Disclosed is a method of making an optoelectronic device that incorporates a crosslinked resin-linear polyorganosiloxane.

Disclosed is an adhesive film. The adhesive film has a silicone adhesive layer on one surface or both surfaces of a substrate film. A silicone adhesive material is used to form the silicone adhesive layer. The silicone adhesive material has 120 to 380% of an elongation at break (tensile speed of 300 mm/min, temperature of 25° C.) specified in JIS K 6251, and 1.8×10.sup.5 to 4.5×10.sup.5 Pa of a shear storage modulus (frequency of 10 Hz, temperature of 25° C.). The adhesive film generally has good wettability to the surface of an adherend and in general can be easily attached without creating air bubbles, to the extent that, even if air bubbles are created, the air bubbles can be easily dissipated. Further, even though the adhesive film is generally not easily peeled, peeling is generally possible with a small adhesive force during high speed peeling.

The present disclosure relates to an adhesive film, and adhesive film includes: a photothermal conversion layer including a light absorbing agent and a pyrolytic resin; an adhesive base film layer disposed on the photothermal conversion layer; a buffer layer disposed on the adhesive base film layer; and an adhesive layer disposed on the buffer layer, and the buffer layer includes a polysiloxane resin, and the adhesive layer includes a silicon-based adhesive, and the silicon-based adhesive includes a silicon-based tackifier and a polysiloxane resin. The adhesive film according to the present disclosure can simplify a process of processing a substrate, and can prevent a damage of the substrate and a circuit or an element formed on the substrate.

The invention discloses a high performance plastic magnetic material, comprising a low surface energy layer, a magnetic layer and a printable layer, wherein the magnetic layer and the printable layer are arranged successively on a first side of the low surface energy layer; the low surface energy layer is an organic silicon pressure sensitive adhesive layer. The invention further discloses a preparation method, comprising the following steps: pretreating a magnetic powder with a coupling agent; mixing the pretreated magnetic powder with matrix components and auxiliaries to gain a mixture; extrusion compositing the gained mixture with a printable layer to gain composite paper having the printable layer and a magnetic layer; and applying a low surface energy layer on a side of the magnetic layer, opposite the printable layer. As no UV layer and no adhesive residue, the material of the invention is environmentally friendly and highly reliable.

Articles and methods of making articles are described. In one embodiment, an electrode is described, comprising an ionically-conductive hydrogel layer comprising a first major surface and opposing major surface. The electrode further comprises a discontinuous primer layer disposed on the first major surface ionically-conducting hydrogel layer and an electrically conductive member or a connector component thereof, in contact with the first major surface of the ionically-conducting hydrogel layer. In another embodiment, an article is described comprising a hydrogel layer comprising a first major surface and opposing major surface; a discontinuous hydrophobic primer layer disposed on the first hydrogel layer; and a hydrophobic adhesive or hydrophobic backing bonded to the primer and discontinuous hydrophobic primer layer of the hydrogel.

The present disclosure provides 1k high temperature debondable adhesives for use in the temporary attachment of one substrate to another substrate. The adhesives composition comprising(a) 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane, or the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H groups, or a mixture of a hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H groups and a hydrosilation reaction product of the reaction between the vinyl groups on vinyl polysiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H groups, and (b) mercapto-crosslinker. The adhesive composition is cured by UVNis/LED or thermal or combined and is cured faster requiring lower energy. The present disclosure also provides assemblies including such an adhesive and methods of using the adhesives.

Provided herein are multilayer tape constructions comprising a damping layer and a bonding layer, wherein the multilayer tape construction effectively dissipates vibrations at low temperatures. The materials and configurations of the layers are selected such that the glass transition temperature of the bonding layer is greater than the glass transition of the damping layer, and the difference between the glass transition temperatures is related to the relative thicknesses of the damping layer and the bonding layer. The multilayer tape constructions may further comprise a carrier layer. Also provided are systems and methods using the disclosed multilayer tape constructions.

Siloxane-based gel adhesives with improved shear holding power are prepared from curable compositions. The curable compositions include a siloxane fluid with a viscosity of at least 1,000,000 centiPoise, a siloxane-(meth)acrylate co-polymer, and siloxane tackifying resin. The curable compositions can contain an initiator or can be cured by e-beam radiation without an initiator. The siloxane-(meth)acrylate copolymer is the reaction product of a reaction mixture of an ethylenically unsaturated siloxane-containing macromer, an alkyl (meth)acrylate monomer; optionally a reinforcing monomer, and an initiator.

Siloxane-based gel adhesives with improved shear holding power are prepared from curable compositions. The curable compositions include a siloxane fluid with a viscosity of at least 1,000,000 centiPoise, a siloxane-(meth)acrylate co-polymer, and siloxane tackifying resin. The curable compositions can contain an initiator or can be cured by e-beam radiation without an initiator. The siloxane-(meth)acrylate copolymer is the reaction product of a reaction mixture of an ethylenically unsaturated siloxane-containing macromer, an alkyl (meth)acrylate monomer; optionally a reinforcing monomer, and an initiator.

The present invention provides a silicone release agent composition comprising the components (A), (B), (C) and (D): 50 to 99.9 parts by mass of (A) linear or branched organopolysiloxane represented by the general formula (1) and having at least two alkenyl group-containing organic groups and at least one aryl group-containing organic group in one molecule and having no fluorine-containing organic group, wherein a percentage of the number of the alkenyl group-containing organic group is 0.005 to 5% and a percentage of the number of the aryl group-containing organic groups is 0.1 to 40%, each based on the total number of groups each bonded to a silicon atom; 50 to 0.1 part by mass of (B) linear or branched organopolysiloxane having at least one alkenyl group-containing organic group and at least one fluorine-containing organic group in one molecule, wherein a percentage of the number of the fluorine-containing organic group is 3% to 50%, based on the total number of groups each bonded to a silicon atom, provided that the total amount of components (A) and (B) is 100 parts by mass; (C) organohydrogenpolysiloxane having three or more hydrogen atoms each bonded to a silicon atom in one molecule and having no fluorine-containing organic group, in such an amount that a ratio of the number of the SiH group in component (C) to the total number of the alkenyl group in components (A) and (B) is from 0.5 to 15; and a catalytic amount of (D) platinum group metal catalyst, provided that the silicone release agent composition does not comprise (E) organohydrogenpolysiloxane having one or more hydrogen atoms each bonded to a silicon atom and having a fluorine-containing organic group.