C22C12/00

Sb—Te-based alloy sintered compact sputtering target

An Sb—Te-based alloy sintered compact sputtering target having Sb and Te as main components and which contains 0.1 to 30 at % of carbon or boron and comprises a uniform mixed structure of Sb—Te-based alloy particles and fine carbon (C) or boron (B) particles is provided. An average grain size of the Sb—Te-based alloy particles is 3 μm or less and a standard deviation thereof is less than 1.00. An average grain size of the C or B particles is 0.5 μm or less and a standard deviation thereof is less than 0.20. When the average grain size of the Sb—Te-based alloy particles is X and the average grain size of the carbon or boron particles is Y, Y/X is within a range of 0.1 to 0.5. This provides an improved Sb—Te-based alloy sputtering target that inhibits generation of cracks in the sintered target and prevents generation of arcing during sputtering.

ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING CONNECTION STRUCTURE

A method for producing an anisotropic conductive film, which includes: a preparation step wherein a base material that has a plurality of recesses and solder fine particles are prepared; an accommodation step wherein at least some of the solder fine particles are accommodated in the recesses; a fusing step wherein the solder fine particles accommodated in the recesses are fused, thereby forming solder particles within the recesses; a transfer step wherein an insulating resin material is brought into contact with the recess opening side of the base material that includes the solder particles in the recesses, thereby obtaining a first resin layer on which the solder particles have been transferred; and a layering step wherein a second resin layer that is configured from an insulating resin material is formed on the surface of the first resin layer, on which the solder particles have been transferred, thereby obtaining an anisotropic conductive film.

SOLDER PARTICLES

The present invention relates to solder particles, each of which partially has a flat portion in the surface. By using these solder particles, electrodes facing each other are able to be appropriately connected, thereby achieving an anisotropic conductive material that exhibits excellent conduction reliability and excellent insulation reliability.

Thermoelectric alloy, method for producing the same and thermoelectric alloy composite

The present invention relates to a thermoelectric alloy and a method for producing the same. A starting material is firstly provided, and an oxidation process is performed to the starting material to obtain an oxidized material composition. Then, the oxidized material composition and a carburizing agent are added into a quartz tube, and a sealing process is performed to the quartz tube. And then, the sealed quartz tube is subjected to a carburization process, thereby obtaining the thermoelectric alloy with excellent thermoelectric figure-of-merit.

Thermoelectric alloy, method for producing the same and thermoelectric alloy composite

The present invention relates to a thermoelectric alloy and a method for producing the same. A starting material is firstly provided, and an oxidation process is performed to the starting material to obtain an oxidized material composition. Then, the oxidized material composition and a carburizing agent are added into a quartz tube, and a sealing process is performed to the quartz tube. And then, the sealed quartz tube is subjected to a carburization process, thereby obtaining the thermoelectric alloy with excellent thermoelectric figure-of-merit.

Sliding member
10982712 · 2021-04-20 · ·

A sliding member including an overlay capable of realizing good fatigue resistance while preventing interlayer peeling. The sliding member includes an overlay formed of an alloy plating film of Bi and Sb. The overlay contains Bi, Sb, and unavoidable impurities. The concentration of Sb on the surface of the overlay is 0.92% by mass or more and 13% by mass or less.

Sliding member
10982712 · 2021-04-20 · ·

A sliding member including an overlay capable of realizing good fatigue resistance while preventing interlayer peeling. The sliding member includes an overlay formed of an alloy plating film of Bi and Sb. The overlay contains Bi, Sb, and unavoidable impurities. The concentration of Sb on the surface of the overlay is 0.92% by mass or more and 13% by mass or less.

Heat sources and alloys for use in down-hole applications
10941630 · 2021-03-09 · ·

A chemical reaction heat source for use in heaters used in down-hole applications is provided. The heat source has a fuel composition that comprises thermite and a damping agent. The use of the thermite mix enables the heaters of the present invention to generate hotter temperatures down wells. This in turn allows the use of Bismuth/Germanium alloys, which have higher melting points, to enable the production of plugs for the abandonment of deeper wells where subterranean temperatures are higher.

Heat sources and alloys for use in down-hole applications
10941630 · 2021-03-09 · ·

A chemical reaction heat source for use in heaters used in down-hole applications is provided. The heat source has a fuel composition that comprises thermite and a damping agent. The use of the thermite mix enables the heaters of the present invention to generate hotter temperatures down wells. This in turn allows the use of Bismuth/Germanium alloys, which have higher melting points, to enable the production of plugs for the abandonment of deeper wells where subterranean temperatures are higher.

Thermoelectric materials synthesized by self-propagating high temperature synthesis process and methods thereof

The disclosure relates to thermoelectric materials prepared by self-propagating high temperature synthesis (SHS) process combining with Plasma activated sintering and methods for preparing thereof. More specifically, the present disclosure relates to the new criterion for combustion synthesis and the method for preparing the thermoelectric materials which meet the new criterion.