C09J2471/00

COMPOSITIONS AND ADHESIVE ARTICLES INCLUDING POROUS POLYMERIC PARTICLES AND METHODS OF COATING SUBSTRATES

Compositions are provided that include a coating and porous polymeric particles disposed in the coating. Adhesive articles are also provided including a substrate and a composition disposed on a first major surface of the substrate. The composition includes an adhesive and porous polymeric particles disposed in the adhesive. Further, a method of coating a substrate is provided including providing a composition, providing a substrate having a surface, and applying the composition on the surface of the substrate. The compositions and adhesive articles can be applied to wet substrates or dry substrates.

ELECTRICALLY PEELABLE ADHESIVE COMPOSITION, ELECTRICALLY PEELABLE ADHESIVE PRODUCT, AND METHOD FOR PEELING PRODUCT
20220195259 · 2022-06-23 ·

The present invention has an object of obtaining an electrically peelable adhesive product that is strong in adhesibility when used, is excellent in peelability even though a low voltage is applied, and does not leave much adhesive deposit after being peeled. The present invention achieves the above object by virtue of an electrically peelable adhesive composition contained in the adhesive product, the adhesive composition comprising an acrylic polymer, an ionic liquid having an ionic conductivity of 10.sup.−4 S/cm or more to 10.sup.−2 S/cm or less, and an alkyl ether of a polyethylene glycol, and containing 5 parts by weight or more to 30 parts by weight or less of the ionic liquid and of the alkyl ether of the polyethylene glycol with respect to 100 parts by weight of the acrylic polymer.

ELECTRICALLY PEELABLE ADHESIVE COMPOSITION, ELECTRICALLY PEELABLE ADHESIVE PRODUCT, AND METHOD FOR PEELING PRODUCT
20220195259 · 2022-06-23 ·

The present invention has an object of obtaining an electrically peelable adhesive product that is strong in adhesibility when used, is excellent in peelability even though a low voltage is applied, and does not leave much adhesive deposit after being peeled. The present invention achieves the above object by virtue of an electrically peelable adhesive composition contained in the adhesive product, the adhesive composition comprising an acrylic polymer, an ionic liquid having an ionic conductivity of 10.sup.−4 S/cm or more to 10.sup.−2 S/cm or less, and an alkyl ether of a polyethylene glycol, and containing 5 parts by weight or more to 30 parts by weight or less of the ionic liquid and of the alkyl ether of the polyethylene glycol with respect to 100 parts by weight of the acrylic polymer.

Electrically conductive adhesive and electrically conductive material
11739238 · 2023-08-29 · ·

A method of producing an electrically conductive material includes hardening, at a temperature in a range of 120° C. to 300° C., an electrically conductive adhesive that constitutes: (A) a polyether polymer having a backbone of a repeating unit of the formula —R.sup.1—O—, wherein R.sup.1 is a hydrocarbon group having 1 to 10 carbon atoms and an end group which is a hydrolyzable silyl group; and (B) silver particles.

Moisture Curable Adhesive Compositions
20220145146 · 2022-05-12 · ·

A moisture curable composition, and a method of application and a substrate including the same are disclosed herein. In some embodiments, a curable composition includes a component (A) comprising an organic polymer containing reactive silicon groups represented by the general formula (1), a component (B) comprising an organic polymer having a viscosity lower than 10,000 cP at 23° C. containing reactive silicon groups represented by the general formula (2), and a component (C) comprising a polyolefin polymer. The moisture curable composition has universal adhesiveness to an adhesion-resistant substrate, such as PVC, EPDM, and TPO. The substrates can be smooth-back or fleece-back substrates.

BONDING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING BONDED BODY, AND BONDED BODY AND PASTED BODY

A bonding film for bonding a semiconductor element and a substrate. The bonding film has an electroconductive bonding layer formed by molding an electroconductive paste including metal fine particles (P) into a film form, and a tack layer having tackiness and laminated on the electroconductive bonding layer. The tack layer includes 0.1% to 1.0% by mass of metal fine particles (M) with respect to the metal fine particles (P) in the electroconductive bonding layer, and the metal fine particles (M) have a melting point of 250° C. or lower.

TIE LAYER CHEMISTRY TO PROMOTE BONDING WITH SILICONE ADHESIVE

The present invention is adhesive article including a tie layer and a silicone adhesive. The tie layer includes a segmented copolymer having a first segment that is one of (a) a polyether comprising one of PTMO or PEO/PPO or (b) a polysiloxane. The segmented copolymer has a water absorbency of less than about 13%.

ELECTRICALLY CONDUCTIVE ADHESIVE AND ELECTRICALLY CONDUCTIVE MATERIAL
20220017793 · 2022-01-20 · ·

Disclosed is an electrically conductive adhesive containing:

(A) a polyether polymer having a backbone comprising a repeating unit of the formula: —R.sup.1—O— wherein R.sup.1 is a hydrocarbon group having 1 to 10 carbon atoms, and an end group which is a hydrolyzable silyl group, and
(B) silver particles. Further disclosed is an electrically conductive material which is a hardened product of the electrically conductive adhesive.

Cable-wrapping tape

The invention relates to a cable wrapping tape for wrapping cables in motor vehicles, comprising a tape-shaped carrier and an adhesive coating on at least one side of said carrier, and characterised in that the adhesive coating and/or carrier are provided with an incorporated repellent against, in particular, mammal bites.

JOINING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING JOINED BODY, AND JOINED BODY

A joining film having sufficient connection heat resistance and high reliability, for which a joining process of joining a semiconductor element and a substrate is simple and easy, a tape for wafer processing, a method for producing a joined body, and a joined body. A joining film for joining a semiconductor element and a substrate includes an electroconductive joining layer formed by molding an electroconductive paste containing metal fine particles (P) into a film form; and a tack layer having tackiness and being laminated with the electroconductive joining layer. The tack layer is thermally decomposed by heating at the time of joining, the metal fine particles (P) of the electroconductive joining layer 13a are sintered, and thereby the semiconductor element and the substrate are joined.