A boron nitride powder, containing at least an aggregated boron nitride particle formed by an aggregation of hexagonal boron nitride primary particles, the powder having a particle size distribution including at least a first maximum point, a second maximum point at which a particle size is larger than at the first maximum point, and a third maximum point at which a particle size is larger than at the second maximum point. The heat dissipation sheet is obtained by molding a heat conductive resin composition containing the boron nitride powder and a resin. The method for producing a heat dissipation sheet includes blending the boron nitride powder and a resin to prepare a heat conductive resin composition, molding the heat conductive resin composition into a sheet shape to prepare a heat conductive resin composition sheet, and heating and pressurizing the heat conductive resin composition sheet under a vacuum.

A heat transfer fluid comprising about 20 to about 80% by weight terphenyls and from about 20 to about 80% by weight partially hydrogenated terphenyls, wherein preferably the terphenyls and partially hydrogenated terphenyls comprise a reclaimed product from a degraded heat transfer fluid initially comprised primarily of partially hydrogenated terphenyls.

The present invention relates to an unsaturated fluorinated ether or amine compound of formula (I) with low global warming potential and method of making the compound (I), where R.sub.H.sup.1 is and R.sub.H.sup.2 are independently selected from H or CH.sub.3, wherein when R.sub.H.sup.1 is CH.sub.3 then R.sub.H.sup.2 is H and when R.sub.H.sup.2 is CH.sub.3, then R.sub.H.sup.1 is H; X is O or N and when X is O, then n is 1 and R.sub.f is a linear or branched perfluorinated alkyl group comprising 1-10 carbon atoms and optionally comprising at least one catenated O or N atom; X is N, then n is 2 and (i) each R.sub.f is independently selected from a linear or branched perfluorinated alkyl group comprising 1-8 carbon atoms and optionally comprising at least one catenated O or N atom, or (ii) the two R.sub.f's are bonded together to form a ring structure optionally comprising at least one catenated O or N atom, wherein the ring of the ring structure consists of 5-7 atoms, no more than 10 carbon atoms, and is perfluorinated. The applications of the compound include solvent cleaning, electrolyte solvents or additives, heat transfer, and vapour phase soldering.

Disclosed are compositions comprising HFC-245eb and at least one additional compound selected from the group consisting of HFO-1234ze, HFC-245fa, HFC-236cb, HFC-236ea, HFC-236fa, HFC-227ea, HFC-227ca, HFO-1225yc, HFO-1225zc, HFO-1225ye, methane, ethane, propane, HFC-23, HFC-143a, HFC-134, HFC-134a, FC-1216, HFO-1234yf, HFC-254eb, HFO-1243zf, and HFC-254fb. Compositions comprising HFC-245eb are useful in processes to make HFO-1234yf. Also disclosed are compositions comprising HFO-1234yf and at least one additional compound selected from the group consisting of HFO-1234ze, HFC-254eb, HFC-254fb, HFO-1243zf, HFCHFC-245eb, HFC-245fa, HFC-245cb, HFC-236cb, HFC-236ea, HFC-236fa, HFC-227ea, HFC-227ca, HFO-1225yc, HFO-1225zc, HFO-1225ye, methane, ethane, propane, HFC-23, HFC-134, HFC-134a, HFO-1132a and FC-1216. Compositions comprising HFO-1234yf are useful as heat transfer compositions for use in refrigeration, air-conditioning and heat pump systems.

Disclosed are compositions comprising HFC-245eb and at least one additional compound selected from the group consisting of HFO-1234ze, HFC-245fa, HFC-236cb, HFC-236ea, HFC-236fa, HFC-227ea, HFC-227ca, HFO-1225yc, HFO-1225zc, HFO-1225ye, methane, ethane, propane, HFC-23, HFC-143a, HFC-134, HFC-134a, FC-1216, HFO-1234yf, HFC-254eb, HFO-1243zf, and HFC-254fb. Compositions comprising HFC-245eb are useful in processes to make HFO-1234yf. Also disclosed are compositions comprising HFO-1234yf and at least one additional compound selected from the group consisting of HFO-1234ze, HFC-254eb, HFC-254fb, HFO-1243zf, HFCHFC-245eb, HFC-245fa, HFC-245cb, HFC-236cb, HFC-236ea, HFC-236fa, HFC-227ea, HFC-227ca, HFO-1225yc, HFO-1225zc, HFO-1225ye, methane, ethane, propane, HFC-23, HFC-134, HFC-134a, HFO-1132a and FC-1216. Compositions comprising HFO-1234yf are useful as heat transfer compositions for use in refrigeration, air-conditioning and heat pump systems.

Heat transfer fluid concentrates include: a freezing point depressant, water, or a combination thereof; a carboxylate; an inorganic phosphate; an azole compound; calcium ions and/or magnesium ions; and a water-soluble polymer. Ready-to-use heat transfer fluids and methods for preventing corrosion in heat transfer systems are described.

An iso(thio)cyanate composition has excellent storage stability. The iso(thio)cyanate composition for an optical component includes an iso(thio)cyanate compound having two or more iso(thio)cyanate groups in a molecule, a phosphoric acid ester compound represented by general formula (1), and a phosphoric acid ester compound represented by general formula (2), a total amount of the phosphoric acid ester compounds being 1 ppm to 25,000 ppm, based on the mass of the iso(thio)cyanate compound.

Various embodiments include a composite comprising: a cooling system; a surface to be cooled including at least a part of an electrical and/or electronic component; and a set of chemical bonds joining the cooling system to the surface.

The process relates to a method of using catalyzed graphene with a nanoparticle reacting agent in the refrigeration circuit of a thermal vapor compression system to improve the efficiency of the system. Specifically, the present process relates to a method of using a catalyzed graphene and nanoparticle reacting agent in the refrigeration circuit of an air conditioning, heat pump, or refrigeration system to increase the performance of the system relative to an equivalent system operating in an equivalent environment without the catalyzed graphene and nanoparticle reacting agent.

A thermal compensation layer includes a metal inverse opal (MIO) layer that includes a plurality of core-shell phase change (PC) particles encapsulated within a metal of the MIO layer. Each of the core-shell PC particles includes a core that includes a PCM having a PC temperature in a range of from 100? C. to 250? C., and a shell that includes a shell material having a melt temperature greater than the PC temperature of the PCM. A power electronics assembly includes a substrate having a thermal compensation layer formed proximate a surface of the substrate, the thermal compensation layer comprising an MIO layer that includes a plurality of core-shell PC particles encapsulated within a metal of the MIO layer. The power electronics assembly further includes an electronic device bonded to the thermal compensation layer at a first surface of the electronic device.