A pressure sensitive adhesive sheet is provided which comprises a pressure sensitive adhesive layer formed of a pressure sensitive adhesive composition. The pressure sensitive adhesive composition contains an aliphatic polycarbonate and a pressure sensitive adhesive resin other than the aliphatic polycarbonate. The pressure sensitive adhesive sheet can be reduced in the adhesive strength at desired timing by a novel mechanism of action so that the release of an adherend becomes easy. The above pressure sensitive adhesive composition preferably contains an acid/base generator that generates an acid or a base by applying energy.

A problem is to provide a sheet having a pre-sintering layer, the thickness of which following sintering is such as to be capable of relieving stresses. Solution means relate to a sheet comprising a pre-sintering layer. Viscosity at 90 C. of the pre-sintering layer is not less than 0.27 MPa.Math.s. Thickness of the pre-sintering layer is 30 m to 200 m.

The invention relates to a multilayer structure (MS) comprising (SI) at least one first polymer layer (SI) comprising ?95% by weight, preferably ?98% by weight, particularly preferably ?99% by weight, based on the total weight of the polymer layer (SI), of a polymer (PI) selected from the group consisting of a polycarbonate, a co-polycarbonate or mixtures thereof having a Vicat softening temperature?149? C., preferably ?160? C., Further preferably ?170? C.; more preferably ?180? C., determined according to ISO 360:2004 (50N; 50? /h); (S2) at least one further polymer layer (S2) having a Vicat softening temperature<149? C., preferably ?140? C., more preferably ?130? C., determined according to ISO 306:2004 (50N; 50? /h), preferably in a range from 120? C. to 148? C.; (S3) optionally at least one third polymer layer (S3) having a Vicat softening temperature ?149? C., preferably ?160? C., further preferably ?170? C.; more preferably ?180? C., determined according to ISO 306:2004 (50N; 50? h). The invention further relates to a process for producing a multilayer structure (MS) and to a security document comprising such a multilayer structure according to the invention.

Provided is a thermal bonding sheet which suppresses a compositional material of the thermal bonding sheet from protruding during bonding and from creeping up onto the surface of an object to be bonded, and provides a strong sintered layer after sintering. A thermal bonding sheet includes a layer. When the layer is analyzed by a differential thermal balance from 23 C. to 500 C. in an air atmosphere at a heating rate of 10 C./min, a value obtained by subtracting a weight decrease amount (%) at 300 C. from a weight decrease amount (%) at 500 C. is in a range of 1% to 0%.

A thermal bonding sheet includes a layer, in which hardness of the layer after being heated at a heating rate of 1.5 C./sec from 80 C. to 300 C. under pressure of 10 MPa, and then held at 300 C. for 2.5 minutes is in a range of 1.5 GPa to 10 GPa in measurement using a nanoindenter.

A problem is to provide a sheet which is such that a sintered body produced following sintering has a small amount of remaining organic substances. Solution means relate to a sheet comprising a pre-sintering layer. The pre-sintering layer comprises polycarbonate.

The present invention refers to a formulation suitable for the manufacture of a pressure sensitive adhesive, said formulation comprising: a) 40-95 wt % of polyalkylene carbonate having a number average molecular weight higher than 17.000 Da; b) 5-60 wt % of a polyether carbonate polyol having CO.sub.2 groups randomly incorporated in the chemical structure thereof, wherein the content of CO.sub.2 ranges from 0.5 to 40 wt %, based on the total weight of the polyether carbonate polyol; and c) optionally, less than 30 wt % of a tackifying resin, provided that said formulation does not contain any reticulating agent.

The present invention refers to a formulation suitable for the manufacture of a pressure sensitive adhesive, said formulation comprising: a) 40-95 wt % of polyalkylene carbonate having a number average molecular weight higher than 17.000 Da; b) 5-60 wt % of a polyether carbonate polyol having CO.sub.2 groups randomly incorporated in the chemical structure thereof, wherein the content of CO.sub.2 ranges from 0.5 to 40 wt %, based on the total weight of the polyether carbonate polyol; and c) optionally, less than 30 wt % of a tackifying resin, provided that said formulation does not contain any reticulating agent.

An electrically conductive adhesive layer includes an adhesive material; a plurality of electrically conductive first particles dispersed in the adhesive material and having a first shape; and a plurality of electrically conductive second particles dispersed in the adhesive material and having a second shape different from the first shape. A ratio of a total weight of the first particles to a total weight of the second particles is in a range from about 2 to about 10. The adhesive layer has an average thickness in a range from about 5 micrometers to about 35 micrometers. An electrical conductance of the adhesive layer in a thickness, but not in an in-plane, direction is at least 5% greater than a comparative adhesive layer having the same construction except that it does not include the second particles.

A laminate debonding method includes producing a laminate by joining a first substrate formed of a semiconductor-forming substrate to a second substrate formed of a support substrate which allows passage of infrared laser light, by the mediation of a first adhesive layer provided on the first substrate and a second adhesive layer provided on the second substrate, wherein the first adhesive layer is obtained by curing an adhesive (A) containing a component which is cured through hydrosilylation, and the second adhesive layer is obtained by use of an adhesive (B) formed of a polymer adhesive having an aromatic ring in at least one of a main chain and a side chain and which allows passage of infrared laser light; and irradiating the laminate with infrared laser light from a second substrate side for debonding the second substrate at the interface between the first and second adhesive layers.