A metal alloy and includes an enhancement coating material.

A variety of polyhedral nanocages are provided having a hollow interior, ultrathin walls, and well-defined facets of metal atoms. The nanocages can include a variety of precious metals such as Pt, Au, Ru, Rh, or Ir. The metal atoms can take a face-centered cubic structure with {111} facets on the surface. The walls can be thin, sometimes less than 1 nm in thickness or only a few atomic layers in thickness. The nanocages can provide for efficient uses of valuable precious metals, among other things, in catalysis. For example, catalysts are provided exhibiting high mass activities in oxygen reduction reactions. Methods of making and methods of using the nanocages and catalysts are also provided.

A variety of polyhedral nanocages are provided having a hollow interior, ultrathin walls, and well-defined facets of metal atoms. The nanocages can include a variety of precious metals such as Pt, Au, Ru, Rh, or Ir. The metal atoms can take a face-centered cubic structure with {111} facets on the surface. The walls can be thin, sometimes less than 1 nm in thickness or only a few atomic layers in thickness. The nanocages can provide for efficient uses of valuable precious metals, among other things, in catalysis. For example, catalysts are provided exhibiting high mass activities in oxygen reduction reactions. Methods of making and methods of using the nanocages and catalysts are also provided.

A decorative product includes a decorative layer containing nickel, chromium, and molybdenum as constituent components. The molybdenum content in the decorative layer is 50 atm % or less. The total content of nickel, chromium, and molybdenum in the decorative layer is 95 atm % or more.

The disclosure pertains to a radiation source, such as an active insert, typically containing porous or microporous iridium or compounds, alloys or composites thereof within an encapsulation, and methods of manufacture thereof. The porosity or microporosity or low-density alloying ingredient with iridium causes a reduced density of the iridium within the active insert to be achieved.

The disclosure pertains to a radiation source, such as an active insert, typically containing porous or microporous iridium or compounds, alloys or composites thereof within an encapsulation, and methods of manufacture thereof. The porosity or microporosity or low-density alloying ingredient with iridium causes a reduced density of the iridium within the active insert to be achieved.

The present disclosure relates to metal alloys for biosensors. An electrode is made from ruthenium metal or a ruthenium-based alloy. The resulting electrode has physical and electrical property advantages when compared with existing pure metal electrodes.

The present disclosure relates to metal alloys for biosensors. An electrode is made from ruthenium metal or a ruthenium-based alloy. The resulting electrode has physical and electrical property advantages when compared with existing pure metal electrodes.

Provided is a master alloy for a sputtering target, wherein, when elements constituting the master alloy are following X1, X2, Y1, Y2, Y2, and Y3; specifically, where X1 is one or two types of Ta or W; X2 is at least one type of Ru, Mo, Nb or Hf; Y1 is one or two types of Cr or Mn; Y2 is one or two types of Co or Ni; and Y3 is one or two types of Ti or V, the master alloy comprises any one combination of X1-Y1, X1-Y2, X1-Y3, X2-Y1, and X2-Y2 of the foregoing constituent elements. This consequently yields superior effects of being able to obtain a sintered sputtering target with few defects and having a high-density and uniform alloy composition, and, by using this target, to realize the deposition of an alloy barrier film with uniform quality and few particles at a high speed.

Provided is a master alloy for a sputtering target, wherein, when elements constituting the master alloy are following X1, X2, Y1, Y2, Y2, and Y3; specifically, where X1 is one or two types of Ta or W; X2 is at least one type of Ru, Mo, Nb or Hf; Y1 is one or two types of Cr or Mn; Y2 is one or two types of Co or Ni; and Y3 is one or two types of Ti or V, the master alloy comprises any one combination of X1-Y1, X1-Y2, X1-Y3, X2-Y1, and X2-Y2 of the foregoing constituent elements. This consequently yields superior effects of being able to obtain a sintered sputtering target with few defects and having a high-density and uniform alloy composition, and, by using this target, to realize the deposition of an alloy barrier film with uniform quality and few particles at a high speed.