The present disclosure relates to an adhesive composition comprising a urethane polymer; an acryl-based polymer; and a curing agent, wherein the acryl-based polymer comprises a (meth)acrylate monomer comprising silicone; and a (meth)acrylate monomer comprising a hydroxyl group as a monomer unit, a surface protective film, and a method for manufacturing an organic light emitting electronic device.

The present disclosure relates to an adhesive composition comprising a urethane polymer; an acryl-based polymer; and a curing agent, wherein the acryl-based polymer comprises a (meth)acrylate monomer comprising silicone; and a (meth)acrylate monomer comprising a hydroxyl group as a monomer unit, a surface protective film, and a method for manufacturing an organic light emitting electronic device.

The present invention is related to a high frequency easy melting multiple layered structure, which includes a high frequency easy melting coating layer; a high frequency easy melting adhesive layer installed below the high frequency easy melting coating layer and a high frequency easy melting thermoplastic polyurethane (TPU) substrate placed below the high frequency easy melting adhesive layer. They serve to reduce the energy and time period in the high frequency melting and connection so as to promote producing speed and capacity effectively.

The present invention relates to a process for bonding substrates, wherein the bond is a bond that can be released by heat treatment at a temperature of 50° C. to less than 200° C. and a composition is used to produce the bond, said composition containing a polymer of formula (I): Q-(O—C(O)—CR′R″—C(O)—R).sub.x, where: Q=a polymer group, selected from a polyester group and/or a polyolefin group, wherein the polymer group does not contain any components that result from the use of molecules having (meth)acrylic acid units as monomers; x is greater than or equal to 1; R.sup.1=R.sup.2 or O—R.sup.3; R2=a hydrocarbon group, which can be substituted with halogen atoms, comprising 1 to 10 carbon atoms; R3=a hydrocarbon group, which can be substituted with halogen atoms, comprising 1 to 10 carbon atoms, or a polymer group; R′=—H, or a hydrocarbon group, which can be substituted with halogen atoms, comprising 1 to 10 carbon atoms, or a group of formula (II): —C(O)—NH-Q′, where Q′=an organic group which can also have one or more silicon atoms; and R″=—H or a group of formula (II), with the proviso that if neither of the groups R′ and R″ is a group of formula (II), then at least one of the groups R′ or R″ is —H.

Described herein is a polyester polyol, which is derived from a first reaction product of (a) a Component A, wherein the Component A is a phthalic acid, a phthalic anhydride or mixtures thereof, (b) a Component B, wherein the Component B is a dimer fatty acid, a dimer fatty acid diol or mixtures thereof, and (c) a Component C, wherein the Component C is an aliphatic diol, an aromatic diol, or mixtures thereof, wherein Component C comprises 2 to 10 carbon atoms and optionally catenated heteroatoms selected from O, S, and N. Also disclosed herein are polyurethane polymers and pressure sensitive adhesives made from the polyurethane polymers or the polyester polyols.

The present disclosure relates to a surface protective film and a method for manufacturing an organic light emitting electronic device.

The present disclosure relates to a surface protective film and a method for manufacturing an organic light emitting electronic device.

Disclosed is a composition for reactive hot melt resin and a reactive hot melt film prepared from the resin, which resin composition includes a polyurethane resin having a linear structure, an isocyanate blocking agent having a plurality of functional groups, a reaction catalyst, a reaction retardant, etc. Preferably, the resin composition includes a polyurethane resin and an isocyanate blocking agent used as a latent curing agent, which are main components; a catalyst for accelerating the reaction; and a reaction retardant for securing long-term storability. Particularly, the composition for reactive hot melt resin further includes a heat-resistance enhancer, preferably nanosilica, for preventing the resin from melting down during no-sew press treatment to provide a performance to help maintenance of adhesion.

Provided is a low temperature rapid curing type low elastic conductive adhesive which is useful as a conductive adhesive for component mounting in a field of FHE. A conductive resin composition contains (A) at least two types of urethane acrylate oligomers, (B) a radical polymerizable monomer, (C) a free radical generation curing agent, and (D) conductive particle. In the conductive resin composition, the component (A) preferably contains a high molecular weight urethane acrylate oligomer having a weight average molecular weight of 10,000 or more (A1), and a low molecular weight urethane acrylate oligomer having a weight average molecular weight of 9,999 or less (A2).

Provided is a low temperature rapid curing type low elastic conductive adhesive which is useful as a conductive adhesive for component mounting in a field of FHE. A conductive resin composition contains (A) at least two types of urethane acrylate oligomers, (B) a radical polymerizable monomer, (C) a free radical generation curing agent, and (D) conductive particle. In the conductive resin composition, the component (A) preferably contains a high molecular weight urethane acrylate oligomer having a weight average molecular weight of 10,000 or more (A1), and a low molecular weight urethane acrylate oligomer having a weight average molecular weight of 9,999 or less (A2).