C22F3/00

Method and System for Improving the Surface Fracture Toughness of Brittle Materials, and a Cutting Tool Produced by Such Method

This invention concerns a method of improving the wear resistance of a cemented carbide. The method includes using fracture toughness as a selection criterion and selecting a cemented carbide which has a fracture toughness between about 6 and about 15 MPa.Math.m.sup.1/2. The method further includes applying a sacrificial coating to the cemented carbide and increasing the fracture toughness of the cemented carbide by creating a toughened surface layer using laser shock peening, thereby increasing its fracture resistance to fatigue and stress corrosion cracking. The invention also concerns a cutting tool or a cutting tool insert made from a cemented carbide and treated using the method according to the invention.

High entropy alloy having composite microstructure

A metallic alloy, more particularly, a high-entropy alloy with a composite structure exhibits high strength and good ductility, and is used as a component material in electromagnetic, chemical, shipbuilding, machinery, and other applications, and in extreme environments, and the like.

High entropy alloy having composite microstructure

A metallic alloy, more particularly, a high-entropy alloy with a composite structure exhibits high strength and good ductility, and is used as a component material in electromagnetic, chemical, shipbuilding, machinery, and other applications, and in extreme environments, and the like.

CALCIUM-BEARING MAGNESIUM AND RARE EARTH ELEMENT ALLOY AND METHOD FOR MANUFACTURING THE SAME

A calcium-bearing magnesium and rare earth element alloy consists essentially of, in mass percent, zinc (Zn): 1-3%; aluminum (Al): 1-3%; calcium (Ca): 0.1-0.4%; gadolinium (Gd): 0.1-0.4%; yttrium (Y): 0-0.4%; manganese (Mn): 0-0.2%; and balance magnesium (Mg).

LEAD-FREE SOLDER ALLOY COMPOSITION, SOLDER BALL INCLUDING THE SAME, SOLDER PASTE INCLUDING THE LEAD-FREE SOLDER ALLOY COMPOSITION, SEMICONDUCTOR DEVICE INCLUDING HYBRID BONDING STRUCTURE INCLUDING THE LEAD-FREE SOLDER ALLOY COMPOSITION, AND METHOD OF MANUFACTURING SOLDER PASTE INCLUDING THE LEAD-FREE SOLDER ALLOY COMPOSITION

A lead-free solder alloy composition includes a lead-free solder alloy; and a flower-shaped metal nano-particle including a metal core and protrusion portions extending from a surface of the metal core, wherein the metal core and the protrusion portions of the metal nano-particle include only one metal element.

LEAD-FREE SOLDER ALLOY COMPOSITION, SOLDER BALL INCLUDING THE SAME, SOLDER PASTE INCLUDING THE LEAD-FREE SOLDER ALLOY COMPOSITION, SEMICONDUCTOR DEVICE INCLUDING HYBRID BONDING STRUCTURE INCLUDING THE LEAD-FREE SOLDER ALLOY COMPOSITION, AND METHOD OF MANUFACTURING SOLDER PASTE INCLUDING THE LEAD-FREE SOLDER ALLOY COMPOSITION

A lead-free solder alloy composition includes a lead-free solder alloy; and a flower-shaped metal nano-particle including a metal core and protrusion portions extending from a surface of the metal core, wherein the metal core and the protrusion portions of the metal nano-particle include only one metal element.

Apparatus and process for localized patterned surface hardening for light-weight alloys to increase wear resistance under lubricated contact

An apparatus for localized patterned surface hardening for light-weight alloys to increase wear resistance under lubricated contact is provided. The apparatus includes a first metallic structure and a second metallic structure. The second metallic structure includes a contact surface and is disposed in lubricated contact with the first metallic structure at the contact surface, wherein the second metallic structure is constructed with a lighter-than-steel material and wherein the contact surface includes a localized surface hardened pattern.

Method of manufacturing electrostatic chuck having electrode layer made of heterogeneous composite material, and electrostatic chuck manufactured thereby

This application relates to a method of manufacturing an electrostatic chuck having good characteristics in heat dissipation, thermal shock resistance, and lightness. In one aspect, the method includes preparing a composite powder by ball-milling (i) aluminum or aluminum alloy powder and (ii) carbon-based nanomaterial powder. The method may also include preparing an electrode layer by sintering the composite powder through spark plasma sintering (SPS), and forming a dielectric layer on the electrode layer.

Method for reducing the speed of propagation of a crack in a metal substrate

A method for reducing the speed of propagation of a crack in a metal substrate by means of laser heat treatment can include heating the metal substrate with a laser heat treatment at one or more crack ends, wherein the laser beam is guided over the substrate surface so that it defines the form of an oval, an arc or a curve. Alternatively, the substrate can be treated by means of laser heat treatment before a crack arises. For example, areas at risk of cracking are identified in a metal substrate and the metal substrate is then heated by means of laser heat treatment in these areas, wherein the laser beam is guided over the substrate surface so that it defines the form of an oval, an arc or a curve. Also disclosed herein are metal substrates produced by the method and the use thereof.

Method for reducing the speed of propagation of a crack in a metal substrate

A method for reducing the speed of propagation of a crack in a metal substrate by means of laser heat treatment can include heating the metal substrate with a laser heat treatment at one or more crack ends, wherein the laser beam is guided over the substrate surface so that it defines the form of an oval, an arc or a curve. Alternatively, the substrate can be treated by means of laser heat treatment before a crack arises. For example, areas at risk of cracking are identified in a metal substrate and the metal substrate is then heated by means of laser heat treatment in these areas, wherein the laser beam is guided over the substrate surface so that it defines the form of an oval, an arc or a curve. Also disclosed herein are metal substrates produced by the method and the use thereof.