The invention provides a joining film having sufficient connection heat resistance and high reliability, for which a joining process of joining a semiconductor element and a substrate is simple and easy, a tape for wafer processing, a method for producing a joined body, and a joined body. Disclosed is a joining film for joining a semiconductor element and a substrate, the joining film having an electroconductive joining layer formed by molding an electroconductive paste containing metal fine particles (P) into a film form; and a tack layer having tackiness and being laminated with the electroconductive joining layer. The tack layer is thermally decomposed by heating at the time of joining, the metal fine particles (P) of the electroconductive joining layer are sintered, and thereby the semiconductor element and the substrate are joined.

The present disclosure provides a laminate. The laminate includes a first film and a second film, wherein the first film is laminated to the second film. The first film includes a sealant layer containing (A) an ethylene-based polymer; and (B) a slip agent blend containing (i) a first polydimethylsiloxane having a number average molecular weight (Mn) from 30,000 g/mol to less than 300,000 g/mol; and (ii) a second polydimethylsiloxane having a number average molecular weight (Mn) from 300,000 g/mol to 2,000,000 g/mol.

Fiber-containing composites are described that include woven or non-woven fibers, and a binder that holds the fibers together. The binder may include the reaction product of a starch and a polycarboxylic acid. The starch has a weight average molecular weight that ranges from 1×10.sup.6 Daltons to 10×10.sup.6 Daltons. The fiber-containing composite has an unaged tensile strength of greater than 4.0 and an aged tensile strength greater than 3.0. Also described are methods of making the fiber-containing composites. The methods may include applying a binder composition to fibers to form coated fibers, measuring a moisture content of the coated fibers, and curing the coated fibers in a curing oven to form the fiber-containing composite. The binder composition may include a starch having a weight average molecular weight that ranges from 1×10.sup.6 Daltons to 10×10.sup.6 Daltons, and a polycarboxylic acid.

Fiber-containing composites are described that include woven or non-woven fibers, and a binder that holds the fibers together. The binder may include the reaction product of a starch and a polycarboxylic acid. The starch has a weight average molecular weight that ranges from 1×10.sup.6 Daltons to 1×10.sup.7 Daltons. The fiber-containing composite has an unaged tensile strength of greater than 4.0 and an aged tensile strength greater than 3.0. Also described are methods of making the fiber-containing composites. The methods may include applying a binder composition to fibers to form coated fibers, measuring a moisture content of the coated fibers, and curing the coated fibers in a curing oven to form the fiber-containing composite. The binder composition may include a starch having a weight average molecular weight that ranges from 1×10.sup.6 Daltons to 1×10.sup.7 Daltons, and a polycarboxylic acid.

The present invention is directed to a photo-curable adhesive or sealant composition comprising, based on the weight of the composition: from 1 to 10 wt. % of a) at least one oxetane compound according to Formula (1) below:

##STR00001## wherein: R.sup.1 and R.sup.2 are H, C.sub.1-C.sub.6 alkyl, C.sub.6-C.sub.18 aryl or C.sub.7-C.sub.18 aralkyl; each R.sup.3 is independently a C.sub.1-C.sub.12 alkylene group, C.sub.6-C.sub.18 arylene group, C.sub.2-C.sub.12 alkenylene group or a poly(C.sub.1-C.sub.6 alkyleneoxy) group; and, n is an integer of from 1 to 3; from 5 to 20 wt. % of b) at least one epoxide compound, wherein part b) is characterized in that at least 50 wt. % of the total weight of epoxide compounds is constituted by b1) at one cycloaliphatic epoxide; from 0.1 to 5 wt % of c) at least one ionic photoacid generator; from 0 to 10 wt. % of d) at least one free radical photoinitiator; from 0.01 to 5 wt. % of e) at least one near-infrared absorbing dye; and, from 50 to 90 wt. % of f) particulate filler.

An adhesive composition having a low dielectric constant and dielectric loss tangent and an excellent folding endurance includes: with respect to the total of 100 parts by mass of the adhesive composition, 75 to 90 parts by mass of a styrene elastomer; 3 to 25 parts by mass of a modified polyphenyleneether resin having a polymerizable group at an end; and totally 10 parts by mass or less of an epoxy resin and an epoxy resin curing agent.

Disclosed is a tire with reduced cavity noise including an adhesive agent layer applied to an inside of an inner liner and a sound absorber layer attached to the adhesive agent layer, wherein the adhesive agent layer includes poly(ether-urethane) containing alkoxysilane at both ends thereof. The tire with reduced cavity noise is stable without causing separation of a sound absorber even upon heating and deformation during driving.

The purpose of the present invention is to provide a thermally conductive moisture-curable resin composition which develops excellent thermal conductivity and peelability after curing.

The thermally conductive moisture-curable resin composition contains the following components (A) to (C): component (A): an organic polymer containing two or more hydrolyzable silyl groups; component (B): a thermally conductive filler; and component (C): a silicone compound having a polar group and/or a polar chain at a terminal or a side chain.

The present disclosure relates to an adhesive printing form attachment layer comprising a support, and a permanently sticky layer suitable for receiving a printing form and fixing a printing form during a printing operation provided on the support, wherein the permanently sticky layer comprises a crosslinked silicone-based material. The present disclosure further relates to a method for preparing an adhesive printing form attachment layer, as well as a printing cylinder comprising it, the use of the an adhesive printing form attachment layer for fixing a flexographic printing plate during a printing operation on a printing cylinder, and a method of operating a printing machine wherein the adhesive printing form attachment layer is used.

A curable composition comprising: a hydroxy-functional or ether-functional (meth)acrylate copolymer, an epoxy resin; water, a photocatalyst, and optionally a polyvinyl acetal polymer and/or a film-forming polymer. When cured, provides structural bonding adhesives that are curable under high humidity conditions.