Patent classifications
C22C27/00
STABLE NANOCRYSTALLINE ORDERING ALLOY SYSTEMS AND METHODS OF IDENTIFYING SAME
Provided in one embodiment is a method of identifying a stable phase of an ordering binary alloy system comprising a solute element and a solvent element, the method comprising: determining at least three thermodynamic parameters associated with grain boundary segregation, phase separation, and intermetallic compound formation of the ordering binary alloy system; and identifying the stable phase of the ordering binary alloy system based on the first thermodynamic parameter, the second thermodynamic parameter and the third thermodynamic parameter by comparing the first thermodynamic parameter, the second thermodynamic parameter and the third thermodynamic parameter with a predetermined set of respective thermodynamic parameters to identify the stable phase; wherein the stable phase is one of a stable nanocrystalline phase, a metastable nanocrystalline phase, and a non-nanocrystalline phase.
METAL ALLOY HAVING RHENIUM EFFECT
A medical device that is at least partially formed of a metal alloy that includes at least 15 awt. % rhenium, and a medical device that is partially or fully formed of such metal alloy.
METAL ALLOY HAVING RHENIUM EFFECT
A medical device that is at least partially formed of a metal alloy that includes at least 15 awt. % rhenium, and a medical device that is partially or fully formed of such metal alloy.
Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste
This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate 11; a nitride layer 31 that is formed on the surface of the ceramic substrate 11 between the copper plate and the ceramic substrate 11; and an AgCu eutectic structure layer 32 having a thickness of 15 m or less that is formed between the nitride layer and the copper plate.
Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste
This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate 11; a nitride layer 31 that is formed on the surface of the ceramic substrate 11 between the copper plate and the ceramic substrate 11; and an AgCu eutectic structure layer 32 having a thickness of 15 m or less that is formed between the nitride layer and the copper plate.
COATING FOR METAL ALLOY
A metal alloy and includes an enhancement coating material.
COATING FOR METAL ALLOY
A metal alloy and includes an enhancement coating material.
GLASS-MELTING COMPONENT
A process for producing a glass melting component composed of refractory metal. A surface zone of the glass melting component is densified at least in sections by application of local compressive stress. As a result the surface zone has its porosity reduced compared to a volume section which is located underneath the surface zone and which has residual porosity.
High-modulus alloy for medical devices
Medical devices, such as implants, having a high-modulus alloy. The alloy includes a biocompatible refractory-metal-based alloy having multiple refractory metals. The alloy has an elastic modulus above about 300 GPa. The alloy comprises 30-35% tungsten, 60% molybdenum, and 5-10% niobium. The alloy is absent of rhenium.
High-modulus alloy for medical devices
Medical devices, such as implants, having a high-modulus alloy. The alloy includes a biocompatible refractory-metal-based alloy having multiple refractory metals. The alloy has an elastic modulus above about 300 GPa. The alloy comprises 30-35% tungsten, 60% molybdenum, and 5-10% niobium. The alloy is absent of rhenium.