C09J2483/00

Optically clear pressure sensitive adhesives and uses thereof
11427739 · 2022-08-30 · ·

Optically clear adhesives (OCA) with UV blocking below 380 nm are described. The OCA comprise a UV blocking package of UV absorbers and hindered amine light stabilizers. The UV blocking package is suitable for a variety of OCA, including PIB-based OCA, styrenic block copolymer-based OCA, silicone-based OCA, or acrylic-based OCA. The OCA with UV blocking in the invention are particularly suitable as laminating films, tapes or encapsulants for adhering display electronic devices, e.g., LCD displays, LED displays, flexible and foldable displays, and touch screens.

ADHESIVE
20220033698 · 2022-02-03 ·

Described herein is a two-part condensation curable silyl-modified polymer based adhesive composition suitable for the adhesion of a front lens having an anti-haze coating onto a lamp body for lighting applications. Also described herein are lamps comprising a lamp body and a front lens utilizing the adhesive composition to adhere the front lens to the lamp body while generally preserving the integrity of the anti-haze coating.

UV CURABLE SILICONE ADHESIVE COMPOSITION AND CURED PRODUCT THEREOF

This UV curable silicone composition contains (A) an organopolysiloxane represented by general formula (1)

##STR00001##

[R.sup.1 represents a monovalent hydrocarbon group having 1-20 carbon atoms, R.sup.2 represents an aromatic group, X represents a group represented by formula (2), a, m, and n respectively represent numbers in the ranges of 1≤a≤3, 1≤m≤2,000, 1≤n≤2,000, and m/(n+m)≥0.01 is satisfied.

##STR00002##

(R.sup.1 is as defined above. R.sup.3 represents an oxygen atom or an alkylene group having 1-20 carbon atoms, R.sup.4 represents an acryloyloxyalkyl group, a methacryloyloxyalkyl group, an acryloyloxyalkyloxy group, or a methacryloyloxyalkyloxy group, p represents a number in the range of 0≤p≤10, and c represents a number in the range of 1≤c≤3)], (B) a mono-functional (meth)acrylate compound not containing a siloxane structure, and (C) a photopolymerization initiator, and provides, as a temporary fixing material, a cured product having excellent adhesiveness and rubber strength.

STACKED STRUCTURE FOR DISPLAY COVER WINDOW HAVING IMPROVED SCRATCH RESISTANCE USING DIFFERENCE IN ELASTIC MODULUS AND METHOD OF MANUFACTURING THE SAME
20220306824 · 2022-09-29 · ·

The present disclosure relates to a stacked structure for a display cover window having improved scratch resistance using a difference in elastic modulus, and a method of manufacturing the same. The stacked structure for a display cover window includes a base member having an elastic modulus of 2.5 GPa to 5.5 GPa; a hard coating member disposed on the base member and having an elastic modulus of 0.546 times to 2.4 times the elastic modulus of the base member; and a damping member disposed beneath the base member and having an elastic modulus of 0.0000018 to 0.02 times the elastic modulus of the base member. The stacked structure for a display cover window has an effect of remarkably improving scratch resistance by reducing a normal force, which is a major component of frictional force that is a main cause of scratching.

VINYL ALCOHOL POLYMER AND USE THEREOF
20170226247 · 2017-08-10 · ·

There is provided a vinyl alcohol-based polymer having an ethylenic double bond with a saponification degree of 70 mol % or more, wherein the vinyl alcohol-based polymer is water-soluble; a molar ratio of the ethylenic double bond to the total of vinyl alcohol units and vinyl acetate units is 0.05/100 to 2/100; and a limiting viscosity [η] and a weight-average molecular weight Mw of a vinyl ester-based polymer which is produced by esterifying the vinyl alcohol-based polymer satisfy the following formulas (1) and (2).


4.7≦log Mw 6.3   (1)


0.60<(log [η]+3.75)/log Mw<0.69   (2)

SURFACE PROTECTIVE FILM, MAKING METHOD, AND SUBSTRATE PROCESSING LAMINATE

A surface protective film comprising a base film and a resin film thereon can be bonded to a substrate having a circuit-forming surface and separated therefrom after processing. The resin film is formed of a resin composition comprising (A) a silphenylene-siloxane skeleton-containing resin, (B) a compound capable of reacting with an epoxy group in the resin to form a crosslinked structure, (C) a curing catalyst, and (D) a parting agent.

SEAL MATERIAL WITH LATENT ADHESIVE PROPERTIES AND A METHOD OF SEALING FUEL CELL COMPONENTS WITH SAME
20170226392 · 2017-08-10 ·

A composition with latent adhesion, fuel cell stack with a bipolar plate assembly with latent adhesion and a method of assembling a fuel cell stack with a seal that has latent adhesion such that reactant or coolant leakage through the seal is reduced. Bipolar plates within the stack include reactant channels and coolant channels that are fluidly coupled to inlet and outlet flowpaths, all of which are formed within a coolant-engaging or reactant-engaging surface of the plate. One or more thin or low aspect-ratio seals are formed on a metal bead that is integrally-formed on a surface of the plate and is used to help reduce leakage by maintaining fluid isolation of the reactants and coolant as they flow through their respective channels and flowpaths that are defined between adjacently-placed plates. By proper formulation of the precursor materials that make up the seal, the activation of the adhesive bond formed between the seal and an adjacent surface within the fuel cell can be delayed to allow ample time to aligned and compressively join the cell assemblies in a stack housing. This in turn improves the ability of the seal and its adjacent surface to avoid seal damage and concomitant reactant or coolant leakage.

WELDABLE AND VIBRATION DAMPING SILICONE ADHESIVES

Weldable adhesive compositions that dampen noise or vibration are described. In addition, various tape products that include the adhesive compositions are described. Also described are various methods of damping noise or vibration by use of the adhesive compositions and tapes. In addition, vibration damping assemblies utilizing the adhesives are described.

ADHESIVE FOR TEMPORARY BONDING, ADHESIVE LAYER, WAFER WORK PIECE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME, REWORK SOLVENT, POLYIMIDE COPOLYMER, POLYIMIDE MIXED RESIN, AND RESIN COMPOSITION (AS AMENDED)

The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention includes a temporary-bonding adhesive wherein a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.99 mol % of the (A1) residue and 0.01-60 mol % of the (B1) residue.

SUSPENDED PARTICLE DEVICES WITH IMPROVED ADHESION BETWEEN THE ACTIVE AND CONDUCTING LAYERS
20220269141 · 2022-08-25 ·

A suspended-particle device with improved adhesion between the active and conductive layers is disclosed. The conductive layers are coated with an adhesion promoter that comprises at least one organosilane that covalently bonds to the surface of the conductive layer and comprises a cross-linkable moiety such as an acrylate. The active layer comprises a suspension of active particles in a polymer matrix that comprises a polymer having pendant cross-linkable moieties such as acrylates. Upon curing (e.g. by irradiation by ultraviolet light), the polymer matrix of the active layer cross-links with the cross-linkable moieties of the adhesion promoter, thereby binding the active and conductive layers.