A sputtering target according to this invention comprises an alloy of Al and Sc and contains from 25 at. % to 50 at. % of Sc. The sputtering target has an oxygen content of 2000 ppm by mass or less, and a variation in Vickers hardness (Hv) of 20% or less.

A sputtering target according to this invention comprises an alloy of Al and Sc and contains from 25 at. % to 50 at. % of Sc. The sputtering target has an oxygen content of 2000 ppm by mass or less, and a variation in Vickers hardness (Hv) of 20% or less.

A polycrystalline bulk body of this invention has uniformity in superconducting properties, in comparison to a polycrystalline bulk body including crystal grains each constituted by (Ba.sub.1-xK.sub.x)Fe.sub.2As.sub.2. A polycrystalline bulk body (1) of this invention includes crystal grains each constituted by an iron-based compound (10) expressed by chemical formula AA′Fe.sub.4As.sub.4, where A is Ca and A′ is K, the iron-based compound (10) having a crystal structure in which AFe.sub.2As.sub.2 layers (16) and A′Fe.sub.2As.sub.2 layers (17) are alternately stacked.

A lead-free solder which can reduce the occurrence of voids and a connecting member which uses the solder and has excellent adhesion, bonding strength, and workability are provided. The lead-free solder alloy contains Sn: 0.1-3% and/or Bi: 0.1-2%, and a remainder of In and unavoidable impurities and has the effect of suppressing the occurrence of voids at the time of soldering. The connecting member is prepared by melting the lead-free solder alloy, immersing a metal substrate in the melt, and applying ultrasonic vibrations to the molten lead-free solder alloy and the metal substrate to form a lead-free solder alloy layer on the surface of the metal substrate. A heat sink and a package are soldered to each other through this connecting member by reflow heating in the presence of flux.

A lead-free solder which can reduce the occurrence of voids and a connecting member which uses the solder and has excellent adhesion, bonding strength, and workability are provided. The lead-free solder alloy contains Sn: 0.1-3% and/or Bi: 0.1-2%, and a remainder of In and unavoidable impurities and has the effect of suppressing the occurrence of voids at the time of soldering. The connecting member is prepared by melting the lead-free solder alloy, immersing a metal substrate in the melt, and applying ultrasonic vibrations to the molten lead-free solder alloy and the metal substrate to form a lead-free solder alloy layer on the surface of the metal substrate. A heat sink and a package are soldered to each other through this connecting member by reflow heating in the presence of flux.

The present invention provides an R-T-B based permanent magnet, comprising: a main phase which is composed of the structure of R.sub.2T.sub.14B (R is at least one element selected from Y, La, Ce, Pr, Nd, Sm, Eu and Gd, and T is one or more transition metal elements having Fe or a combination of Fe and Co as necessary); and a grain boundary phase which is composed of Ce.sub.xM.sub.1-x (M is at least one element selected from Mg, Al, Si, Ti, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Y, Zr, Nb, Mo, Ag, In, Sn, La, Pr, Nd, Sm, Eu, Gd, Hf, Ta, W and Bi, and x is within the range of 0.20≦x≦0.55), and the cross-sectional ratio Atre of the grain boundary phase to the whole magnet structure is within the range of 0.03<Atre<0.07.

The present invention provides an R-T-B based permanent magnet, comprising: a main phase which is composed of the structure of R.sub.2T.sub.14B (R is at least one element selected from Y, La, Ce, Pr, Nd, Sm, Eu and Gd, and T is one or more transition metal elements having Fe or a combination of Fe and Co as necessary); and a grain boundary phase which is composed of Ce.sub.xM.sub.1-x (M is at least one element selected from Mg, Al, Si, Ti, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Y, Zr, Nb, Mo, Ag, In, Sn, La, Pr, Nd, Sm, Eu, Gd, Hf, Ta, W and Bi, and x is within the range of 0.20≦x≦0.55), and the cross-sectional ratio Atre of the grain boundary phase to the whole magnet structure is within the range of 0.03<Atre<0.07.

A step of, while an RLM alloy powder (where RL is Nd and/or Pr; M is one or more elements selected from among Cu, Fe, Ga, Co, Ni and Al) and an RH compound powder (where RH is Dy and/or Tb; and the RH compound is an RH fluoride and/or an RH oxyfluoride) are present on the surface of a sintered R-T-B based magnet, performing a heat treatment at a sintering temperature of the sintered R-T-B based magnet or lower is included. The RLM alloy contains RL in an amount of 50 at % or more, and the melting point of the RLM alloy is equal to or less than the temperature of the heat treatment. The heat treatment is performed while the RLM alloy powder and the RH compound powder are present on the surface of the sintered R-T-B based magnet at a mass ratio of RLM alloy: RH compound=9.6:0.4 to 5:5.

A lead free solder composition is disclosed and includes: 0.02% to 6% by weight stibium, 0.03% to 3% by weight copper, 0.03% to 8% by weight bismuth, 42% to 70% by weight indium, 0.3% to 8% by weight silver, 5% to 11% by weight magnesium, 0.8% to 1.6% by weight scandium, 0.7% to 2.0% by weight yttrium, and 10% to 45% by weight tin. The lead free solder composition of the invention has a solidus temperature no lower than 120° C., has good ductility and stability, and hence is suitable for soldering electrical connectors onto the metalized surface on the glass.

A lead free solder composition is disclosed and includes: 0.02% to 6% by weight stibium, 0.03% to 3% by weight copper, 0.03% to 8% by weight bismuth, 42% to 70% by weight indium, 0.3% to 8% by weight silver, 5% to 11% by weight magnesium, 0.8% to 1.6% by weight scandium, 0.7% to 2.0% by weight yttrium, and 10% to 45% by weight tin. The lead free solder composition of the invention has a solidus temperature no lower than 120° C., has good ductility and stability, and hence is suitable for soldering electrical connectors onto the metalized surface on the glass.