Electrochemical analysis method and system for monitoring and controlling the quality of electrochemical deposition and/or plating processes. The method uses a fingerprinting analysis method of an output signal to indicate whether the chemistry and/or process is operating in the normally expected range and utilizes one or more substrates as working electrode(s) and a) whereby the potential between the one or more working electrodes and one or more reference electrodes is analyzed to provide an output signal fingerprint which is represented as potential difference as a function of time or b) the input power of a process power supply to provide input energy in the form of current and/or potential between the working electrode(s) and a counter-electrode whereby the method utilizes the potential between the one or more working electrode(s) and at least one of: one or more reference electrodes; or one or more counter-electrodes; to provide an output signal fingerprint.

Electrochemical analysis method and system for monitoring and controlling the quality of electrochemical deposition and/or plating processes. The method uses a fingerprinting analysis method of an output signal to indicate whether the chemistry and/or process is operating in the normally expected range and utilizes one or more substrates as working electrode(s) and a) whereby the potential between the one or more working electrodes and one or more reference electrodes is analyzed to provide an output signal fingerprint which is represented as potential difference as a function of time or b) the input power of a process power supply to provide input energy in the form of current and/or potential between the working electrode(s) and a counter-electrode whereby the method utilizes the potential between the one or more working electrode(s) and at least one of: one or more reference electrodes; or one or more counter-electrodes; to provide an output signal fingerprint.

A coating system includes an electrocoat (e-coat) bath having an e-coat fluid with a first amount of dissolved gases, a plurality of ultrasonic transducers mounted on at least two sides of the e-coat bath, a carrier frame and control circuitry. The control circuitry is configured to control a trajectory of a metal part dipped in the e-coat bath using the carrier frame, control the plurality of ultrasonic transducers to direct a plurality of acoustic waves at a defined ultrasonic operating frequency and at a first intensity to cause a plurality of localized pressure drops in the e-coat fluid, the first amount of dissolved gases is reduced or removed as bubbles from the e-coat fluid of the e-coat bath based on the directed plurality of acoustic waves, and increase the first intensity of the directed plurality of acoustic waves over a defined time period to accelerate dispersion of an e-coat pigment.

A coating system includes an electrocoat (e-coat) bath having an e-coat fluid with a first amount of dissolved gases, a plurality of ultrasonic transducers mounted on at least two sides of the e-coat bath, a carrier frame and control circuitry. The control circuitry is configured to control a trajectory of a metal part dipped in the e-coat bath using the carrier frame, control the plurality of ultrasonic transducers to direct a plurality of acoustic waves at a defined ultrasonic operating frequency and at a first intensity to cause a plurality of localized pressure drops in the e-coat fluid, the first amount of dissolved gases is reduced or removed as bubbles from the e-coat fluid of the e-coat bath based on the directed plurality of acoustic waves, and increase the first intensity of the directed plurality of acoustic waves over a defined time period to accelerate dispersion of an e-coat pigment.

In some examples, a system comprises a die having multiple electrical connectors extending from a surface of the die and a lead coupled to the multiple electrical connectors. The lead comprises a first conductive member; a first non-solder metal plating stacked on the first conductive member; an electroplated layer stacked on the first non-solder metal plating; a second non-solder metal plating stacked on the electroplated layer; and a second conductive member stacked on the second non-solder metal plating, the second conductive member being thinner than the first conductive member. The system also comprises a molding to at least partially encapsulate the die and the lead.

In some examples, a system comprises a die having multiple electrical connectors extending from a surface of the die and a lead coupled to the multiple electrical connectors. The lead comprises a first conductive member; a first non-solder metal plating stacked on the first conductive member; an electroplated layer stacked on the first non-solder metal plating; a second non-solder metal plating stacked on the electroplated layer; and a second conductive member stacked on the second non-solder metal plating, the second conductive member being thinner than the first conductive member. The system also comprises a molding to at least partially encapsulate the die and the lead.

An exemplary embodiment relates to improving a driving speed of a shape-memory-alloy applied as an artificial muscle, and to improving heat conduction and thermal convection by growing copper nanowires on the surface of the shape-memory-alloy to improve a natural cooling rate and a driving speed of the shape-memory-alloy.

A uniform copper-tin compound layer is electrochemically deposited on a surface of a copper-based base structure. A tin-based film is then formed on the copper-tin compound layer. The uniform copper-tin compound layer provides a barrier that effectively inhibits tin whisker growth.

The present invention provides a method of tin-plating a copper alloy for electric or electronic parts and automobile parts which has excellent insertion force, heat-resistant peeling, and solderability, and a tin-plating material of a copper alloy manufactured therefrom.

The present invention provides a method of tin-plating a copper alloy for electric or electronic parts and automobile parts which has excellent insertion force, heat-resistant peeling, and solderability, and a tin-plating material of a copper alloy manufactured therefrom.