms. A total volume of the pluralities of particles may be greater than 40% of a total volume of the adhesive layer. The first and second particles may have different shapes.

Exemplary methods for installing tile using a reactivatable tile bonding mat is disclosed. The reactivatable tile bonding mat is placed upon a substantially flat surface. Stone, porcelain or ceramic tile is placed and arranged on the reactivatable tile bonding mat in an aesthetically pleasing fashion, in some cases aided by the use of spacers in the joints between the sides of the tiles. Induction, or some other method of heat, is applied to the upper surfaces of the tiles, to quickly transfer through the tile, causing a polymer hot-melt material embedded in the reactivatable tile bonding mat to melt and adhere to a lower surface of the tiles, forming a strong bond. Upon the tiles fully bonding to the reactivatable tile bonding mat, spacers may be removed and a suitable grout may be applied in the joints between the sides of the tiles.

A composition is described comprising semicrystalline polylactic acid polymer; polyvinyl acetate polymer having a glass transition temperature (Tg) of at least 25° C.; plasticizer; and optionally amorphous polylactic acid polymer. In another embodiment the composition further comprises nucleating agent. Also described are films comprising the composition as well as articles, such as a tape or sheet, comprising the film described herein and a layer of pressure sensitive adhesive disposed on the film.

A composition is described comprising semicrystalline polylactic acid polymer; polyvinyl acetate polymer having a glass transition temperature (Tg) of at least 25° C.; plasticizer; and optionally amorphous polylactic acid polymer. In another embodiment the composition further comprises nucleating agent. Also described are films comprising the composition as well as articles, such as a tape or sheet, comprising the film described herein and a layer of pressure sensitive adhesive disposed on the film.

An adhesive for an electrical storage device packaging material containing a polyol compound (A), a polyisocyanate compound (B), and an epoxy resin (C), in which the polyol compound (A) contains an ester bond-containing polyol, and the following formula is satisfied when a stress at the time when a cured film obtained by performing curing under the condition of 80° C. for 2 weeks is stretched to twice its length at a speed of 6 mm/min under an environment of 20° C. and 65% RH is S1 [N/mm.sup.2], and a stress at the time when the cured film is held for 100 seconds in a stretched state is S2 [N/mm.sup.2]. Formula: 10.0≤(S1−S2)/S1×100≤40.0.

Methods of bonding together substrates that do not require use of primers, mixing, fixturing, or autoclaving. These methods can include the steps of disposing an adhesive layer on a bonding surface of either substrate, the adhesive layer comprising a curable composition that is dimensionally stable at ambient conditions; either before or after disposing the adhesive layer on the bonding surface, irradiating the adhesive layer with ultraviolet radiation to initiate curing of the curable composition; placing one substrate so as to be bonded to the other substrate by the adhesive layer; and allowing the adhesive layer to cure.

A method for manufacturing a joined body includes subjecting a first electronic component and a second electronic component to thermocompression bonding with a hot-melt adhesive sheet interposed therebetween. The hot-melt adhesive sheet includes a binder and electroconductive particles. The binder includes a crystalline polyamide resin and a crystalline polyester resin. When a melt viscosity of the hot-melt adhesive sheet is measured under a condition of a heating rate of 5° C./min. the hot-melt adhesive sheet has a ratio of a melt viscosity at 20° C. lower than a thermocompression bonding temperature to a melt viscosity at the thermocompression bonding temperature of 10 or higher.

Disclosed is a method of producing a fabric product, the method comprising preparing an upper; preparing a lining fabric; layering a thermoplastic hot-melt film between the upper and the lining fabric for bonding the upper and the lining fabric; bonding a lining fabric to the upper, wherein the thermoplastic hot-melt film consists of the composition selected from the group consisting of thermoplastic polyurethane, ethylene vinyl acetate, polyamide and polyester compositions, wherein the thermoplastic hot-melt film further contains nanosilica, wherein a content of the nanosilica is 0.1 to 5.0 Parts per Hundred Resin (phr) and a size of the nanosilica is less than 100 nm.

An adhesive resin composition for bonding two adherends of different materials together, the composition comprising a phenoxy resin and a polyester elastomer at a weight ratio (phenoxy resin:polyester elastomer) ranging from 20:80 to 80:20, wherein the area of portions where solid matter forms a phase separation structure attributed to both of the phenoxy resin and the polyester elastomer is at most 1 area % of an entire observation area in an elastic modulus phase image of a plurality of arbitrarily defined 10-μm square regions observed by an atomic force microscope (AFM) to which a probe having a tip radius of curvature of 10 nm at 25° C. is attached.

An adhesive resin composition for bonding two adherends of different materials together, the composition comprising a phenoxy resin and a polyester elastomer at a weight ratio (phenoxy resin:polyester elastomer) ranging from 20:80 to 80:20, wherein the area of portions where solid matter forms a phase separation structure attributed to both of the phenoxy resin and the polyester elastomer is at most 1 area % of an entire observation area in an elastic modulus phase image of a plurality of arbitrarily defined 10-μm square regions observed by an atomic force microscope (AFM) to which a probe having a tip radius of curvature of 10 nm at 25° C. is attached.