Composite pillar structures, in particular for adhesion to soft and rough surfaces, include in the longitudinal direction at least one region with lower elasticity modulus and at least one region with higher elasticity modulus. The region with lower elasticity modulus preferably includes an end face, wherein the two regions adjoin one another.

An adhesive is provided that has superior bonding strength and that can be beneficially used as a structural adhesive and, when formed into a sheet shape, has superior shape retention. The adhesive includes an acrylic polymer; an epoxy resin in an amount of 80 to 300 parts by mass per 100 parts by mass of the acrylic polymer; at least one type of thermoplastic resin selected from the group consisting of a phenoxy resin and a polyvinyl butyral resin, in an amount of 15 parts by mass or greater per 100 parts by mass of the acrylic polymer; and an epoxy resin curing agent. In such an adhesive, the acrylic polymer is a polymer of monomer components including a (meth)acrylic acid ester having a homopolymer Tg of 80 C. or higher, a nitrogen-containing monomer, and a crosslinking monomer having an epoxy group.

The aim of the invention is to effectively protect a flat adhesive compound from permeates originating from the surroundings as well as from permeates trapped during lamination, winding, stacking or other processing steps. For this purpose, the adhesive tape comprises at least the following layers in the indicated order: a first outer adhesive compound layer A, a layer B, which contains at least one inorganic getter material, and a second outer adhesive compound layer C. The invention also relates to the use of said adhesive tape as an encapsulation material.

A curable perfluoropolyether adhesive composition including: (A) a linear perfluoropolyether compound having at least two alkenyl groups per molecule and having a perfluoropolyether structure containing a repeating unit represented by C.sub.aF.sub.2aO in a main chain, wherein a represents an integer of 1 to 6: 100 parts by mass; (B) a fluorine-containing organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule: an effective curing amount; and (C) a hydrosilylation-reaction catalyst: a catalytic amount. The curable perfluoropolyether adhesive composition does not contain any organic solvent in the composition. This provides a curable perfluoropolyether adhesive composition that produces a cured product with excellent heat resistance, weather resistance, water repellency, oil repellency, chemical resistance, solvent resistance, etc., and particularly free of voids that may otherwise occur on the coating film surface during heating processes, as well as an adhesive and an adhesive tape including the cured product.

Flexible films of thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces. the materials are particularly useful in bonding together dissimilar substrates.

Provided is a process for producing a surface-metalized polymer article, comprising: (a) preparing a graphene dispersion comprising multiple graphene sheets and an optional conductive filler dispersed in a first liquid medium, which is an adhesive monomer or contains a liquid adhesive monomer, oligomer or polymer dissolved in a solvent; (b) bringing a polymer article into a graphene deposition zone, wherein the graphene dispersion is sprayed, painted, coated, cast, or printed to deposit graphene sheets and optional conductive filler to a surface of the polymer article; and (c) moving the graphene-coated polymer article into a metallization chamber which accommodates a plating solution therein for plating a layer of a desired metal onto the graphene-coated polymer article to obtain a surface-metalized polymer article and retreating the surface-metalized polymer article from the metallization chamber.

Disclosed herein is a method of making polymerizable bio-based monomers containing one phenolic hydroxyl group which has been derivatized to provide at least one polymerizable functional group which is an ethylenically unsaturated functional group (such as a [meth]acrylate group), where the precursors of the polymerizable bio-based monomers are derived from raw lignin-containing biomass. Also disclosed herein are bio-based copolymers prepared from such bio-based monomers and a co-monomer, and methods of making and using such bio-based copolymers. In particular, the bio-based copolymers can be used as pressure sensitive adhesives, binders, and polymer electrolytes.

A rivetable adhesive for use in a joint between dissimilar materials, comprising a liquid epoxy resin, an expoxidized polysulfide, a flexibilizer, a solid epoxy CTBN adduct based upon bisphenol A, a phenoxy resin, an impact modifier including methacrylate-butadiene-styrene, a curing agent; and a blowing agent. The adhesive finds particular suitability for use in riveting aluminum panels to steel structures, such as for forming automotive vehicle roof structures.

Several embodiments of the present technology are directed to bonding sheets having enhanced plasma resistant characteristics, and being used to bond to semiconductor devices. In some embodiments, a bonding sheet in accordance with the present technology comprises a base bond material having one or more thermal conductivity elements embedded therein, and one or more etched openings formed around particular regions or corresponding features of the adjacent semiconductor components. The bond material can include PDMS, FFKM, or a silicon-based polymer, and the etch resistant components can include PEEK, or PEEK-coated components.

A composition for a bond ply, and a circuit subassembly that comprises such bond ply, are disclosed. The circuit subassembly can have a UL-94 rating of V-0. The composition of the bond ply layer comprises 25 to 45 volume percent of liquid resin; 10 to 40 weight percent of a bromine-containing or phosphorus-containing aromatic compound having a peak melting point of at least about 260 C.; and 5 to 35 volume percent inorganic filler.