Atomic layer etching (ALE) processes are disclosed. In some embodiments, the methods comprise at least one etch cycle in which the substrate is alternately and sequentially exposed to a first vapor phase non-metal halide reactant and a second vapor phase halide reactant. In some embodiments both the first and second reactants are chloride reactants. In some embodiments the first reactant is fluorinating gas and the second reactant is a chlorinating gas. In some embodiments a thermal ALE cycle is used in which the substrate is not contacted with a plasma reactant.

It is an objective of the present invention to suppress or prevent damages to a metal layer when a surface of a substrate having an easily oxidizable metal layer formed therein is dry-processed and subsequently wet-cleaned. In a dry-processing part 10, a reducing gaseous fluid containing a reducing component is brought into contact with an easily oxidizable metal layer 93 on a surface of a workpiece substrate 90 and the reducing gaseous fluid is activated generally concurrently with the contacting. Subsequently, the workpiece substrate 90 is moved on to a wet-cleaning part 20 and cleaned with cleaning liquid 29.

A method of removing a ceramic coating from a ceramic coated metallic article without damaging the metallic bond coating, the metallic article having a first and second portions, each of the portions comprising a metallic bond coating and a ceramic coating on the metallic bond coating, the ceramic coating on the second portion being less porous than the ceramic coating on the first portion. The method comprises the steps of a) immersing the ceramic coated metallic article in a caustic solution; b) maintaining the ceramic coated metallic article in the caustic solution at atmospheric pressure for a predetermined time period and at a predetermined temperature; c) removing the ceramic coated metallic article from the caustic solution; d) rinsing the ceramic coated metallic article in water at ambient temperature; e) water jet blasting the first portion of the metallic article to remove the ceramic coating; and f) water jet blasting the second portion of the metallic article to remove the ceramic coating.

An etchant is described that includes an N-heterocyclic carbene and optionally an appropriate solvent. The etchant was effective at etching a metallic surface having, for example, a metal oxide and/or metal, in both solution phase and vapour-phase. The etchant has been shown to effectively etch oxidized copper and tungsten.

The invention relates to a method for removing a metal deposit (2) arranged on a surface (5) in a chamber (1), said method including repeatedly performing a sequence including: a) a first phase of injecting chemical species suitable for oxidizing said metal deposit (2); and b) a second phase of injecting chemical species suitable for volatilizing the oxidized metal deposit, said second phase b) being performed after the first phase a).

The invention relates to a method for removing a metal deposit (2) arranged on a surface (5) in a chamber (1), said method including repeatedly performing a sequence including: a) a first phase of injecting chemical species suitable for oxidizing said metal deposit (2); and b) a second phase of injecting chemical species suitable for volatilizing the oxidized metal deposit, said second phase b) being performed after the first phase a).

A method for treating a metal substrate surface before coating or printing thereof, the method including preheating to 40 C. or above a specific metal substrate having a thermal conductivity of 10 W/mK or higher, and thereafter performing a flame treatment on the substrate surface, prior to coating or printing of the surface of the substrate with a coating material or an ink.

A method for treating a metal substrate surface before coating or printing thereof, the method including preheating to 40 C. or above a specific metal substrate having a thermal conductivity of 10 W/mK or higher, and thereafter performing a flame treatment on the substrate surface, prior to coating or printing of the surface of the substrate with a coating material or an ink.

The present invention relates to an active substance for sewage treatment and dewatering of solid domestic wastes landfills. Besides, the present invention also relates to a method for producing this active substance. More specifically, the present invention relates to use of this active substance for sewage treatment and dewatering of solid domestic wastes landfills to remove organic impurities, organogenic elements, solid and radioactive metals.

A method for cleaning a metal surface of a metal component of an industrial plant is disclosed comprising measuring the electrical resistance R.sub.A1 of a metal component over a cleaned area of the metal surface with a resistance meter, comparing the electrical resistance R.sub.A1 measured with a pre-determined electrical resistance value R.sub.DET, assessing whether R.sub.A1 is greater, smaller or equal to R.sub.DET, and repeating cleaning if the electrical resistance R.sub.A1 measured is greater than R.sub.DET, or terminating cleaning of the surface area of the metal component if R.sub.A1 is smaller than or identical to R.sub.DET.