A composition is composed mainly of: a component (I) (which is at least one selected from polyether ketone, polyether ether ketone, and polyether ketone ketone); a component (II) (which is polyphenylene sulfide); and, additionally if necessary, a component (III) (which is at least one selected from polyether imide, polyimide, polyamide imide, and polysulfone resins) and (IV) an inorganic filler. The composition is obtained using a conventional melt-kneading machine, for example, a single screw or twin screw extruder, Banbury mixer, or kneader in accordance with the melt-kneading method corresponding to the kneading machine. The resin composition for metal bonding has excellent metal bonding properties, and is applicable for use in automobile parts that require the composition to be bonded with metal and in electronic products such as laptop computers and mobile phones.

A composition is composed mainly of: a component (I) (which is at least one selected from polyether ketone, polyether ether ketone, and polyether ketone ketone); a component (II) (which is polyphenylene sulfide); and, additionally if necessary, a component (III) (which is at least one selected from polyether imide, polyimide, polyamide imide, and polysulfone resins) and (IV) an inorganic filler. The composition is obtained using a conventional melt-kneading machine, for example, a single screw or twin screw extruder, Banbury mixer, or kneader in accordance with the melt-kneading method corresponding to the kneading machine. The resin composition for metal bonding has excellent metal bonding properties, and is applicable for use in automobile parts that require the composition to be bonded with metal and in electronic products such as laptop computers and mobile phones.

The invention relates to a composition comprising a sulfone-group containing resin obtainable by reaction of a polyamine containing at least one sulfone-group with a polyepoxide and optionally a hardener, as well as adhesives and coating compositions comprising said compositions having gas-barrier properties, methods for bonding substrates using said adhesives and the thus obtained articles as well as the use of the compositions described herein as adhesive or coatings having gas-barrier properties.

A sealant structure and a method of fabricating a display panel are provided. The sealant structure includes a plurality of adhesive strips, and the adhesive strips overlap end to end to form a closed loop. Ends of at least one of any two adjacent adhesive strips are provided with an overlap region, and a width of the overlap region is less than or equal to one third of a width of the adhesive strip provided with the overlap region.

Disclosed is a layered body comprising a polymer comprising repeating units having the general structure CH.sub.2CHR.sup.1COOR.sup.2 as defined herein, to a process for producing such a layered body, to a layered body produced by that process and to the use of a layered body for electrophysical measurements.

Described herein are methods of forming uncured sealant assemblies and also methods of forming seals between various parts using such assemblies. In some examples, an uncured sealant assembly comprises two protective layers and an uncured sealant layer, disposed in between. The uncured sealant assembly is stored and provided at a cure-inhibiting temperature, selected to minimize the curing rate of the uncured sealant layer. The size and the shape of the uncured sealant layer are specifically selected to ensure the complete coverage of the faying surfaces, filling of all gaps and voids between the faying surfaces, and controlling the shape and size of uncured sealant squeeze out between the faying surfaces. In some examples, the size and shape of the uncured sealant layer maybe be specifically selected to have no uncured sealant squeeze out between parts.

A liquid crystal cell according to the present invention includes a TFT board including a first dielectric substrate, TFTs supported by the first dielectric substrate, and patch electrodes, a slot board including a second dielectric substrate and a slot electrode having slots and supported by the second dielectric substrate, and a liquid crystal layer LC between the TFT board and the slot board, which are positioned with the patch electrodes and the slot electrode facing each other, and a sealant disposed between the TFT board and the slot board and surrounding the liquid crystal layer. The liquid crystal layer LC includes a liquid crystal compound containing an isothiocyanate group. The sealant includes an ene-thiol compound in which an ene compound and a thiol compound are bonded by using a radical.

A semiconductor package includes a semiconductor die, a substrate for supporting the semiconductor die, an encapsulant covering the semiconductor die and at least part of the substrate, and a die attach material attaching the semiconductor die to the substrate. The die attach material includes molecules having a first functional group with at least one free electron pair and a second functional group chemically reacted or reactable with the encapsulant in a way that promotes adhesion with the encapsulant. A corresponding method of manufacturing the semiconductor package is also described.

Provided is a process for producing a surface-metalized polymer article, comprising: (a) preparing a graphene dispersion comprising multiple graphene sheets and an optional conductive filler dispersed in a first liquid medium, which is an adhesive monomer or contains a liquid adhesive monomer, oligomer or polymer dissolved in a solvent; (b) bringing a polymer article into a graphene deposition zone, wherein the graphene dispersion is sprayed, painted, coated, cast, or printed to deposit graphene sheets and optional conductive filler to a surface of the polymer article; and (c) moving the graphene-coated polymer article into a metallization chamber which accommodates a plating solution therein for plating a layer of a desired metal onto the graphene-coated polymer article to obtain a surface-metalized polymer article and retreating the surface-metalized polymer article from the metallization chamber.

A semiconductor package includes a semiconductor die, a substrate for supporting the semiconductor die, an encapsulant covering the semiconductor die and at least part of the substrate, and a die attach material attaching the semiconductor die to the substrate. The die attach material includes molecules having a first functional group with at least one free electron pair and a second functional group chemically reacted or reactable with the encapsulant in a way that promotes adhesion with the encapsulant. A corresponding method of manufacturing the semiconductor package is also described.