Patent classifications
C22C12/00
Separation of manganese bismuth powders
A method of increasing volume ratio of magnetic particles in a MnBi alloy includes depositing a MnBi alloy powder containing magnetic particles and non-magnetic particles on a sloped surface having a magnetic field acted thereupon. The method further includes collecting falling non-magnetic particles while separated magnetic particles are magnetically retained on the sloped surface.
Piston with sealed cooling gallery containing a thermally conductive composition
A heavy duty piston for an internal combustion engine comprises a thermally conductive composition filling 10 to 90 vol. % of a sealed cooling gallery. The thermally conductive composition includes bismuth and/or tin. For example, the thermally conductive composition can be a single-phase binary mixture of bismuth and tin. The thermally conductive composition has improved thermal properties, for example a melting point around 139° C., a thermal conductivity around 22 W/m.Math.K, and a thermal diffusivity around 1.43E-5 m.sup.2/s. The thermally conductive composition is not reactive and does not include toxic or cost-prohibitive metals. During high temperature operation, as the piston reciprocates in the cylinder bore, the thermally conductive composition flows throughout the cooling gallery to dissipate heat away from the upper crown and thus improve efficiency of the engine.
METHODS, APPARATUS AND SYSTEMS FOR CREATING BISMUTH ALLOY PLUGS FOR ABANDONED WELLS
A wellbore is plugged using a bismuth alloy. In one embodiment, the bismuth alloy comprises an alloy of bismuth and tin. In another embodiment, the bismuth alloy comprises an alloy of bismuth and silver. The wellbore can be arranged so that a liquid bismuth alloy sets with an excess pressure of the plug relative to the borehole fluid pressure along a desired seal height distance. Other aspects are described and claimed.
METHODS, APPARATUS AND SYSTEMS FOR CREATING WELLBORE PLUGS FOR ABANDONED WELLS
A wellbore is plugged using a bismuth alloy. The wellbore is arranged so that a liquid bismuth alloy sets with an excess pressure of the plug relative to the borehole fluid pressure along a desired seal height distance.
METHODS, APPARATUS AND SYSTEMS FOR CREATING WELLBORE PLUGS FOR ABANDONED WELLS
A wellbore is plugged using a bismuth alloy. The wellbore is arranged so that a liquid bismuth alloy sets with an excess pressure of the plug relative to the borehole fluid pressure along a desired seal height distance.
METHODS, APPARATUS AND SYSTEMS FOR CREATING WELLBORE PLUGS FOR ABANDONED WELLS
A wellbore is plugged using a bismuth alloy. The wellbore is arranged so that a liquid bismuth alloy sets with an excess pressure of the plug relative to the borehole fluid pressure along a desired seal height distance.
Sliding member
A sliding member includes an overlay formed with an alloy plated film of Bi and Sb, the Sb concentration increasing in the overlay with the depth from the surface of the overlay.
Compound semiconductor and manufacturing method thereof
Disclosed is a compound semiconductor material with excellent performance and its utilization. The compound semiconductor may be expressed by Chemical Formula 1 below:
M1.sub.aCo.sub.4Sb.sub.12-xM2.sub.x Chemical Formula 1 where M1 and M2 are respectively at least one selected from In and a rare earth metal element, 0≤a≤1.8, and 0≤x≤0.6.
Compound semiconductor and manufacturing method thereof
Disclosed is a compound semiconductor material with excellent performance and its utilization. The compound semiconductor may be expressed by Chemical Formula 1 below:
M1.sub.aCo.sub.4Sb.sub.12-xM2.sub.x Chemical Formula 1 where M1 and M2 are respectively at least one selected from In and a rare earth metal element, 0≤a≤1.8, and 0≤x≤0.6.
Sb—Te-based alloy sintered compact sputtering target
An Sb—Te-based alloy sintered compact sputtering target having Sb and Te as main components and which contains 0.1 to 30 at % of carbon or boron and comprises a uniform mixed structure of Sb—Te-based alloy particles and fine carbon (C) or boron (B) particles is provided. An average grain size of the Sb—Te-based alloy particles is 3 μm or less and a standard deviation thereof is less than 1.00. An average grain size of the C or B particles is 0.5 μm or less and a standard deviation thereof is less than 0.20. When the average grain size of the Sb—Te-based alloy particles is X and the average grain size of the carbon or boron particles is Y, Y/X is within a range of 0.1 to 0.5. This provides an improved Sb—Te-based alloy sputtering target that inhibits generation of cracks in the sintered target and prevents generation of arcing during sputtering.