The present disclosure provides a method for preparing a powder material and an application thereof. The preparation method includes: obtaining an initial alloy ribbon including a matrix phase and a dispersed particle phase by solidifying an alloy melt, and then removing the matrix phase in the initial alloy ribbon while retaining the dispersed particle phase, so as to obtain a powder material composed of original dispersed particle phase. The preparation method of the present disclosure is simple in process and can prepare multiple powder materials of nano-level, sub-micron-level and micro-level. The powder materials have good application prospects in the fields such as catalytic materials, powder metallurgy, composite materials, wave-absorbing materials, sterilization materials, metal injection molding, 3D printing and coating.

The present disclosure provides a method for preparing a powder material and an application thereof. The preparation method includes: obtaining an initial alloy ribbon including a matrix phase and a dispersed particle phase by solidifying an alloy melt, and then removing the matrix phase in the initial alloy ribbon while retaining the dispersed particle phase, so as to obtain a powder material composed of original dispersed particle phase. The preparation method of the present disclosure is simple in process and can prepare multiple powder materials of nano-level, sub-micron-level and micro-level. The powder materials have good application prospects in the fields such as catalytic materials, powder metallurgy, composite materials, wave-absorbing materials, sterilization materials, metal injection molding, 3D printing and coating.

An exemplary shock absorber includes a damper tube, a damper piston, a piston shaft, and at least two different surface treatments. The damper tube includes an interior surface. The damper piston includes a piston surface that engages the interior surface. The piston shaft couples with the damper piston and includes a shaft surface that engages a fourth surface. The at least two different surface treatments are disposed on at least one of the interior surface and the shaft surface and create a corresponding plurality of coefficients of friction with at least one of the piston surface and the fourth surface respectively.

Embodiments relate to nanoporous copper interconnects on a first body for electrically connecting to a second body. To fabricate the nanoporous copper interconnect, a zinc-copper alloy is deposited on recesses on the surface of the first body, and then the zinc is removed from the zinc-copper alloy to obtain nanoporous copper. The first body and the second body can be attached using bonding between oxide surfaces of the two bodies or be provided with underfill between the two bodies. The nanoporous copper electrically connects to an active layer or electrical components of the first body and the second bodies. Using nanoporous copper as interconnects is advantageous, among other reasons, because it can be formed at a low temperature, it is compatible with a standard complementary metal-oxide-semiconductor (CMOS) process, it provides good electrical conductivity, and it is less likely to cause issues due to migration of material.

The invention concerns a method for the surface treatment of a component, for example a turbomachine component, the component comprising a surface to be treated, the method comprising the following steps: loading a first dispenser with a chemical etching solution and a second dispenser with a rinsing solution, positioning the first dispenser and the second dispenser opposite the surface to be treated, moving the first dispenser and the second dispenser along the surface to be treated, such that the surface to be treated successively receives the chemical etching solution followed by the rinsing solution.

Porous solid materials are provided. The porous solid materials include a plurality of interconnected wires forming an ordered network. The porous solid materials may have a predetermined volumetric surface area ranging between 2 m.sup.2/cm.sup.3 and 90 m.sup.2/cm.sup.3, a predetermined porosity ranging between 3% and 90% and an electrical conductivity higher than 100 S/cm. The porous solid materials may have a predetermined volumetric surface area ranging between 3 m.sup.2/cm.sup.3 and 72 m.sup.2/cm.sup.3, a predetermined porosity ranging between 80% and 95% and an electrical conductivity higher than 100 S/cm. The porous solid materials (100) may have a predetermined volumetric surface area ranging between 3 m.sup.2/cm.sup.3 and 85 m.sup.2/cm.sup.3, a predetermined porosity ranging between 65% and 90% and an electrical conductivity higher than 2000 S/cm. Methods for the fabrication of such porous solid materials and devices including such porous solid material are also disclosed.

The dry etching method of the present invention etches a metal film formed on a surface of a workpiece by bringing etching gases each containing a β-diketone into contact with the metal film. The method includes: a first etching step of bringing a first etching gas containing a first β-diketone into contact with the metal film; and a second etching step of bringing a second etching gas containing a second β-diketone into contact with the metal film after the first etching step. The first β-diketone is a compound capable of forming a first complex through a reaction with the metal film. The second β-diketone is a compound capable of forming a second complex having a lower sublimation point than the first complex through a reaction with the metal film.

The dry etching method of the present invention etches a metal film formed on a surface of a workpiece by bringing etching gases each containing a β-diketone into contact with the metal film. The method includes: a first etching step of bringing a first etching gas containing a first β-diketone into contact with the metal film; and a second etching step of bringing a second etching gas containing a second β-diketone into contact with the metal film after the first etching step. The first β-diketone is a compound capable of forming a first complex through a reaction with the metal film. The second β-diketone is a compound capable of forming a second complex having a lower sublimation point than the first complex through a reaction with the metal film.

Disclosed are aluminum alloy products and methods of making and processing such products. Thus, disclosed are aluminum alloy products exhibiting controllable surface properties, including excellent bond durability, low contact resistance, and corrosion resistance. Aluminum alloy products described herein include a migrant element, a subsurface portion having a concentration of the migrant element, and a bulk portion having a concentration of the migrant element. The aluminum alloy product comprises an enrichment ratio of 4.0 or less, wherein the enrichment ratio is a ratio of the migrant element concentration in the subsurface portion to the concentration in the bulk portion. Additionally, the aluminum alloy products surface and/or subsurface can contain phosphorus (e.g., elemental phosphorus or oxidized phosphorus). The phosphorus containing surface provides reduced electronic stress on an electrode tip of a resistance spot welding apparatus, and an extended service lifetime (e.g., weld cycles to failure) of the electrode tip.

Disclosed are aluminum alloy products and methods of making and processing such products. Thus, disclosed are aluminum alloy products exhibiting controllable surface properties, including excellent bond durability, low contact resistance, and corrosion resistance. Aluminum alloy products described herein include a migrant element, a subsurface portion having a concentration of the migrant element, and a bulk portion having a concentration of the migrant element. The aluminum alloy product comprises an enrichment ratio of 4.0 or less, wherein the enrichment ratio is a ratio of the migrant element concentration in the subsurface portion to the concentration in the bulk portion. Additionally, the aluminum alloy products surface and/or subsurface can contain phosphorus (e.g., elemental phosphorus or oxidized phosphorus). The phosphorus containing surface provides reduced electronic stress on an electrode tip of a resistance spot welding apparatus, and an extended service lifetime (e.g., weld cycles to failure) of the electrode tip.