An adhesive composition and a polarizing plate including an adhesive layer formed using the same are disclosed herein. In some embodiments, an adhesive composition includes 3-ethyl-3-(2-ethylhexyloxy)methyloxetane, 3-ethyl-3-hydroxymethyloxetane, 3,3-oxybis(methylene)bis(3-ethyloxetane), an acryl-based compound, an aromatic epoxy compound, and an alicyclic epoxy compound, wherein the 3-ethyl-3-(2-ethylhexyloxy)methyloxetane is present in an amount of 20 parts by weight to 40 parts by weight, the 3-ethyl-3-hydroxymethyloxetane is present in 2 parts by weight to 8 parts by weight, the 3,3-oxybis(methylene)bis(3-ethyloxetane) is present in 2 parts by weight to 8 parts by weight, the acryl-based compound is present in 5 parts by weight to 20 parts by weight, the aromatic epoxy compound is present in 7 parts by weight to 40 parts by weight, and the alicyclic epoxy compound is present in 10 parts by weight to 50 parts by weight, based on 100 parts by weight of the adhesive composition.

Provided is a reaction-curable adhesive that exhibits an excellent adhesive strength even under a low-temperature environment. The reaction-curable adhesive includes an epoxy compound and an amine compound, the reaction-curable adhesive being cured through a reaction between the epoxy compound and the amine compound, in which a compound having a specific molecular structure is used as at least one of the epoxy compound or the amine compound.

Several embodiments of the present technology are directed to bonding sheets having enhanced plasma resistant characteristics, and being used to bond to semiconductor devices. In some embodiments, a bonding sheet in accordance with the present technology comprises a base bond material having one or more thermal conductivity elements embedded therein, and one or more etched openings formed around particular regions or corresponding features of the adjacent semiconductor components. The bond material can include PDMS, FFKM, or a silicon-based polymer, and the etch resistant components can include PEEK, or PEEK-coated components.

The acrylic composition for sealing contains an acrylic compound, a polyphenylene ether resin including a radical-polymerizable substituent at a terminal, an inorganic filler, a thermal radical polymerization initiator, and a thermoplastic resin.

The invention relates to a label which is attachable to object surfaces and to a manufacturing method thereof, the label comprising a pressure sensitive adhesive layer having a coat weight equal to or higher than 10 g/m.sup.2 and wherein the adhesive layer has a composition which is free of alkylphenol ethoxylate and has been selected to comprise emulsion polymerized, water-dispersible acrylate polymer and non-ionic copolymer based on polyethylene glycol and polypropylene glycol such that when the adhesive layer is subjected to paper recycling process conditions, the adhesive layer resists disintegration into small fragments.

A polymer composition includes at least one poly(aryl ether ketone) (PAEK) component and at least one low molecular weight aromatic compound. A polymer metal junction including the polymer composition and a method of making a polymer metal junction are also described.

A disintegrable film is disclosed, including at least one water-soluble polymer having a molecular weight greater than about 700 kDa, and at least one water-soluble plasticizer having a molecular weight less than about 0.8 kDa. A further disintegrable film is disclosed wherein the disintegrable film is a tacky adhesive film, includes a storage modulus of about 310.sup.6 dyn/cm.sup.2 or less at 1 rad/s and 25 C., includes a disintegration resistance factor sufficient to resist disintegration for a disintegration time after contact with a disintegrating fluid, includes a tan evaluated at an angular frequency of 0.01 rad/s and 25 C. of less than about 1, the at least one water-soluble polymer constitutes between about 3 wt % to about 70 wt % of the disintegrable film, and the at least one water-soluble plasticizer constitutes between about 30 wt % to about 60 wt % of the disintegrable film.

The present invention refers to a formulation suitable for the manufacture of a pressure sensitive adhesive, said formulation comprising: a) 40-95 wt % of polyalkylene carbonate having a number average molecular weight higher than 17.000 Da; b) 5-60 wt % of a polyether carbonate polyol having CO.sub.2 groups randomly incorporated in the chemical structure thereof, wherein the content of CO.sub.2 ranges from 0.5 to 40 wt %, based on the total weight of the polyether carbonate polyol; and c) optionally, less than 30 wt % of a tackifying resin, provided that said formulation does not contain any reticulating agent.

The present invention refers to a formulation suitable for the manufacture of a pressure sensitive adhesive, said formulation comprising: a) 40-95 wt % of polyalkylene carbonate having a number average molecular weight higher than 17.000 Da; b) 5-60 wt % of a polyether carbonate polyol having CO.sub.2 groups randomly incorporated in the chemical structure thereof, wherein the content of CO.sub.2 ranges from 0.5 to 40 wt %, based on the total weight of the polyether carbonate polyol; and c) optionally, less than 30 wt % of a tackifying resin, provided that said formulation does not contain any reticulating agent.

Flexible films of thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces, the materials are particularly useful in bonding together dissimilar substrates.