Patent classifications
C25F7/00
PLATING-DEPLATING WAVEFORM BASED CONTACT CLEANING FOR A SUBSTRATE ELECTROPLATING SYSTEM
An electrochemical deposition system configured for electrochemical plating of a substrate includes a chamber, an electrode, a plating cup and a controller. The chamber holds a plating bath. The electrode is disposed in the plating bath. The plating cup includes a contact ring. The contact ring includes contacts. The contacts are immersed in the plating bath. The controller is configured to apply a voltage signal across the contact ring and the electrode to remove residual from the contacts. The voltage signal includes a plating-de-plating waveform. The plating-de-plating waveform includes multiple cycles. Each of the cycles includes a pair of pulses with different polarity.
METHOD FOR CREATING A CHROMIUM-PLATED SURFACE WITH A MATTE FINISH
A method for creating a chrome-plated surface having a matte finish that typically includes: controlling a resistance of a current bridge circuit; depositing a first chromium layer on a substrate positioned in a chromium bath, wherein the first chromium layer is deposited by supplying current from a power source that is electrically connected to the substrate and to anodes positioned in the chromium bath; etching the first chromium layer by engaging a current bridge that closes the current bridge circuit; depositing a first intermediate chromium layer, wherein the first intermediate chromium layer is deposited by supplying current from the power source; etching the first intermediate chromium layer, wherein the first intermediate chromium layer is etched by engaging the current bridge; and depositing a final chromium layer, wherein the final chromium layer is deposited by supplying current from the power source.
METHOD FOR CREATING A CHROMIUM-PLATED SURFACE WITH A MATTE FINISH
A method for creating a chrome-plated surface having a matte finish that typically includes: controlling a resistance of a current bridge circuit; depositing a first chromium layer on a substrate positioned in a chromium bath, wherein the first chromium layer is deposited by supplying current from a power source that is electrically connected to the substrate and to anodes positioned in the chromium bath; etching the first chromium layer by engaging a current bridge that closes the current bridge circuit; depositing a first intermediate chromium layer, wherein the first intermediate chromium layer is deposited by supplying current from the power source; etching the first intermediate chromium layer, wherein the first intermediate chromium layer is etched by engaging the current bridge; and depositing a final chromium layer, wherein the final chromium layer is deposited by supplying current from the power source.
System and method for machining workpiece and article machined therefrom
A system is configured for machining a workpiece (100), the workpiece includes an interior surface (110) that defines an internal passage (112). The system includes an electrode (116) located within the internal passage and electrically isolated from the workpiece, an electrolyte supply, a power supply, and a remover. The electrolyte supply is configured for circulating an electrolyte in a gap between the electrode and the workpiece. The power supply is configured for applying a voltage between the electrode and the workpiece to facilitate smoothing the interior surface. The remover is configured for completely removing the electrode from within the internal passage after smoothing the interior surface.
System and method for machining workpiece and article machined therefrom
A system is configured for machining a workpiece (100), the workpiece includes an interior surface (110) that defines an internal passage (112). The system includes an electrode (116) located within the internal passage and electrically isolated from the workpiece, an electrolyte supply, a power supply, and a remover. The electrolyte supply is configured for circulating an electrolyte in a gap between the electrode and the workpiece. The power supply is configured for applying a voltage between the electrode and the workpiece to facilitate smoothing the interior surface. The remover is configured for completely removing the electrode from within the internal passage after smoothing the interior surface.
Nanopore forming method and uses thereof
The invention relates to a method for making nanopores in thin layers or monolayers of transition metal dichalcogenides that enables accurate and controllable formation of pore within those thin layer(s) with sub-nanometer precision.
Nanopore forming method and uses thereof
The invention relates to a method for making nanopores in thin layers or monolayers of transition metal dichalcogenides that enables accurate and controllable formation of pore within those thin layer(s) with sub-nanometer precision.
Processing device based on electrochemistry and processing method using same
A processing device based on electrochemistry includes a platform, a power supply and at least one modeling mechanism which is arranged under the platform and movable with respect to the platform. The modeling mechanism includes a photoelectric wheel, a light source and a container in which an ionic liquid is stored. The photoelectric wheel is rotatable and partially immersed in the ionic liquid. The photoelectric wheel includes a transparent conductive layer and a photoconductive layer bound together from inside to outside. The transparent conductive layer is electrically connected to an electrode of the power supply, and the platform is electrically connected to the other electrode of the power supply. The light source is arranged inside the photoelectric wheel and emits a light beam to pass through the transparent conductive layer towards the platform to selectively irradiate the photoconductive layer.
Method for smoothing and polishing metals via ion transport via free solid bodies and solid bodies for performing the method
A method for smoothing and polishing metals via ion transport by free solid bodies. The method includes connecting a part to be treated to a pole of a current generator and subjecting the part to friction with a set of particles that includes electrically charged and electrically conductive free solid bodies in a gaseous environment.
Method for smoothing and polishing metals via ion transport via free solid bodies and solid bodies for performing the method
A method for smoothing and polishing metals via ion transport by free solid bodies. The method includes connecting a part to be treated to a pole of a current generator and subjecting the part to friction with a set of particles that includes electrically charged and electrically conductive free solid bodies in a gaseous environment.