Disclosed is a composition that comprises or is produced from a first ethylene -olefin copolymer, a modified first ethylene -olefin copolymer, and a second ethylene -olefin copolymer or propylene -olefin copolymer. Also disclosed is a multilayer film or sheet structure containing at least one barrier layer; at least one predominantly propylene-based layer, at least one predominantly ethylene-based layer, or both; and at least one adhesive layer produced from the composition. Further disclosed is a produced for producing a multilayer structure using the composition as adhesive layer.

An adhesive composition including predominantly one or two polyamide(s) having units chosen from: at least one unit denoted A with a mean number of carbon atoms per nitrogen atom, denoted CA, ranging from 4 to 8.5, advantageously from 4 to 7; at least one unit denoted B with a mean number of carbon atoms per nitrogen atom, denoted CB, ranging from 7 to 10, advantageously from 7.5 to 9.5; at least one unit denoted C with a mean number of carbon atoms per nitrogen atom, denoted CC, ranging from 9 to 18, advantageously from 10 to 18, and to the use thereof.

An adhesive composition is provided which exhibits not only adhesiveness to a polyimide film or copper foil, but also high adhesiveness to gold-plated copper foil, and is also superior in heat resistance such as soldering heat resistance.

The adhesive composition comprises a solvent-soluble polyamide resin (A) which is solid at 25 C., an epoxy resin (B), and an imidazole compound (C) having an alkoxysilyl group, wherein the mass ratio (A)/(B) of the component (A) to the component (B) is 99/1-50/50, and the content of the component (C) is 0.3-5 parts by mass with respect to 100 parts by mass of the total of the component (A) and the component (B).

An adhesive composition is provided which exhibits not only adhesiveness to a polyimide film or copper foil, but also high adhesiveness to gold-plated copper foil, and is also superior in heat resistance such as soldering heat resistance.

The adhesive composition comprises a solvent-soluble polyamide resin (A) which is solid at 25 C., an epoxy resin (B), and an imidazole compound (C) having an alkoxysilyl group, wherein the mass ratio (A)/(B) of the component (A) to the component (B) is 99/1-50/50, and the content of the component (C) is 0.3-5 parts by mass with respect to 100 parts by mass of the total of the component (A) and the component (B).

A sealant structure and a method of fabricating a display panel are provided. The sealant structure includes a plurality of adhesive strips, and the adhesive strips overlap end to end to form a closed loop. Ends of at least one of any two adjacent adhesive strips are provided with an overlap region, and a width of the overlap region is less than or equal to one third of a width of the adhesive strip provided with the overlap region.

The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.

An adhesive film can include a barrier layer and an adhesive layer. In an embodiment, the barrier layer can have a melting temperature of at least 230 C. and the adhesive layer having a melting temperature of no greater than 200 C. In an embodiment, an article can include the adhesive film bonded to a substrate.

An adhesive composition including predominantly one or two polyamide(s) having units chosen from: at least one unit denoted A having an average number of carbon atoms per nitrogen atom, denoted C.sub.A, ranging from 4 to 8.5, advantageously from 4 to 7; at least one unit denoted B having an average number of carbon atoms per nitrogen atom, denoted C.sub.B, ranging from 7 to 10, advantageously from 7.5 to 9.5; and at least one unit denoted C having an average number of carbon atoms per nitrogen atom, denoted C.sub.C, ranging from 9 to 18, advantageously from 10 to 18, and to the use thereof.

Disclosed are a conductive hot melt adhesive, a conductive insulating tape, and a battery, where the conductive hot melt adhesive includes a matrix and a conductive filler. A Vicat softening temperature of the conductive hot melt adhesive ranges from 60? C. to 130? C., and the conductive hot melt adhesive is solid in a first state and may soften and flow in a second state. The conductive hot melt adhesive is disposed between a positive electrode component and a negative electrode component of a battery. When a temperature is lower than the Vicat softening temperature of the conductive hot melt adhesive, the positive and negative electrode components cannot be conducted via the conductive hot melt adhesive; when the temperature is higher than the Vicat softening temperature, the conductive hot melt adhesive softens and flows, thereby conducting the positive and negative electrode components.

The invention concerns a linerless self-adhesive material obtained starting from a self-adhesive material with a liner, by means of a process that comprises the delamination of the liner from a self-adhesive layer, activation of the liner or self- adhesive layer, transferral of the liner over the self-adhesive layer and re-lamination of the two components so as to produce the linerless self-adhesive material. The liner or the self-adhesive layer is coated with a thermo-adhesive that allows for permanent lamination of the liner located on the self-adhesive layer.