Provided is a film formation device and a film formation method for a metallic coating that allow forming a metallic coating with a uniform film thickness. The film formation device of the present disclosure includes an anode, a solid electrolyte membrane, a power supply device, a solution container, and a pressure device. The solid electrolyte membrane is disposed between the anode and a substrate that serves as a cathode. The power supply device applies a voltage between the anode and the cathode. The solution container contains a solution between the anode and the solid electrolyte membrane. The solution contains metal ions. The pressure device pressurizes the solid electrolyte membrane to the cathode side with a fluid pressure of the solution. The film formation device further includes a shielding member disposed to surround an outer peripheral surface of the anode. The shielding member shields a line of electric force.

At least one embodiment relates to a method for transforming at least part of a valve metal layer into a template that includes a plurality of spaced channels aligned longitudinally along a first direction. The method includes a first anodization step that includes anodizing the valve metal layer in a thickness direction to form a porous layer that includes a plurality of channels. Each channel has channel walls and a channel bottom. The channel bottom is coated with a first insulating metal oxide barrier layer as a result of the first anodization step. The method also includes a protective treatment. Further, the method includes a second anodization step after the protective treatment. The second anodization step substantially removes the first insulating metal oxide barrier layer, induces anodization, and creates a second insulating metal oxide barrier layer. In addition, the method includes an etching step.

The disclosure provides devices and methods for controlled assembly of colloidal particles. A medium with colloidal particles having a charged surface is placed in physical contact with an electrically conductive material (e.g., an ITO coating). An external light source directs light towards the electrically conductive material, thus driving the colloidal particles from a first non-assembled state to a second assembled state, which may thus create organized colloidal crystals or alternatively predetermined void regions. Assembly of the colloids can be achieved with no external electric fields or external magnetic fields. Moreover, the colloidal assembly is three-dimensional, occurs rapidly, and is entirely reversible and reconfigurable based on controlling the light applied to the electrically conductive material.

An apparatus and method for a mandrel used during an electroforming process. The mandrel is formed of a structural wax and includes a metallic layer utilized to formulate a metal component. During the electroforming process, the mandrel is actively cooled utilizing a closed loop. The closed loop includes the mandrel and a heat exchanger through which a coolant flows.

An apparatus and method for a mandrel used during an electroforming process. The mandrel is formed of a structural wax and includes a metallic layer utilized to formulate a metal component. During the electroforming process, the mandrel is actively cooled utilizing a closed loop. The closed loop includes the mandrel and a heat exchanger through which a coolant flows.

In manufacturing of a first electroformed component and a second electroformed component having portions fitted to each other into close contact, after the first electroformed component is formed, the first electroformed component is used as a portion of an electroforming mold to form the second electroformed component. Using the first electroformed component as a portion of the electroforming mold to form the second electroformed component, the shape of the first electroformed component is transferred to the second electroformed component. As a result, multiple types of components differing in shape may be accurately manufactured concurrently in a series of manufacturing steps.

In certain embodiments, a method comprises placing nonconductive fibers adjacent to a conductive material, immersing the nonconductive fibers and the conductive material in a plating medium, and applying a voltage to the conductive material to initiate electroplating. The method further comprises engulfing, by electroplating, the nonconductive fibers in metal to create a metal matrix composite.

In certain embodiments, a method comprises placing nonconductive fibers adjacent to a conductive material, immersing the nonconductive fibers and the conductive material in a plating medium, and applying a voltage to the conductive material to initiate electroplating. The method further comprises engulfing, by electroplating, the nonconductive fibers in metal to create a metal matrix composite.

According to an embodiment of the present invention, a method for producing a duplicate of a nano-pattern texture of a surface of an object through electroforming using an imprint mold comprises selecting the object having the nano-pattern texture, disposing the selected object and pretreating a surface of the object by washing, drying and then forming a nano-thin film thereto to block transfer of impurities, metallizing a surface of the plastic mold through, e.g., vapor deposition, spraying, and wet silver mirror reaction, and performing a first electroforming of the surface of the plastic mold, and repeating to thus manufacture a plurality of metal module master molds.

An electrochemical deposition system includes a cathode and a printhead. The printhead is spaced apart from the cathode, movable relative to the cathode, and comprises a plurality of deposition anodes. The system further comprises a capacitive sensor that includes a first electrically-conductive layer, at a known location relative to the cathode, and a second electrically-conductive layer, at a known location relative to the printhead. The system additionally includes a processor, electrically coupled with the capacitive sensor and configured to determine a distance between the cathode and the printhead in response to a capacitance of the capacitive sensor.