A resin composition includes 100 parts by weight of an unsaturated C?C double bond-containing polyphenylene ether resin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance, thermal resistance after moisture absorption and rigidity and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion. ##STR00001##

The present invention relates to blends of poly(ether ketone ketone) (PEKK) polymers, in particular to certain blends endowed with lower melting point than traditional PEKK polymers, yet maintaining high crystallinity and rapid crystallization behaviour, which are composed of a major amount of a first nucleophilic PEKK having a first T/I ratio, and a minor amount of a second PEKK having a second T/I ratio higher than the first T/I ratio: to methods of making the same, and to uses thereof in various fields.

A pressure-sensitive adhesive composition for an optical film of the present invention comprises a (meth)acryl-based polymer(A): and a polyether compound (B) having a polyether skeleton and a reactive silyl group represented by formula (1): SiR.sub.aM.sub.3-a at at least one terminal, wherein R represents a monovalent organic group having 1 to 20 carbon atoms and optionally having a substituent; M represents a hydroxyl group or a hydrolyzable group; and <a> represents an integer of 1 to 3, provided that in cases where two or more R groups, R groups is the same or different, and in cases where two or more M groups, M groups is the same or different. The pressure-sensitive adhesive composition for an optical film is capable of forming a pressure-sensitive adhesive layer having reworkability that enables an optical film to be easily peeled off from a liquid crystal panel or the like with no adhesive residue and satisfactory durability that prevents a bonded optical film from peeling or lifting.

A pressure-sensitive adhesive composition for an optical film of the present invention comprises a (meth)acryl-based polymer(A): and a polyether compound (B) having a polyether skeleton and a reactive silyl group represented by formula (1): SiR.sub.aM.sub.3-a at at least one terminal, wherein R represents a monovalent organic group having 1 to 20 carbon atoms and optionally having a substituent; M represents a hydroxyl group or a hydrolyzable group; and <a> represents an integer of 1 to 3, provided that in cases where two or more R groups, R groups is the same or different, and in cases where two or more M groups, M groups is the same or different. The pressure-sensitive adhesive composition for an optical film is capable of forming a pressure-sensitive adhesive layer having reworkability that enables an optical film to be easily peeled off from a liquid crystal panel or the like with no adhesive residue and satisfactory durability that prevents a bonded optical film from peeling or lifting.

Fiber-containing composites are described that include woven or non-woven fibers, and a binder that holds the fibers together. The binder may include the reaction product of a starch and a polycarboxylic acid. The starch has a weight average molecular weight that ranges from 1?10.sup.6 Daltons to 10?10.sup.6 Daltons. The fiber-containing composite has an unaged tensile strength of greater than 4.0 and an aged tensile strength greater than 3.0. Also described are methods of making the fiber-containing composites. The methods may include applying a binder composition to fibers to form coated fibers, measuring a moisture content of the coated fibers, and curing the coated fibers in a curing oven to form the fiber-containing composite. The binder composition may include a starch having a weight average molecular weight that ranges from 1?10.sup.6 Daltons to 10?10.sup.6 Daltons, and a polycarboxylic acid.

A composition that toughens and impact modifies epoxy resin based compositions comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks. The disclosure also relates to epoxy resin compositions containing the composition comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks and films, adhesives, foamable compositions and foamed compositions containing such a composition.

The present device is an adhesive sheet having an adhesive layer consisting of an adhesive composition containing a thermosetting resin and a thermal foaming agent and a coating layer. The coating layer having a resin and provided on the adhesive layer. The coating layer is characterized in that it does not exhibit tackiness at room temperature. In addition, at least a part of the coating layer disappears in a region ranging from an interface between the adhesive layer and the coating layer to a surface of the coating layer by heating the adhesive sheet at a temperature not lower than a curing starting temperature of the adhesive layer and wherein the following inequation is satisfied: T3<T1, T1 is a thermal foaming temperature of the thermal foaming agent, and T3 is a glass transition temperature of the coating layer.

Provided is a method of producing a pressure-sensitive adhesive containing a cured product of a curable composition containing a crosslinkable silicon group-containing organic polymer and an adhesion-imparting resin as a pressure-sensitive adhesive layer; curing of the curable composition does not proceed when heated during production, i.e., the curable composition has excellent stability when heated, and the crosslinking reaction of the curable composition proceeds by some sort of trigger. The pressure-sensitive adhesive contains, as a pressure-sensitive adhesive layer, a cured product of a curable composition containing (A) a crosslinkable silicon group-containing organic polymer, (B) an adhesion-imparting resin, (C) a SiF bond-containing silicon compound, and (D) a photobase generator.

Provided is a water-activated double-side adhesive tape or sheet, wherein a water-absorbing adhesive layer is provided on one surface of a water permeable substrate, and a water-activated adhesive layer which is made slippery by applying water is provided on the other surface of the water permeable substrate. The water-activated double-sided adhesive tape or sheet is used to fix grips onto sports equipment such as golf clubs and bicycle, and allows the adhesive layer to dry rapidly and the grips to be fixed well, regardless of the type of grip material.

The present disclosure relates to a thermosettable structural adhesive composition comprising an epoxy compound; a thermoplastic compound; an epoxy curing agent; at least one mineral filler, wherein the at least one mineral filler is capable of absorbing water. The thermosettable structural adhesive composition can exhibit an improved corrosion resistance while also providing good adhesive properties such as good t-peel strength and overlap shear strength.