The polyamic acid composition according to the present disclosure comprises a polyamic acid. The monomers constituting the polyamic acid include, relative to the total monomers, 30-95 mol % of monomer (A) that has a diphenyl ether skeleton represented by general formula (1) or (2) but no benzophenone skeleton, and 0-5 mol % of monomer (B) that has a benzophenone skeleton. The diamines constituting the polyamic acid include aromatic diamine (?1) that has a diphenyl ether skeleton represented by general formula (2) and aliphatic diamine (?2) represented by general formula (3) or (4), and the molar ratio b/a of the diamines b to tetracarboxylic dianhydride a constituting the polyamic acid is 0.90-0.999.

A semiconductor package includes a semiconductor die, a substrate for supporting the semiconductor die, an encapsulant covering the semiconductor die and at least part of the substrate, and a die attach material attaching the semiconductor die to the substrate. The die attach material includes molecules having a first functional group with at least one free electron pair and a second functional group chemically reacted or reactable with the encapsulant in a way that promotes adhesion with the encapsulant. A corresponding method of manufacturing the semiconductor package is also described.

A semiconductor package includes a semiconductor die, a substrate for supporting the semiconductor die, an encapsulant covering the semiconductor die and at least part of the substrate, and a die attach material attaching the semiconductor die to the substrate. The die attach material includes molecules having a first functional group with at least one free electron pair and a second functional group chemically reacted or reactable with the encapsulant in a way that promotes adhesion with the encapsulant. A corresponding method of manufacturing the semiconductor package is also described.

Adhesive composition including an elastomeric silicone-based copolymer selected from the group consisting of urea-based silicone copolymers, oxamide-based silicone copolymers, amide-based silicone copolymers, urethane-based silicone copolymers and mixtures thereof; and greater than 0% by weight and no more than 20% by weight of MQ resin. In certain embodiments, the adhesive compositions includes less than 10% by weight of MQ resin. In some illustrative embodiments, the adhesive composition is a pressure-sensitive adhesive. In certain illustrative embodiments, the pressure sensitive adhesive is optically clear, self-wetting to the end-use substrate, and stretch releasable. In certain such embodiments, the adhesive article exhibits a 180 PEEL ADHESION to a glass substrate no greater than about 500 N/dm after aging for seven days at 85 C. The pressure sensitive adhesive compositions may be used to form adhesive articles and adhesive assemblies.

A method for sealing a container having an opening by contacting the opening with a mixture including a phenethylamine and a first polymer, adding a fluid to be contained to the container, and then adding a second mixture, comprising a second polymer, whereupon an interaction between the first and second polymer mixtures result in a seal being formed over the opening, thereby containing the fluid. The first polymer is typically a water-swellable polymer and the second polymer is typically a hydrophilic polymer that will form an interpenetrating network with the swellable polymer.

The present invention provide an adhesive composition which is suitable for laminating a polyimide film with a copper foil in a double-sided flexible copper-clad laminate to be used for a flexible printed wiring board. The adhesive composition comprises a polyamide-imide resin, an epoxy resin, and a phosphorus-type flame retardant, wherein 15 to 40 parts by mass of the epoxy resin is compounded to 85 to 60 parts by mass of the polyamide-imide resin; a glass transition temperature of the polyamide-imide resin is 250 C. or higher; an acid value of the polyamide-imide resin is 50 to 150 mgKOH/g; the epoxy resin is liquid at 25 C.; 15 to 60 parts by mass of the phosphorus-type flame retardant is compounded to 100 parts by mass in total of the polyamide-imide resin and the epoxy resin; and 50% by mass or more of the phosphorus-type flame retardant is a phosphinic acid derivative of a phenanthrene type.

The present invention provide an adhesive composition which is suitable for laminating a polyimide film with a copper foil in a double-sided flexible copper-clad laminate to be used for a flexible printed wiring board. The adhesive composition comprises a polyamide-imide resin, an epoxy resin, and a phosphorus-type flame retardant, wherein 15 to 40 parts by mass of the epoxy resin is compounded to 85 to 60 parts by mass of the polyamide-imide resin; a glass transition temperature of the polyamide-imide resin is 250 C. or higher; an acid value of the polyamide-imide resin is 50 to 150 mgKOH/g; the epoxy resin is liquid at 25 C.; 15 to 60 parts by mass of the phosphorus-type flame retardant is compounded to 100 parts by mass in total of the polyamide-imide resin and the epoxy resin; and 50% by mass or more of the phosphorus-type flame retardant is a phosphinic acid derivative of a phenanthrene type.

A mixed binder which includes a polyacrylic acid and a polyimide. The mixed binder is configured to bind an anode and a current collector in an electrode. The mixed binder is also configured to come into contact with an electrolyte solution in the electrode.

A method for sealing a container having an opening by contacting the opening with a mixture including a phenethylamine and a first polymer, adding a fluid to be contained to the container, and then adding a second mixture, comprising a second polymer, whereupon an interaction between the first and second polymer mixtures result in a seal being formed over the opening, thereby containing the fluid. The first polymer is typically a water-swellable polymer and the second polymer is typically a hydrophilic polymer that will form an interpenetrating network with the swellable polymer.

The present disclosure relates generally to the field of adhesives, more specifically to the field of structural adhesive tapes, in particular for use in bonding metal parts. The present disclosure also relates to a method of bonding two parts and to a composite article. The present disclosure is further directed to the use of a structural adhesive tape for industrial applications, such as construction and automotive applications, in particular for body-in-white bonding applications in the automotive industry.