There is provided a surface-treated steel sheet (1) comprising: a tin-plated steel sheet (10) obtained by tin-plating a steel sheet (11); a phosphate compound layer (20) containing tin phosphate formed on the tin-plated steel sheet (10); and an aluminum-oxygen compound layer (30) on the phosphate compound layer (20), a main constituent of the aluminum-oxygen compound layer (30) being an aluminum-oxygen compound; wherein, when the 3d.sub.5/2 spectrum of tin in the aluminum-oxygen compound layer (30) is determined using an X-ray photoelectron spectroscopy, the ratio of the integration value of the profile derived from tin oxide to the integration value of the profile derived from tin phosphate (tin oxide/tin phosphate) is 6.9 or more.

A method of fabricating and using a zinc negative electrode and systems thereof are described. A zinc electroplated electrode including a layer of zinc metal bonded to a surface of an electrically conductive current collector is fabricated by an electroplating process using a zinc electroplating system. The zinc electroplating system includes: a zinc metal anode, a cathode including the current collector for plating zinc thereon, and an electrolyte bath comprising zinc ions. The electroplating process bonds the zinc metal to the surface of the current collector to create the electroplated zinc electrode. The electroplated zinc electrode is used as a negative electrode in a zinc metal cell. The zinc metal cell may be a primary cell or a secondary cell.

A method of fabricating and using a zinc negative electrode and systems thereof are described. A zinc electroplated electrode including a layer of zinc metal bonded to a surface of an electrically conductive current collector is fabricated by an electroplating process using a zinc electroplating system. The zinc electroplating system includes: a zinc metal anode, a cathode including the current collector for plating zinc thereon, and an electrolyte bath comprising zinc ions. The electroplating process bonds the zinc metal to the surface of the current collector to create the electroplated zinc electrode. The electroplated zinc electrode is used as a negative electrode in a zinc metal cell. The zinc metal cell may be a primary cell or a secondary cell.

A heat equalization plate includes a first copper clad laminate including a first copper foil, a second copper clad laminate including a second copper foil, a connecting bump, a plurality of thermally conductive bumps, and a working fluid. The second copper foil faces the first copper foil. The connecting bump is formed on a surface of the first copper foil facing the second copper foil. The thermally conductive bumps are formed on a surface of the first copper foil facing the second copper foil. The connecting bump is an annulus and surrounds the thermally conductive bumps. The connecting bump is connected to the second copper foil to form a sealed chamber. The thermally conductive bumps are received in the sealed chamber. The working fluid is received in the sealed chamber.

A manufacturing method of a symbol button for a vehicle includes: preparing a button body comprising a side portion, a top portion formed of a polymer material on which a metal is able to be plated; forming an electrically conductive layer on an outside of the button body using a conductive polymer material; forming a plating shielding layer in a form of a symbol using a material on which a metal is not able to be plated on the electrically conductive layer; and performing metal plating on the outside of the button body having the plating shielding layer.

A manufacturing method of a symbol button for a vehicle includes: preparing a button body comprising a side portion, a top portion formed of a polymer material on which a metal is able to be plated; forming an electrically conductive layer on an outside of the button body using a conductive polymer material; forming a plating shielding layer in a form of a symbol using a material on which a metal is not able to be plated on the electrically conductive layer; and performing metal plating on the outside of the button body having the plating shielding layer.

A sliding member including an overlay capable of realizing good fatigue resistance while preventing interlayer peeling. The sliding member including an overlay formed of an alloy plating film of Bi and Sb, wherein Bi—Sb oxide is formed on a surface of the overlay.

A method for manufacturing appliques on a dial for a timepiece.

The purpose of the present invention is to provide a filling plating system and a filling plating method capable of filling plating sufficiently even if the plating is interrupted between electrolytic plating cells. A filling plating system for forming filling plating in a via hole and/or a through hole of a work to be plated, comprising: a plurality of electrolytic plating cells; and an additive adhesion region arranged between each of the plurality of electrolytic plating cells, wherein solution containing one or more kinds of additive selected from at least a leveler comprising nitrogen-containing organic compound, a brightener comprising sulfur-containing organic compound, and a carrier comprising polyether compound, is directly adhered to the work to be plated at the additive adhesion region.

The purpose of the present invention is to provide a filling plating system and a filling plating method capable of filling plating sufficiently even if the plating is interrupted between electrolytic plating cells. A filling plating system for forming filling plating in a via hole and/or a through hole of a work to be plated, comprising: a plurality of electrolytic plating cells; and an additive adhesion region arranged between each of the plurality of electrolytic plating cells, wherein solution containing one or more kinds of additive selected from at least a leveler comprising nitrogen-containing organic compound, a brightener comprising sulfur-containing organic compound, and a carrier comprising polyether compound, is directly adhered to the work to be plated at the additive adhesion region.