The present invention refers to a formulation suitable for the manufacture of a pressure sensitive adhesive, said formulation comprising: a) 40-95 wt % of polyalkylene carbonate having a number average molecular weight higher than 17.000 Da; b) 5-60 wt % of a polyether carbonate polyol having CO.sub.2 groups randomly incorporated in the chemical structure thereof, wherein the content of CO.sub.2 ranges from 0.5 to 40 wt %, based on the total weight of the polyether carbonate polyol; and c) optionally, less than 30 wt % of a tackifying resin, provided that said formulation does not contain any reticulating agent.

The present invention refers to a formulation suitable for the manufacture of a pressure sensitive adhesive, said formulation comprising: a) 40-95 wt % of polyalkylene carbonate having a number average molecular weight higher than 17.000 Da; b) 5-60 wt % of a polyether carbonate polyol having CO.sub.2 groups randomly incorporated in the chemical structure thereof, wherein the content of CO.sub.2 ranges from 0.5 to 40 wt %, based on the total weight of the polyether carbonate polyol; and c) optionally, less than 30 wt % of a tackifying resin, provided that said formulation does not contain any reticulating agent.

An electrically conductive adhesive layer is described. The adhesive layer includes an adhesive material and pluralities of electrically conductive at least first and second particles. The adhesive layer may have a thickness less than about 35 micrometers and an electrical resistance in the thickness direction of less than about 30 milliohms. A total volume of the pluralities of particles may be greater than 40% of a total volume of the adhesive layer. The first and second particles may have different shapes.

Provided are: a thermal bonding sheet suitable for actually providing sinter bonding between bonding targets while reducing misalignment of the bonding targets, and a dicing tape with such a thermal bonding sheet. This thermal bonding sheet includes a pressure-sensitive adhesive layer including sinterable particles containing a conductive metal. The pressure-sensitive adhesive layer has a shear bond strength of 0.1 MPa or more determined at 70 C. with respect to a silver plane to which the pressure-sensitive adhesive layer as a 5-mm square piece has been compression-bonded under compression bonding conditions of 70 C., 0.5 MPa, and 1 second. The thermal bonding sheet-associated dicing tape includes a dicing tape and the thermal bonding sheet. The dicing tape has a multilayer structure including a base and a pressure-sensitive adhesive layer. The thermal bonding sheet is disposed on the pressure-sensitive adhesive layer of the dicing tape.

A pressure sensitive adhesive sheet is provided which comprises a pressure sensitive adhesive layer formed of a pressure sensitive adhesive composition. The pressure sensitive adhesive composition contains an aliphatic polycarbonate and a pressure sensitive adhesive resin other than the aliphatic polycarbonate. The pressure sensitive adhesive sheet can be reduced in the adhesive strength at desired timing by a novel mechanism of action so that the release of an adherend becomes easy. The above pressure sensitive adhesive composition preferably contains an acid/base generator that generates an acid or a base by applying energy.

Provided are a thermal bonding sheet capable of suppressing inhibition of sintering of sinterable metallic particles by an organic component, thereby imparting sufficient bonding reliability to a power semiconductor device, and a thermal bonding sheet with a dicing tape having the thermal bonding sheet. A thermal bonding sheet has a precursor layer that is to become a sintered layer by heating, and the precursor layer has sinterable metallic particles and an organic component, a 95% weight loss temperature of the organic component is 150 C. or more and 300 C. or less when thermogravimetry of the thermal bonding sheet is performed under an air atmosphere at a heating rate of 10 C./min.

Semi-crystalline polyester polyols and their use in reactive hot-melt adhesives are disclosed. The polyols comprise recurring units of a C.sub.2-C.sub.10 aliphatic diol, a C.sub.8-C.sub.24 aliphatic dicarboxylic acid, and 1 to 20 wt. % of an aromatic dicarboxylic acid source, a polycarbonate, or a combination thereof. The polyols have a hydroxyl number within the range of 14 to 112 mg KOH/g. Reactive hot-melt adhesives from the polyols and composite structures produced using the adhesives are also disclosed. A minor proportion of aromatic dicarboxylic acid, polycarbonate content in the polyester polyol surprisingly improves the properties of reactive hot-melt adhesives when compared with a commercial hot-melt adhesive or an adhesive formulated using an all-aliphatic polyester polyol. The adhesives are useful for bonding a wide variety of substrates, including paper, wood, glass, ceramics, plastics, and metals.

A sheet for thermal bonding which has a tensile modulus of 10 to 3,000 MPa and contains fine metal particles in an amount in the range of 60-98 wt % and which, when heated from 23 C. to 400 C. in the air at a heating rate of 10 C./min and then examined by energy dispersive X-ray spectrometry, has a carbon concentration of 15 wt % or less.

The present invention refers to a composition comprising: (a) 5-95 wt % of a poly(alkylene carbonate), wherein said poly(alkylene carbonate) has a glass transition temperature equal to or lower than 30 C. and a number average molecular weight higher than 15,000 Da; and (b) 95-5 wt % of poly(alkylene carbonate), wherein said poly(alkylene carbonate) has a glass transition temperature higher than 30 C. It also refers to a method for producing said composition as well as to its use for preparing adhesive formulations with improved thermal stability and adhesion properties.

Provided are a water-dispersed pressure-sensitive adhesive composition excellent in dispersion stability and applicability, and a pressure-sensitive adhesive sheet for re-peeling using the water-dispersed pressure-sensitive adhesive composition. The water-dispersed pressure-sensitive adhesive composition includes: a water-dispersed acrylic polymer; an active energy ray-curable resin; and a photopolymerization initiator, wherein the water-dispersed acrylic polymer is a polymer obtained by subjecting a monomer composition containing (A) a carboxyl group-containing monomer represented by the formula (1) to emulsion polymerization:

##STR00001##

where R.sup.1 represents a hydrogen atom or a methyl group, R.sup.2 represents a divalent hydrocarbon group, x represents an integer of from 1 to 20, and y represents 0 or 1.