A method for transferring microstructures, comprising at least the steps of: (i) bonding a plurality of microstructures formed on one surface of a supplier substrate to a silicone-based rubber layer formed on a donor substrate; (ii) separating some or all of the plurality of microstructures from the supplier substrate and transferring the some or all of the plurality of microstructures to the donor substrate through the silicone-based rubber layer to produce the donor substrate having the to plurality of microstructures temporality fixed thereon; (iii) washing or neutralizing the donor substrate having the plurality of microstructures temporality fixed thereon; (iv) drying the washed or neutralized donor substrate having the plurality of microstructures temporality fixed thereon; and (v) transferring the dried donor substrate having the plurality of microstructures temporality fixed thereof so that the donor substrate can be subjected to a subsequent step. According to the method, a plurality of steps can be carried out while temporality fixing microstructures on a single donor substrate, and therefore it becomes possible to achieve the transfer of the microstructures with high efficiency without increasing the number of steps.

The present invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by formula (L) (wherein each of L.sup.1 and L.sup.2 represents a C2 to C4 alkyl group, and L.sup.3 represents O or S) in an amount of 80 mass % or more.

L.sup.1-L.sup.3-L.sup.2(L)

An anti-fouling silicone composite sheet includes a substrate layer, and a silicone adhesive layer stacked on one surface of the substrate layer, and has a hardness of 5 or less measured with an Asker C hardness tester and an adhesive force of 5 N/25 mm or more with respect to a mortar test piece, in which a surface of the substrate layer which is located on a side opposite to the surface where the silicone adhesive layer is stacked is a surface anti-fouling-treated with a silicone hard coating agent containing a fluorine-containing silicone compound. An anti-fouling silicone composite sheet is capable of exhibiting anti-fouling performance and washability stably for a long period, easily attachable to an adherend, and followable even to cracking and shifting on the application surface; and a method for preventing graffiti by using the anti-fouling silicone composite sheet.

To provide an adhesive suitable to bond a component of an electronic apparatus or an optical apparatus, as well as an electronic apparatus and an optical apparatus in which the adhesive is used. An adhesive according to an embodiment of the present technology includes a flexible adhesive material and a plurality of particles. The adhesive material is flexible. The plurality of particles is dispersed in the adhesive material, the plurality of particles being deformed under a low-rate load and not being deformed under a high-rate load.

A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.

There is provided an adhesive capable of improving the visibility and controlling gaps with high accuracy. The adhesive according to the present invention is an adhesive containing a curable component and a gap material, in which the 10% K value of the gap material is 10000 N/mm.sup.2 or less, and the absolute value of the difference between the refractive index of a cured product obtained by curing the curable component at 23° C. for 1 hour and the refractive index of the gap material is 0.1 or less.

A curable hot-melt silicone composition that is less susceptible to curing inhibition and with excellent storage stability, and a sheet or film containing the same, is provided. The composition comprises: (A) a solid organopolysiloxane resin containing a specific ratio of (A1) an organopolysiloxane resin having a curing reactive functional group that contains a carbon-carbon double bond and containing 20 mol % or more of a Q unit, and (A2) an organopolysiloxane resin not having a curing reactive functional group that contains a carbon-carbon double bond and containing 20 mol % or more of a Q unit; (B) a chain organopolysiloxane having a curing reactive functional group that contains at least two carbon-carbon double bonds; (C) an organohydrogenpolysiloxane resin having a mass loss ratio relative to pre-exposure of 10% or less after exposure to 100° C. for 1 hour under atmospheric pressure; and (D) a hydrosilylation reaction catalyst. The composition generally has hot-melt properties.

Generally described herein are adhesion promoter compositions, which can be formed, for example, via a two-step synthetic process. In some embodiments, the first step of the synthetic process involves the hydrolysis and polycondensation of an organosilane monomer compound, thereby providing a polyorganosilane intermediate compound. In certain aspects, the organosilane compound may be hydrolyzed and polycondensed in the presence of a chain extender (e.g., a co-monomer) to provide an oligomeric adhesion promoter with greater degrees of functionalization. In some embodiments, the second step of the synthetic process involves the hydrosilylation of the polyorganosilane intermediate compound with a hydro silane-containing compound, resulting in a compound of the adhesion promoter.

A method for preparing a curable silicone pressure sensitive adhesive emulsion includes preparing a dispersion of benzoyl peroxide and a phenoxy-functional alcohol and thereafter combining the dispersion with the other starting materials of the emulsion.

The invention relates to an assembly for adhesively connecting substantially congruent gluing surfaces of a first and second joining partner over their full surface, comprising: the first joining partner (1); the second joining partner (2); an adhesive layer (3) of a polar, flowable adhesive applied to the gluing surface (1a) of the first joining partner (1); means (8) for holding the second joining partner (2) above the adhesive layer (1a) of the first joining partner (1), such that the gluing surface (2a) of the second joining partner (2) faces the adhesive layer (3) on the first joining partner (1) and is disposed so as to be spaced therefrom across an air gap (5), and the spacing defined by the air gap (5) between the first joining partner (1) and the second joining partner (2) is dimensioned in such a way that a capillary volume is formed; means (7) for generating an electric field (10) in order to cause, by means of electric influence, a local charge displacement (11) on and/or in the second joining partner (1), and the charge displacement (11) is suitable for attracting the polar adhesive in such a way that it wets the gluing surface (2a) of the second joining partner (2) first in the area of the local charge displacement (11), wherein the means for generating the electric field comprise an electrode (7), which is disposed on the side of the second joining partner (2) facing away from the gluing surface (2a) and is electrically insulated from said partner (2).