According to one embodiment, an adhesive tape includes a film and an adhesive layer. The film includes polytetrafluoroethylene and a carbon filler. The adhesive layer is provided on a surface of the film, and includes a silicone pressure-sensitive adhesive.

The present invention aims to provide a polyvinyl acetal resin composition that is moldable by an extrusion method and capable of exhibiting excellent heat resistance after molding, an adhesive sheet containing the polyvinyl acetal resin composition, and a method for producing the adhesive sheet. The present invention relates to a polyvinyl acetal resin composition including: a polyvinyl acetal; a reactive diluent; and a photopolymerization initiator, the polyvinyl acetal resin composition having a storage modulus G′ at 200° C. before irradiation with light of 8×10.sup.4 Pa or lower and a storage modulus G′ at 200° C. after irradiation with light of 8×10.sup.3 Pa or higher, with the storage modulus G′ at 200° C. after irradiation with light being higher than the storage modulus G′ at 200° C. before irradiation with light.

The present invention aims to provide a polyvinyl acetal resin composition that is moldable by an extrusion method and capable of exhibiting excellent heat resistance after molding, an adhesive sheet containing the polyvinyl acetal resin composition, and a method for producing the adhesive sheet. The present invention relates to a polyvinyl acetal resin composition including: a polyvinyl acetal; a reactive diluent; and a photopolymerization initiator, the polyvinyl acetal resin composition having a storage modulus G′ at 200° C. before irradiation with light of 8×10.sup.4 Pa or lower and a storage modulus G′ at 200° C. after irradiation with light of 8×10.sup.3 Pa or higher, with the storage modulus G′ at 200° C. after irradiation with light being higher than the storage modulus G′ at 200° C. before irradiation with light.

Pressure sensitive adhesive compositions are described comprising at least one low Tg ethylenically unsaturated monomer, and at least one silsesquioxane polymer crosslinker comprising a plurality of ethylenically unsaturated groups. The low Tg ethylenically unsaturated monomer typically has a Tg no greater than 10° C. In some embodiments, the composition comprises at least 50, 55, 60, 65, or 70 wt-% of low Tg ethylenically unsaturated monomer. The low Tg ethylenically unsaturated monomer is typically an alkyl (meth)acrylate comprising 4 to 20 carbon atoms. In another embodiment, an adhesive composition is described comprising a syrup. The syrup comprising i) a free-radically polymerizable solvent monomer; ii) a solute (meth)acrylic polymer comprising polymerized units derived from one or more alkyl (meth)acrylate monomers, and iii) at least one silsesquioxane polymer crosslinker comprising a plurality of ethylenically unsaturated groups. The free-radically polymerizable solvent monomer, polymerized units of the solute (meth)acrylic polymer, or a combination thereof comprise a low Tg ethylenically unsaturated monomer. Also described are pressure sensitive adhesive articles and method of preparing adhesive articles.

Herein are disclosed a pressure-sensitive adhesive layer on a substrate, the adhesive layer containing stripes of first and second pressure-sensitive adhesives. The surface of the adhesive layer that faces the substrate is surface-enriched with the first pressure-sensitive adhesive. Methods of making are disclosed.

An objective is to provide a surface-protective PSA sheet capable of reducing adherend damage and well maintaining appearance, etc. The surface-protective PSA sheet capable of reducing adherend damage and well maintaining appearance, etc., comprises a surface layer, a resin substrate layer and a PSA layer, and has a multilayer structure with the resin substrate layer placed between the surface layer and the PSA layer, wherein the surface layer is a layer obtainable by curing a heat-curable composition comprising the following components: (a) a hydroxyl group-containing (meth)acrylic copolymer having a glass transition temperature of −40° C. to 30° C.; (b) an allophanate polyisocyanate and/or a biuret polyisocyanate; and (c) a polysiloxane comprising a hydroxyl group-containing hydrocarbon group and/or polymer.

An objective is to provide a surface-protective PSA sheet capable of reducing adherend damage and well maintaining appearance, etc. The surface-protective PSA sheet capable of reducing adherend damage and well maintaining appearance, etc., comprises a surface layer, a resin substrate layer and a PSA layer, and has a multilayer structure with the resin substrate layer placed between the surface layer and the PSA layer, wherein the surface layer is a layer obtainable by curing a heat-curable composition comprising the following components: (a) a hydroxyl group-containing (meth)acrylic copolymer having a glass transition temperature of −40° C. to 30° C.; (b) an allophanate polyisocyanate and/or a biuret polyisocyanate; and (c) a polysiloxane comprising a hydroxyl group-containing hydrocarbon group and/or polymer.

An embodiment of the present invention provides an electrical steel sheet including: an upper adhesive layer positioned on an upper surface of an electrical steel sheet; and an lower adhesive layer positioned on a lower surface of the electrical steel sheet, wherein the upper adhesive layer has a pencil hardness of F or lower, and the lower adhesive layer has a pencil hardness of H or higher.

This disclosure describes devices, systems, and methods related to dual switchable adhesives, the manufacture thereof, and the use thereof. An exemplary dual switchable adhesive includes one or more polymers, photo initiators configured to cause the one or more polymers to cross-link responsive to receiving light, and polymerization initiators configured to cause the one or more polymers to cross-link responsive to receiving moisture.

A thermal conductive composite silicone rubber sheet includes a thermal conductive silicone rubber sheet and a thermosoftening silicone resin layer with a thickness of 0.5 to 10 μm on one side of the thermal conductive silicone rubber sheet, the thermosoftening silicone resin layer having an viscosity at 70° C. of 700 Pa.Math.s or lower, where the thermosoftening silicone resin layer has adhesion of 0.5 N/25 mm or higher at a normal temperature and the thermal conductive composite silicone rubber sheet has a thermal resistance lower than a value obtained by adding 0.3 cm2.Math.K/W per one layer of one side of the thermosoftening silicone resin layer to a thermal resistance of the thermal conductive silicone rubber sheet. A thermal conductive composite silicone rubber sheet provided with an adhesive layer on one side of a thermal conductive silicone rubber sheet, makes it possible to impart adhesion without sacrificing thermal conductivity.