In a method is provided for removing a material from a substrate, a plasma is generated at atmospheric pressure. The plasma includes an energetic species reactive with one or more components of the material. The plasma is flowed from an outlet as a plasma plume that includes periodic regions of high plasma density and low plasma density. The material is exposed to the plasma plume. At least one component of the material reacts with the energetic species, and at least one other component of the material is physically impacted and moved by one or more of the regions of high plasma density.

In a method is provided for removing a material from a substrate, a plasma is generated at atmospheric pressure. The plasma includes an energetic species reactive with one or more components of the material. The plasma is flowed from an outlet as a plasma plume that includes periodic regions of high plasma density and low plasma density. The material is exposed to the plasma plume. At least one component of the material reacts with the energetic species, and at least one other component of the material is physically impacted and moved by one or more of the regions of high plasma density.

Process for pre-treatment of a surface of a chromium containing corrosion resistant metallic substrate prior to further processing, wherein the metallic substrate is brought into contact with an in-situ generated activating agent, being the thermal decomposition product of a hydrofluoroolefin, the substrate and the activating agent are heated, and optionally the activating agent is partly or entirely removed before further processing.

A solution is provided comprising a strong base, a corrosion inhibitor, wherein the strong base is an alkali metal hydroxide, wherein the corrosion inhibitor is at least one of an organic acid having a-COOH functional group or an alkali metal salt one of an organic acid having a-COOH functional groups.

Provided are a substrate treatment method and a substrate treatment equipment enabling greater suppression of corrosion or oxidation of metal wiring exposed on a substrate surface. The present invention relates to a substrate treatment equipment having a treatment chamber wherein a substrate is disposed, and whereto a substrate treatment solution for treating the substrate is supplied. This equipment is provided with an inert gas filling mechanism for filling with an inert gas the interior of the treatment chamber wherein the substrate is disposed, and, near or inside the treatment chamber, a catalytic unit filled with a platinum-group metal catalyst wherethrough a hydrogen-dissolved water including hydrogen added to ultra-pure water is passed. Obtained by passing the hydrogen-dissolved water through the platinum-group metal catalyst, a hydrogen-dissolved treatment solution is supplied as the substrate treatment solution into the treatment chamber by the equipment.

Provided are a substrate treatment method and a substrate treatment equipment enabling greater suppression of corrosion or oxidation of metal wiring exposed on a substrate surface. The present invention relates to a substrate treatment equipment having a treatment chamber wherein a substrate is disposed, and whereto a substrate treatment solution for treating the substrate is supplied. This equipment is provided with an inert gas filling mechanism for filling with an inert gas the interior of the treatment chamber wherein the substrate is disposed, and, near or inside the treatment chamber, a catalytic unit filled with a platinum-group metal catalyst wherethrough a hydrogen-dissolved water including hydrogen added to ultra-pure water is passed. Obtained by passing the hydrogen-dissolved water through the platinum-group metal catalyst, a hydrogen-dissolved treatment solution is supplied as the substrate treatment solution into the treatment chamber by the equipment.

This invention provides a relatively thick roll-bonded laminate that exhibits a high Erichsen value and excellent molding workability. Such roll-bonded laminate is composed of a stainless steel layer and a non-stainless steel metal layer, and it is characterized in that thickness T is 0.2 mm to 3 mm and a correlation between a proportion P.sub.SUS of thickness T.sub.SUS of the stainless steel layer relative to thickness T and a half width FWHM.sub.200 of a peak exhibiting a crystal plane orientation (200) determined by X-ray diffraction analysis of the stainless steel layer side satisfies the correlation represented by the formula: FWHM.sub.200≤0.0057P.sub.SUS+0.4.

A method for removing oxide materials from a crack of a metallic workpiece comprises: infiltrating an alkali solution into the crack in a pressurized atmosphere or an ultrasonic environment; applying an energy to the crack to react the oxide materials with the alkali solution and form a resultant material; and rinsing the resultant material with an acid solution to remove the resultant material from the crack. The method is easier to penetrate into the inside of the cracks, in particular suitable for cleaning narrow and deep cracks.

A method for removing oxide materials from a crack of a metallic workpiece comprises: infiltrating an alkali solution into the crack in a pressurized atmosphere or an ultrasonic environment; applying an energy to the crack to react the oxide materials with the alkali solution and form a resultant material; and rinsing the resultant material with an acid solution to remove the resultant material from the crack. The method is easier to penetrate into the inside of the cracks, in particular suitable for cleaning narrow and deep cracks.

This invention provides a roll-bonded laminate for an electronic device that exhibits high rigidity and a high elastic modulus and is suitable for housing applications. More specifically, this invention concerns a roll-bonded laminate for an electronic device composed of a stainless steel layer and an aluminum alloy layer, wherein thickness T.sub.Al (mm) and surface hardness H.sub.Al (HV) of the aluminum alloy layer and thickness T.sub.SUS (mm) and surface hardness H.sub.SUS (HV) of the stainless steel layer satisfy the correlation represented by Formula (1): H.sub.SUST.sub.SUS.sup.2≥(34.96+0.03×(H.sub.AlT.sub.Al.sup.2).sup.2−3.57×H.sub.AlT.sub.Al.sup.2)/(−0.008×(H.sub.AlT.sub.Al.sup.2).sup.2+0.061×H.sub.AlT.sub.Al.sup.2+1.354). This invention also concerns an electronic device housing.