The invention relates to an adhesive film that can be wound and stamped, having an epoxy-based adhesive compound that can be activated by UV radiation, characterized in that the adhesive compound comprises: a) 2-40 wt % of film former, b) 10-70 wt % of aromatic epoxy resins, c) cycloaliphatic epoxy resins, the cycloaliphatic epoxy resins not exceeding 35 wt %, d) 0.5-7 wt % of cationic initiators, e) 0-50 wt % of epoxy-enhanced polyether compounds, and f) 0-20 wt % of polyol, the proportions adding up to 100%, and the adhesive compound having an open time of 10 seconds to 60 minutes after the UV activation, during which open time the film has a pressure-sensitive adhesive characteristic.

Underwater adhesive are provided that include a hydrophobic polymer backbone having periodically embedded dynamic bonding units, where the underwater adhesive has nanophase separation between a first phase of the hydrophobic polymer backbone and a second phase of the dynamic bonding units. The resulting nanophase-separated morphology has clusters of dynamically bonded groups that are protected from water by a surrounding matrix of hydrophobic polymer backbone. This enables a pressure sensitive underwater adhesive with advantages of: no curing needed, reusable, recyclable, and good adhesion strength.

Disclosed are ethylenically unsaturated salts of allyl (poly)ether sulfates utilized as reactive surfactants or emulsifiers during emulsion polymerization.

Fiber-containing composites are described that include woven or non-woven fibers, and a binder that holds the fibers together. The binder may include the reaction product of a starch and a polycarboxylic acid. The starch has a weight average molecular weight that ranges from 110.sup.6 Daltons to 1010.sup.6 Daltons. The fiber-containing composite has an unaged tensile strength of greater than 4.0 and an aged tensile strength greater than 3.0. Also described are methods of making the fiber-containing composites. The methods may include applying a binder composition to fibers to form coated fibers, measuring a moisture content of the coated fibers, and curing the coated fibers in a curing oven to form the fiber-containing composite. The binder composition may include a starch having a weight average molecular weight that ranges from 110.sup.6 Daltons to 1010.sup.6 Daltons, and a polycarboxylic acid.

It is an object of the present invention to achieve an adhesive composition which enables provision of a cured product having excellent mechanical properties. In order to attain the foregoing object, an adhesive composition in accordance with an embodiment of the present invention contains: a polyoxypropylene-based polymer (A) which has, the terminal thereof, not less than 0.6 (meth)acryloyl groups on average and which has a number average molecular weight of not less than 5,000; a methacrylate compound (B) having a glass transition temperature of higher than 60? C. in a state of a homopolymer; an organic peroxide (C); and a reducing agent (D).

A self-adhesive article comprises an adhesive layer comprising a crosslinked adhesive composition, which comprises at least one polysilylated polymer having a number-average molar mass (Mn) of at least 20000 g/mol, wherein the at least one polysilylated polymer comprises a polyether and/or polyurethane main chain and at least two hydrolysable silylated end groups, said silylated end groups being attached to the main chain of the polymer by a urethane or ether function (referred to as a connector group); at least one tackifying resin having an average hydroxyl number of less than or equal to 100; and at least one crosslinking catalyst, excluding any monosilylated polymer.

The present disclosure provides an encapsulating composition, a composition, an encapsulating glue film, an electronic component and a solar cell assembly. The encapsulating composition comprises polyolefin resin, polyethylene glycol dimethacrylate and organic peroxide, and the structural formula of the polyethylene glycol dimethacrylate is represented by a formula (I). When the polyolefin resin is heated and melted, the ethylene glycol dimethacrylate is delaminated and aggregated in the polyolefin resin. A polymer network structure that has a three-dimensional network structure and that has several ester groups and ether bonds is formed in situ in a polyolefin resin matrix, and the polymer network structure may adsorb residual metal ions in the polyolefin resin, thereby reducing the mobility of the metal ions, so as to improve the dry insulation resistance of the polyolefin resin. In addition, said composition has simple components, readily available raw materials and low costs.

The present disclosure provides an encapsulating composition, a composition, an encapsulating glue film, an electronic component and a solar cell assembly. The encapsulating composition comprises polyolefin resin, polyethylene glycol dimethacrylate and organic peroxide, and the structural formula of the polyethylene glycol dimethacrylate is represented by a formula (I). When the polyolefin resin is heated and melted, the ethylene glycol dimethacrylate is delaminated and aggregated in the polyolefin resin. A polymer network structure that has a three-dimensional network structure and that has several ester groups and ether bonds is formed in situ in a polyolefin resin matrix, and the polymer network structure may adsorb residual metal ions in the polyolefin resin, thereby reducing the mobility of the metal ions, so as to improve the dry insulation resistance of the polyolefin resin. In addition, said composition has simple components, readily available raw materials and low costs.

A composition that toughens and impact modifies epoxy resin based compositions comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks. The disclosure also relates to epoxy resin compositions containing the composition comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks and films, adhesives, foamable compositions and foamed compositions containing such a composition.

Disclosed are ethylenically unsaturated salts of allyl (poly)ether sulfates utilized as reactive surfactants or emulsifiers during emulsion polymerization.