A multi-phasic polymer blend for energy activated edge banding adhesion to a substrate is described. While the blend may be used for adhering edge banding to straight substrates, the blend is preferred for adhering edge banding to contoured substrates. The outer, hard, structural layer of the edge banding is formed from a polypropylene component. The polypropylene component at least includes polypropylene and an optional energy adsorber. The inner adhesion layer of the edge banding is formed from a multi-phasic polymer blend that bonds the outer layer of the edge banding to the substrate. The multi-phasic polymer blend at least includes a polyamide component, a polyolefin component, and a modified polypropylene component. Both the outer and inner layers forming the edge banding may be tinted to conform or contrast with the color of the finished substrate.

[Object]

The present invention provides a curable resin composition useful for imparting high durability and adhesion to a substrate such as a metal.

[Solution]

A curable resin composition is prepared by combining a polyamide-based resin (A) having an amino group, a blocked polyisocyanate (B), and an epoxy compound (C). The polyamide-based resin (A) contains a polyamide-based resin (A1) having a melting point of 170° C. or higher and a polyamide-based resin (A2) having a melting point of 150° C. or lower. The mass ratio of the polyamide-based resin (A1) and the polyamide-based resin (A2) is, in the form of the former/the latter, from 65/35 to 35/65.

[Object]

The present invention provides a curable resin composition useful for imparting high durability and adhesion to a substrate such as a metal.

[Solution]

A curable resin composition is prepared by combining a polyamide-based resin (A) having an amino group, a blocked polyisocyanate (B), and an epoxy compound (C). The polyamide-based resin (A) contains a polyamide-based resin (A1) having a melting point of 170° C. or higher and a polyamide-based resin (A2) having a melting point of 150° C. or lower. The mass ratio of the polyamide-based resin (A1) and the polyamide-based resin (A2) is, in the form of the former/the latter, from 65/35 to 35/65.

The present disclosure relates to a resin composition for semiconductor adhesion comprising: a thermoplastic resin; a thermosetting resin; a curing agent; and a curing catalyst compound having a specific structure, and an adhesive film for semiconductor, a method for manufacturing a semiconductor package, and a semiconductor package using the same.

A multi-phasic polymer blend for energy activated edge banding adhesion to a substrate is described. While the blend may be used for adhering edge banding to straight substrates, the blend is preferred for adhering edge banding to contoured substrates. The outer, hard, structural layer of the edge banding is formed from a polypropylene component. The polypropylene component at least includes polypropylene and an optional energy adsorber. The inner adhesion layer of the edge banding is formed from a multi-phasic polymer blend that bonds the outer layer of the edge banding to the substrate. The multi-phasic polymer blend at least includes a polyamide component, a polyolefin component, and a modified polypropylene component. Both the outer and inner layers forming the edge banding may be tinted to conform or contrast with the color of the finished substrate.

Disclosed herein are improved methods for bonding textiles using an adhesive composition.

Provided is an adhesive composition including lysine, oxaloacetic acid, and water, wherein the lysine and the oxaloacetic acid are present in the form of an aqueous salt solution and do not form precipitates in the aqueous solution.

Provided are a breathable waterproof membrane capable of being thermally-bonded to a fabric by using a hot melt adhesive that is dot-coated on the surface thereof, and a method of manufacturing the same. In particular, the present invention relates to a breathable waterproof membrane capable of being thermally-bonded to a fabric and a method of manufacturing the same, the membrane being applied to the manufacture of outdoor clothing, thereby giving excellent breathability and waterproof properties to the outdoor clothing and simplifying a manufacturing process of the outdoor clothing.

Disclosed herein are improved methods for bonding textiles using an adhesive composition.

A process for preparing a printed rigid plastic substrate is described, the process comprising: providing a rigid plastic substrate comprising a primer on a surface of the rigid plastic substrate, the primer comprising a primer resin; printing a liquid electrophotographic ink composition comprising a thermoplastic resin onto the primer on the surface of the rigid plastic substrate; depositing a cross-linking composition comprising a cross-linker onto the printed electrophotographic ink composition disposed on the primer; and laminating the rigid plastic substrate with a flexible film such that the ink composition and the cross-linker are disposed between the rigid substrate and the flexible film and wherein the lamination of the rigid substrate with the flexible film causes cross-linking of the thermoplastic resin of the ink composition and of the primer resin.