The invention relates to a method for protecting an electronic arrangement which is disposed on a substrate and comprises organic constituents, where a cover is applied to the electronic arrangement in such a way that the electronic arrangement is at least partly covered by the cover, the cover being bonded at least over a partial area to the substrate and/or to the electronic arrangement, the adhesive bond being produced by means of at least one layer of an adhesive in an adhesive tape, characterized in that the adhesive comprises a getter material which is capable of at least one permeable substance, the getter material being present in the adhesive in a proportion of not more than 2 wt %, based on the adhesive with the getter material.

The present invention provides an adhesive composition for a flexible printed wiring board containing (A) an epoxy resin; (B) no phosphorus-containing epoxy resin; and (C) a polyamide-imide resin.

A method for manufacturing a smart card capable of achieving excellent connection reliability and bending resistance, a smart card, and a conductive particle-containing hot-melt adhesive sheet. A conductive particle-containing hot-melt adhesive sheet containing solder particles of a non-eutectic alloy in a binder containing a crystalline polyamide having a carboxyl group is interposed between a card member and an IC chip and subjected to thermocompression bonding. The crystalline polyamide having a carboxyl group improves the solder wettability of the non-eutectic alloy, thereby achieving excellent connection reliability. This effect is considered to be a flux effect due to the carboxyl group present in the crystalline polyamide, and as a result, it is possible to prevent the decrease in the elastic modulus of the adhesive layer which would be caused by the addition of a flux compound and to achieve excellent bending resistance.

A pressure relief cushion includes an elastic layer which is made from a viscoelastic foam material, an adhesive carrying layer disposed on the elastic layer and including an adhesive portion and a carrier portion for carrying the adhesive portion, a hydrogel layer disposed on the adhesive carrying layer opposite to the elastic layer, and a detachable film disposed on the hydrogel layer opposite to the adhesive carrying layer.

A multi-phasic polymer blend for energy activated edge banding adhesion to a substrate is described. While the blend may be used for adhering edge banding to straight substrates, the blend is preferred for adhering edge banding to contoured substrates. The outer, hard, structural layer of the edge banding is formed from a polypropylene component. The polypropylene component at least includes polypropylene and an optional energy adsorber. The inner adhesion layer of the edge banding is formed from a multi-phasic polymer blend that bonds the outer layer of the edge banding to the substrate. The multi-phasic polymer blend at least includes a polyamide component, a polyolefin component, and a modified polypropylene component. Both the outer and inner layers forming the edge banding may be tinted to conform or contrast with the color of the finished substrate.

Disclosed is an environment-friendly hot-melt composition for a vehicle interior material, the hot-melt composition including: 65 wt % to 85 wt % of an aromatic polyamide; 10 wt % to 30 wt % of an aliphatic polyamide; 1 wt % to 5 wt % of an olefinic elastomer graft-polymerized with maleic anhydride; and 0.1 wt % to 2 wt % of an antioxidant.

Disclosed is an environment-friendly hot-melt composition for a vehicle interior material, the hot-melt composition including: 65 wt % to 85 wt % of an aromatic polyamide; 10 wt % to 30 wt % of an aliphatic polyamide; 1 wt % to 5 wt % of an olefinic elastomer graft-polymerized with maleic anhydride; and 0.1 wt % to 2 wt % of an antioxidant.

A method for manufacturing a smart card capable of achieving excellent connection reliability and bending resistance, a smart card, and a conductive particle-containing hot-melt adhesive sheet. A conductive particle-containing hot-melt adhesive sheet containing solder particles of a non-eutectic alloy in a binder containing a crystalline polyamide having a carboxyl group is interposed between a card member and an IC chip and subjected to thermocompression bonding. The crystalline polyamide having a carboxyl group improves the solder wettability of the non-eutectic alloy, thereby achieving excellent connection reliability. This effect is considered to be a flux effect due to the carboxyl group present in the crystalline polyamide, and as a result, it is possible to prevent the decrease in the elastic modulus of the adhesive layer which would be caused by the addition of a flux compound and to achieve excellent bending resistance.

A method for manufacturing a battery cell stack according to exemplary embodiments of the present invention includes an application step of spraying an adhesive resin composition on one surface of a battery cell in one direction by a plurality of nozzles, wherein the nozzles are disposed in a direction different from the one direction, and at least two nozzles of the plurality of nozzles apply the adhesive resin composition in amounts different from each other. Thereby, the adhesive resin composition is applied to one surface of a non-flat battery cell, and the application amount is controlled according to portions to be applied, so that the one surface may bring into contact with another surface of another battery cell adhered thereon over an entire area in which the adhesive resin composition is applied.

Branched amorphous polyamide (co)polymers having a backbone formed by reacting a reaction mixture including at least 25 mol % of a di-amine selected from a secondary di-amine, a branched di-amine, or a combination thereof; and an aliphatic acid blend including a branched aliphatic dimer acid and a branched aliphatic trimer acid. The molar equivalent ratio of the di amine to the aliphatic acid blend is 0.9-1.1. Preferably, the branched amorphous polyamide (co)polymer is not telechelic. The branched amorphous polyamide (co)polymer preferably exhibits one or more of a shear modulus of from 10,000 to 500,000 Pa at 70 C., a complex viscosity of greater than 1,000,000 mPa*s at 70 C., a glass transition temperature of less than 25 C., or a number average molecular weight of greater than 10,000 Da. Biodegradable and/or compostable adhesive articles including the branched amorphous polyamide (co)polymer also are disclosed.